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UNE NOUVELLE TECHNIQUE D'INTERCONNEXION MULTICOUCHE.KOCSIS A.1975; ELECTRON. MICROELECTRON. INDUSTR.; FR.; DA. 1975; NO 209 SUPPL.; PP. 32-63 (4P.); MEME DOC. ANGLArticle

MULTILAYER INTERCONNECTION TECHNIQUES APPLIED TO HIGH SPEED COMPUTER SYSTEMS.BINGHAM KC; NAYLOR R.1974; I.E.E.E. TRANS. PARTS HYBR. PACKAG.; U.S.A.; DA. 1974; VOL. 10; NO 3; PP. 175-180; BIBL. 3 REF.; (ELECTRON. COMPONENTS CONF.; WASHINGTON; 1974)Conference Paper

THICK-FILM PASTES FOR MULTILAYER USEKURZWEIL K; LOUGHRAN J.1973; SOLID-STATE TECHNOL.; U.S.A.; DA. 1973; VOL. 16; NO 5; PP. 36-42; BIBL. 14 REF.Serial Issue

SHIELDED SILICON GATE COMPLEMENTARY MOS INTEGRATED CIRCUITHUNG CHANG LIN; HALSOR JL; HAYES PJ et al.1972; I.E.E.E. TRANS. ELECTRON DEVICES; U.S.A.; DA. 1972; VOL. 19; NO 11; PP. 1199-1207; BIBL. 6 REF.Serial Issue

PACKAGE DEVELOPMENT FOR A LARGE MULTI-CHIP ARRAY.CLEFORD AP; PAYNE JR.1974; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1974; VOL. 14; NO 9; PP. 47-54 (4P.); BIBL. 6 REF.Article

INTERCONNEXION MULTICOUCHE PLANAR POUR CIRCUITS INTEGRES BIPOLAIRES DE GRANDE SURFACE.RIOULT JP; FABIEN R; GRIOT D et al.1974; DGRST-7371327; FR.; DA. 1974; PP. 1-12; (RAPP. FINAL, ACTION CONCERTEE: C.C.M.)Report

DIE ERSTE 380-KV-SCHALT- UND UMSPANNANLAGE IN OESTERREICH. = LA PREMIERE SOUS-STATION 380 KV EN AUTRICHEWAGNER E.1975; OESTERR. Z. ELEKTR.-WIRTSCH.; OESTERR.; DA. 1975; VOL. 28; NO 4; PP. 254-256; ABS. ANGL. FR.; BIBL. 9 REF.Article

EQUIVALENT CIRCUIT MODELS FOR THREE-DIMENSIONAL MULTICONDUCTOR SYSTEMS.RUEHLI AE.1974; I.E.E.E. TRANS. MICROWAVE THEORY TECH.; U.S.A.; DA. 1974; VOL. 22; NO 3; PP. 216-221; BIBL. 16 REF.Article

PLANAR MULTILEVEL INTERCONNECTION TECHNOLOGY EMPLOYING A POLYIMIDEMUKAI K; SAIKI A; YAMANAKA K et al.1978; I.E.E.E. J. SOLID STATE CIRCUITS; USA; DA. 1978; VOL. 13; NO 4; PP. 462-467; BIBL. 3 REF.Article

DIFFERENT CHIP INTERCONNECTING TECHNIQUESDANIELSSON H.1980; ELECTROCOMPON. SCI. TECHNOL.; ISSN 0305-3091; GBR; DA. 1980; VOL. 7; NO 1-3; PP. 149-154; BIBL. 8 REF.Article

OVERALL COMPARISON BETWEEN THEORETICAL PREDICTIONS USING THE CROSS-FIELD TRANSMISSION-LINE MODEL AND EXPERIMENTAL MEASUREMENTS OF A SPLIT-CONNECTED TRANSDUCER.DEVRIES AJ; SUBRAMANIAN S.1973; IN: ULTRASON. SYMP. PROC.; MONTEREY, CALIF.; 1973; NEW YORK; INST. ELECTR. ELECTRON. ENG.; DA. 1973; PP. 407-409; BIBL. 2 REF.Conference Paper

SUR L'INTERCONNEXION OPTIMALE DES INSOLATEURS DANS LES SYSTEMES DE CHAUFFAGE DE L'AIR AVEC DE GRANDES SURFACES DE CAPTATION = OPTIMAL INTERCONNECTION OF SOLAR COLLECTORS IN AIR HEATING SYSTEMS WITH LARGE COLLECTING AREASBADESCU V; OANCEA C.1980; REV. INTERNATIONAL. HELIOTECH.; FRA; DA. 1980; 1ER SEMESTRE; PP. 36-41; ABS. ENG; BIBL. 4 REF.Article

APPLICATION DES TECHNIQUES D'OXYDATION ANODIQUE A LA REALISATION D'INTERCONNEXIONS MONO ET BICOUCHE DANS LES TECHNOLOGIES MOS.MONTIER M.1976; DGRST-7570666; FR.; DA. 1976; PP. (37P.); H.T. 24; BIBL. 1 P.; (RAPP. FINAL, ACTION CONCERTEE: COMPOSANTS CIRCUITS MICROMINIATURISES)Report

NEW CYCLOCONVERTOR FOR POWER-SYSTEM HIGH-FREQUENCY LINKSFORSTER MK; BOYS JJ.1983; IEE PROCEEDINGS. PART C. GENERATION, TRANSMISSION AND DISTRIBUTION; ISSN 0143-7046; GBR; DA. 1983; VOL. 130; NO 3; PP. 111-121; BIBL. 18 REF.Article

ADVANCED BATTERIES FOR LOAD-LEVELING THE UTILITY PERSPECTIVE ON SYSTEM INTEGRATIONDELMONACO JL; LEWIS PA; ROMAN HT et al.1982; IEEE TRANS. POWER APPAR. SYST.; ISSN 0018-9510; USA; DA. 1982; VOL. 101; NO 9; PP. 3315-3321; BIBL. 11 REF.Article

A NEW METHOD FOR THE EFFICIENT INTERCONNECTION OF HIGH-INDEX PLANAR WAVEGUIDES TO LOW-INDEX TRANSITIONAL WAVEGUIDES.SOPORI BL; CHANG WSC; PHILLIPS CM et al.1976; APPL. PHYS. LETTERS; U.S.A.; DA. 1976; VOL. 29; NO 12; PP. 800-802; BIBL. 7 REF.Article

GENERATION SCHEMES FOR WIND POWER PLANTS. = SCHEMAS D'INTERCONNEXION POUR CENTRALES ELECTRIQUES EOLIENNESJAYA DEVAIAH TS; SMITH RT.1975; I.E.E.E. TRANS. AEROSPACE ELECTRON. SYST.; U.S.A.; DA. 1975; VOL. 11; NO 4; PP. 543-550; BIBL. 14 REF.Article

CARACTERISATION PREVISIONNELLE DE LA QUALITE DES INTERCONNEXIONS DES CIRCUITS INTEGRES AU SILICIUMRIOULT JP; COMMON JC; FABIEN R et al.1972; DGRST-7172975; FR.; DA. 1972; PP. (35 P.); H.T. 10; BIBL. 2 REF.; 2 FASC. (RAPP. FINAL, ACTION CONCERTEE: C.C.M.)Report

WIRING ALGORITHMS FOR THE COMPUTER-AIDED LAYOUT OF MULTILAYER HYBRID MICROCIRCUITS.PRICE IR; MORAN P.1977; I.E.E.E. TRANS. PARTS HYBR. PACKAG.; U.S.A.; DA. 1977; VOL. 13; NO 2; PP. 143-146; BIBL. 5 REF.Article

SURVEY OF COMPUTER-AIDED ELECTRICAL ANALYSIS OF INTEGRATED CIRCUIT INTERCONNECTIONSRUEHLI A.1979; I.B.M. J. RES. DEVELOP.; USA; DA. 1979; VOL. 23; NO 6; PP. 626-639; BIBL. 98 REF.Article

AN OPTIMIZING PATH PRINTED CIRCUIT BOARD ROUTER.KELLY MF.1977; IN: ANNU. ASILOMAR CONF. CIRCUITS, SYST., COMPUT. 10; PACIFIC GROVE, CALIF.; 1976; NORTH HOLLYWOOD, CALIF.; WESTERN PERIODICALS; DA. 1977; PP. 425-430; BIBL. 6 REF.Conference Paper

ECL - TOUJOURS LES CIRCUITS LES PLUS RAPIDES.TALBOT B; JAMES J.1976; ELECTRONIQUE; SUISSE; DA. 1976; VOL. 5; NO 1-2; PP. EL.15-EL.17Article

DEVELOPING A PROGRAMMABLE WIRING TERMINAL.CRONIN MJ.1975; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1975; VOL. 15; NO 2; PP. 71-76 (4P.)Article

IMPLANTATION DES LIAISONS CONDUCTRICES DES PLAQUES IMPRIMEES A PLUSIEURS COUCHES EN UTILISANT DES MICROCIRCUITS DE COMMUTATIONTESLENKO VP; ROMASHKO VI; POLYANSKIJ GA et al.1975; ELEKTRON. I MODELIROVAN, U.S.S.R.; S.S.S.R.; DA. 1975; NO 7; PP. 82-83; BIBL. 2 REF.Article

LE RESEAU A "BILAN ENERGETIQUE NUL" DANS LA FORMATION DES EQUIVALENTS REI.DIMO P.1974; REV. ROUMAINE SCI. TECH., ELECTROTECH. ENERGET.; ROUMAN.; DA. 1974; VOL. 19; NO 2; PP. 221-227; ABS. ANGL. ALLEM.; BIBL. 5 REF.Article

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