kw.\*:("Imida polímero")
Results 1 to 25 of 3990
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A photosensitive polymide using an alkaline aqueous solution as a developerNISHIZAWA, H; SATO, K; KOJIMA, M et al.Polymer engineering and science. 1992, Vol 32, Num 21, pp 1610-1612, issn 0032-3888Conference Paper
Novel auto-photosensitive polyimides with tailored propertiesROHDE, O; SMOLKA, P; FALCIGNO, P. A et al.Polymer engineering and science. 1992, Vol 32, Num 21, pp 1623-1629, issn 0032-3888Conference Paper
A new positive-type photoreactive polyimide precursor using 1,4-dihydropyridine derivativeOMOTE, T; YAMAOKA, T.Polymer engineering and science. 1992, Vol 32, Num 21, pp 1634-1641, issn 0032-3888Conference Paper
Process characterization of an aqueous developable photosensitive polyimide on a broadband stepperFLACK, Warren W; KULAS, Scott; FRANKLIN, Craig et al.SPIE proceedings series. 2000, pp 452-463, isbn 0-8194-3617-8Conference Paper
Progress in polyimide chemistry IKRICHELDORF, Hans R.Advances in polymer science. 1999, Vol 140, issn 0065-3195, 185 p.Serial Issue
Stable second-order nonlinear optical polymer network based on an organosoluble polyimideHSIUE, G. H; KUO, J. K; JENG, R. J et al.Chemistry of materials. 1994, Vol 6, Num 7, pp 884-887, issn 0897-4756Article
Polyimide ablation using intense laser beamsSOBEHART, J. R.Journal of applied physics. 1993, Vol 74, Num 4, pp 2830-2833, issn 0021-8979Article
Intrinsically photosensitive polyimides : approaches to fluorinated homologsMOORE, J. A; GAMBLE, D. R.Polymer engineering and science. 1992, Vol 32, Num 21, pp 1642-1645, issn 0032-3888Conference Paper
Carbonization and graphitization of polymide film NovaxINAGAKI, M; LI-JUN MENG; IBUKI, T et al.Carbon (New York, NY). 1991, Vol 29, Num 8, pp 1239-1243, issn 0008-6223Article
Curing of polyimidesFEGER, C.Polymer engineering and science. 1989, Vol 29, Num 5, pp 347-351, issn 0032-3888Article
Effect of isothermal aging on the imidization of PMR-15JORDAN, K; IROH, J. O.Polymer engineering and science. 1996, Vol 36, Num 20, pp 2550-2555, issn 0032-3888Article
A new generation of polyimide filmsMaterials engineering. 1992, Vol 109, Num 6, pp 17-18, issn 0025-5319Article
Pthalimide on copper: a model system to address certain site-specific interactions at the polyimide-copper interfaceSALANECK, W. R; STAFSTROM, S; BREDAS, J.-L et al.Journal of vacuum science and technology. A. Vacuum, surfaces, and films. 1988, Vol 6, Num 6, pp 3134-3139, issn 0734-2101Article
Surface modification of polyimide gate insulators for solution-processed 2,7-didecyl[1 ]benzothieno-[3,2-b][1]benzothiophene (C10-BTBT) thin-film transistorsJANG, Kwang-Suk; WON SOO KIM; WON, Jong-Myung et al.PCCP. Physical chemistry chemical physics (Print). 2013, Vol 15, Num 3, pp 950-956, issn 1463-9076, 7 p.Article
Formation of intrinsic surface defects during 248 nm photoablation of polyimideKRAJNOVICH, D. J; VAZAQUEZ, J. E.Journal of applied physics. 1993, Vol 73, Num 6, pp 3001-3008, issn 0021-8979Article
Pre-imidized photoimageable polyimide as a dielectric for high density multichip modulesCECH, J. M; BURNETT, A. F; KNAPP, L et al.Polymer engineering and science. 1992, Vol 32, Num 21, pp 1646-1652, issn 0032-3888Conference Paper
In-plane solvent diffusion in a soluble polyimide lift-off structureSHIH, D.-Y; GALLIGAN, E; CATALDO, J et al.Journal of vacuum science and technology. B. Microelectronics processing and phenomena. 1990, Vol 8, Num 5, pp 1038-1043, issn 0734-211XArticle
Le polyimide-alumine: un isolant performant utilisé dans un aimant supraconducteur refroidi à l'hélium superfluide = Polyimide-alumin: a perform isolating material used in a supraconducting magnet cooled with Helium fluidLIBEYRE, P.Revue de physique appliquée. 1988, Vol 23, Num 11, pp 1761-1765, issn 0035-1687Article
Study of dielectric response of PMR-15 resin during cureSTEPHAN, F; SEYTRE, G; BOITEUX, G et al.Journal of non-crystalline solids. 1994, Vol 172-74, pp 1001-1011, issn 0022-3093, 2Conference Paper
Spin coating behavior of polyimide precursor solutionsLEVINSON, W. A; ARNOLD, A; DEHODGINS, O et al.Polymer engineering and science. 1993, Vol 33, Num 15, pp 980-988, issn 0032-3888Article
Large area photochemical dry etching of polyimide with excimer UV lampsJUN YING ZHANG; ESROM, H; KOGELSCHATZ, U et al.Applied surface science. 1993, Vol 69, Num 1-4, pp 299-304, issn 0169-4332Conference Paper
Ester-type photosensitive polyimide precursor with low thermal expansion coefficientMATSUOKA, Y; YOKOTA, K; OGITANI, S et al.Polymer engineering and science. 1992, Vol 32, Num 21, pp 1618-1622, issn 0032-3888Conference Paper
Positive photosensitive polyimide synthesized by block-copolymerization for KrF lithographyITATANI, Taro; GORWADKAR, Sucheta; FUKUSHIMA, Takafumi et al.SPIE proceedings series. 2000, pp 552-558, isbn 0-8194-3617-8Conference Paper
A polyimide removal process for die sealed in ceramic packageTSANG, Y. L; PERRIN, D.Journal of the Electrochemical Society. 1995, Vol 142, Num 6, pp 2047-2051, issn 0013-4651Article
Thermal diffusivity measurement of a thin film in the direction across the film by AC calorimetric methodKATO, R; MAESONO, A; HATTA, I et al.Japanese journal of applied physics. 1993, Vol 32, Num 8, pp 3653-3655, issn 0021-4922, 1Article