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kw.\*:("Imida polímero")

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A photosensitive polymide using an alkaline aqueous solution as a developerNISHIZAWA, H; SATO, K; KOJIMA, M et al.Polymer engineering and science. 1992, Vol 32, Num 21, pp 1610-1612, issn 0032-3888Conference Paper

Novel auto-photosensitive polyimides with tailored propertiesROHDE, O; SMOLKA, P; FALCIGNO, P. A et al.Polymer engineering and science. 1992, Vol 32, Num 21, pp 1623-1629, issn 0032-3888Conference Paper

A new positive-type photoreactive polyimide precursor using 1,4-dihydropyridine derivativeOMOTE, T; YAMAOKA, T.Polymer engineering and science. 1992, Vol 32, Num 21, pp 1634-1641, issn 0032-3888Conference Paper

Adhesive bonding study of amorphous LARC-TPIPROGAR, D. J; ST. CLAIR, T. L.Journal of adhesion science and technology. 1994, Vol 8, Num 1, pp 67-83, issn 0169-4243Article

Process characterization of an aqueous developable photosensitive polyimide on a broadband stepperFLACK, Warren W; KULAS, Scott; FRANKLIN, Craig et al.SPIE proceedings series. 2000, pp 452-463, isbn 0-8194-3617-8Conference Paper

Progress in polyimide chemistry IKRICHELDORF, Hans R.Advances in polymer science. 1999, Vol 140, issn 0065-3195, 185 p.Serial Issue

Stable second-order nonlinear optical polymer network based on an organosoluble polyimideHSIUE, G. H; KUO, J. K; JENG, R. J et al.Chemistry of materials. 1994, Vol 6, Num 7, pp 884-887, issn 0897-4756Article

Polyimide ablation using intense laser beamsSOBEHART, J. R.Journal of applied physics. 1993, Vol 74, Num 4, pp 2830-2833, issn 0021-8979Article

Intrinsically photosensitive polyimides : approaches to fluorinated homologsMOORE, J. A; GAMBLE, D. R.Polymer engineering and science. 1992, Vol 32, Num 21, pp 1642-1645, issn 0032-3888Conference Paper

Carbonization and graphitization of polymide film NovaxINAGAKI, M; LI-JUN MENG; IBUKI, T et al.Carbon (New York, NY). 1991, Vol 29, Num 8, pp 1239-1243, issn 0008-6223Article

Curing of polyimidesFEGER, C.Polymer engineering and science. 1989, Vol 29, Num 5, pp 347-351, issn 0032-3888Article

Progress in polyimide chemistry. IIKRICHELDORF, H. R.Advances in polymer science. 1999, Vol 141, issn 0065-3195, 251 p.Serial Issue

Effect of cold-drawing on the carbonization of polyimide filmsTAKEICHI, T; TAKENOSHITA, H; OGURA, S et al.Chemistry Letters. 1993, Num 4, pp 657-658, issn 0366-7022Article

Comparison of finite element stress analysis results with peel strength at the copper-polyimide interfaceLACOMBE, R. H; BUCHWALTER, L. P; HOLLOWAY, K et al.Journal of adhesion science and technology. 1993, Vol 7, Num 12, pp 1293-1307, issn 0169-4243Article

The use of peel tests to examine the self adhesion of polyimide filmsBROWN, H. R; YANG, A. C. M.Journal of adhesion science and technology. 1992, Vol 6, Num 3, pp 333-346, issn 0169-4243Article

Structuring of polyimide by ArF excimer laser ablationSPIESS, W; STRACK, H.Semiconductor science and technology. 1989, Vol 4, Num 6, pp 486-490, issn 0268-1242, 5 p.Article

Effect of isothermal aging on the imidization of PMR-15JORDAN, K; IROH, J. O.Polymer engineering and science. 1996, Vol 36, Num 20, pp 2550-2555, issn 0032-3888Article

A new generation of polyimide filmsMaterials engineering. 1992, Vol 109, Num 6, pp 17-18, issn 0025-5319Article

Pthalimide on copper: a model system to address certain site-specific interactions at the polyimide-copper interfaceSALANECK, W. R; STAFSTROM, S; BREDAS, J.-L et al.Journal of vacuum science and technology. A. Vacuum, surfaces, and films. 1988, Vol 6, Num 6, pp 3134-3139, issn 0734-2101Article

Surface modification of polyimide gate insulators for solution-processed 2,7-didecyl[1 ]benzothieno-[3,2-b][1]benzothiophene (C10-BTBT) thin-film transistorsJANG, Kwang-Suk; WON SOO KIM; WON, Jong-Myung et al.PCCP. Physical chemistry chemical physics (Print). 2013, Vol 15, Num 3, pp 950-956, issn 1463-9076, 7 p.Article

Formation of intrinsic surface defects during 248 nm photoablation of polyimideKRAJNOVICH, D. J; VAZAQUEZ, J. E.Journal of applied physics. 1993, Vol 73, Num 6, pp 3001-3008, issn 0021-8979Article

Pre-imidized photoimageable polyimide as a dielectric for high density multichip modulesCECH, J. M; BURNETT, A. F; KNAPP, L et al.Polymer engineering and science. 1992, Vol 32, Num 21, pp 1646-1652, issn 0032-3888Conference Paper

In-plane solvent diffusion in a soluble polyimide lift-off structureSHIH, D.-Y; GALLIGAN, E; CATALDO, J et al.Journal of vacuum science and technology. B. Microelectronics processing and phenomena. 1990, Vol 8, Num 5, pp 1038-1043, issn 0734-211XArticle

Le polyimide-alumine: un isolant performant utilisé dans un aimant supraconducteur refroidi à l'hélium superfluide = Polyimide-alumin: a perform isolating material used in a supraconducting magnet cooled with Helium fluidLIBEYRE, P.Revue de physique appliquée. 1988, Vol 23, Num 11, pp 1761-1765, issn 0035-1687Article

Reduced copper diffusion in layered silicate/fluorinated polyimide (6FDA-ODA) nanocompositesJIANG, Liang-You; WEI, Kung-Hwa.Journal of applied polymer science. 2004, Vol 92, Num 3, pp 1422-1425, issn 0021-8995, 4 p.Article

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