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STATISTICAL MODEL FOR ELECTROMIGRATION FAILURE AT ALUMINIUM CONTACTS AND TERMINALSPROKOP GS; LIANG G.1972; J. ELECTRON. MATER.; U.S.A.; DA. 1972; VOL. 1; NO 4; PP. 474-498; BIBL. 1 P.Serial Issue

OHMIC CONTACTS ON N⁺-AND P⁺-SI BY ION IMPLANTATIONFEUERSTEIN A; KALBITZER S.1973; APPL. PHYS. LETTERS; U.S.A.; DA. 1973; VOL. 22; NO 1; PP. 19-20; BIBL. 1 REF.Serial Issue

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