IMAPS : international symposium on microelectronics (Denver CO, 4-6 September 2002)SPIE proceedings series. 2002, isbn 0-930815-66-1, XX, 957 p, isbn 0-930815-66-1Conference Proceedings

Heat sink design optimization for optical transpondersSHI, Z. F; LU, Albert C. W; TAN, Y. M et al.SPIE proceedings series. 2002, pp 330-335, isbn 0-930815-66-1, 6 p.Conference Paper

Design and reliability of a new WL-CSPWETZ, Li; KESER, Beth; WHITE, Jerry et al.SPIE proceedings series. 2002, pp 211-215, isbn 0-930815-66-1, 5 p.Conference Paper

Reliability of small BGAs in the automotive environmentSUHLING, Jeffrey C; JOHNSON, R. Wayne; EVANS, John L et al.SPIE proceedings series. 2002, pp 524-532, isbn 0-930815-66-1, 9 p.Conference Paper

Structures of cantilever with implanted strain gaugeHUSAK, M; KULHA, P; JAKOVENKO, J et al.SPIE proceedings series. 2002, pp 749-754, isbn 0-930815-66-1, 6 p.Conference Paper

Design by analysis of a MEMS pressure sensorPRYPUTNIEWICZ, Ryszard J; FURLONG, Cosme; PRYPUTNIEWICZ, Emily J et al.SPIE proceedings series. 2002, pp 81-86, isbn 0-930815-66-1, 6 p.Conference Paper

Low profile LTCC transformersWAHLERS, R. L; HUANG, C. Y. D; HEINZ, M. R et al.SPIE proceedings series. 2002, pp 76-80, isbn 0-930815-66-1, 5 p.Conference Paper

Beyond periodic pulse reverseGUTIERREZ, Enrique JR.SPIE proceedings series. 2002, pp 708-714, isbn 0-930815-66-1, 7 p.Conference Paper

New lead-free thick film resistorsHORMADALY, J.SPIE proceedings series. 2002, pp 543-547, isbn 0-930815-66-1, 5 p.Conference Paper

Modular systems for sensor integrationKLEIN, Matthias; OPPERMANN, Hermann; ASCHENBRENNER, Rolf et al.SPIE proceedings series. 2002, pp 194-198, isbn 0-930815-66-1, 5 p.Conference Paper

Very high speed 3D system in packageVAL, Christian; VASSAL, Marie-Cécile; LIGNIER, Olivier et al.SPIE proceedings series. 2002, pp 181-187, isbn 0-930815-66-1, 7 p.Conference Paper

Strategies for successfully integrating MEMS die onto laminateDEAN, Robert; JOHNSON, R. Wayne; GARRISON, Holly et al.SPIE proceedings series. 2002, pp 109-114, isbn 0-930815-66-1, 6 p.Conference Paper

Thermal properties of new composites of diamond and copperYOSHIDA, Katsuhito; MORIGAMI, Hideaki; AWAJI, Takahiro et al.SPIE proceedings series. 2002, pp 721-726, isbn 0-930815-66-1, 6 p.Conference Paper

One packaging technique of exposed MEMS sensorsLIN, Tim; YOON, Rick.SPIE proceedings series. 2002, pp 105-108, isbn 0-930815-66-1, 4 p.Conference Paper

Cardo polymer based photo imageable dielectricTAKEUCHI, Masahiko; INABA, Shinji; KAWASATO, Hironobu et al.SPIE proceedings series. 2002, pp 39-44, isbn 0-930815-66-1, 6 p.Conference Paper

Adhesive assembly for optoelectronic transceiversSCHULTZ, John; CONNELL, Glen; HENSON, Gordon et al.SPIE proceedings series. 2002, pp 927-932, isbn 0-930815-66-1, 6 p.Conference Paper

Challenge of flip chip encapsulation technologiesCHAI, Kevin; WU, Eddy; HSIEH, Roger et al.SPIE proceedings series. 2002, pp 733-737, isbn 0-930815-66-1, 5 p.Conference Paper

Patternable compliant silicones for advanced packaging applicationsLARSON, Lyndon J; ALGER, James S; DENT, Stanton J et al.SPIE proceedings series. 2002, pp 795-799, isbn 0-930815-66-1, 5 p.Conference Paper

RF MEMS: Modeling and simulation of switch dynamicsPRYPUTNIEWICZ, Rvszard J; WILKERSON, Patrick W; PREKWAS, Andrzej J et al.SPIE proceedings series. 2002, pp 267-272, isbn 0-930815-66-1, 6 p.Conference Paper

Compliant dielectric and magnetic materials for buried componentsFEINGOLD, A. H; HEINZ, M; WAHLERS, R. L et al.SPIE proceedings series. 2002, pp 65-70, isbn 0-930815-66-1, 6 p.Conference Paper

New low cost surge resistive inksMOROZ, Michail; SHAIKH, Aziz.SPIE proceedings series. 2002, pp 421-426, isbn 0-930815-66-1, 6 p.Conference Paper

Composite dielectric laminate for integrated capacitorsSLENES, Kirk; LUTHER, Erik; TUQIANG CHEN et al.SPIE proceedings series. 2002, pp 583-586, isbn 0-930815-66-1, 4 p.Conference Paper

Integrated capacitors for multichip module packaging applicationsKEENEY, Allen C; FRANCOMACARO, A. Shaun; EDWARDS, Richard L et al.SPIE proceedings series. 2002, pp 610-616, isbn 0-930815-66-1, 7 p.Conference Paper

3D electromagnetic simulation of optoelectronic transceiver structuresSCHULTZ, John C; TRAMEL, Robert; TUROWSKI, Marek et al.SPIE proceedings series. 2002, pp 909-914, isbn 0-930815-66-1, 6 p.Conference Paper

Curing low yields in photonicsGARARD, Richard S.SPIE proceedings series. 2002, pp 933-935, isbn 0-930815-66-1, 3 p.Conference Paper