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kw.\*:("Imide polymère")

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Results 1 to 25 of 8481

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A photosensitive polymide using an alkaline aqueous solution as a developerNISHIZAWA, H; SATO, K; KOJIMA, M et al.Polymer engineering and science. 1992, Vol 32, Num 21, pp 1610-1612, issn 0032-3888Conference Paper

Novel auto-photosensitive polyimides with tailored propertiesROHDE, O; SMOLKA, P; FALCIGNO, P. A et al.Polymer engineering and science. 1992, Vol 32, Num 21, pp 1623-1629, issn 0032-3888Conference Paper

A new positive-type photoreactive polyimide precursor using 1,4-dihydropyridine derivativeOMOTE, T; YAMAOKA, T.Polymer engineering and science. 1992, Vol 32, Num 21, pp 1634-1641, issn 0032-3888Conference Paper

Adhesive bonding study of amorphous LARC-TPIPROGAR, D. J; ST. CLAIR, T. L.Journal of adhesion science and technology. 1994, Vol 8, Num 1, pp 67-83, issn 0169-4243Article


Polyimide/PDMS flexible thermoelectric generator for ambient assisted living applicationsFRANCIOSO, L; DE PASCALI, C; FARELLA, I et al.Proceedings of SPIE, the International Society for Optical Engineering. 2011, Vol 8066, issn 0277-786X, isbn 978-0-8194-8655-4, 80662H.1-80662H.5Conference Paper

Process characterization of an aqueous developable photosensitive polyimide on a broadband stepperFLACK, Warren W; KULAS, Scott; FRANKLIN, Craig et al.SPIE proceedings series. 2000, pp 452-463, isbn 0-8194-3617-8Conference Paper

Progress in polyimide chemistry IKRICHELDORF, Hans R.Advances in polymer science. 1999, Vol 140, issn 0065-3195, 185 p.Serial Issue

Stable second-order nonlinear optical polymer network based on an organosoluble polyimideHSIUE, G. H; KUO, J. K; JENG, R. J et al.Chemistry of materials. 1994, Vol 6, Num 7, pp 884-887, issn 0897-4756Article

Polyimide ablation using intense laser beamsSOBEHART, J. R.Journal of applied physics. 1993, Vol 74, Num 4, pp 2830-2833, issn 0021-8979Article

Intrinsically photosensitive polyimides : approaches to fluorinated homologsMOORE, J. A; GAMBLE, D. R.Polymer engineering and science. 1992, Vol 32, Num 21, pp 1642-1645, issn 0032-3888Conference Paper

Carbonization and graphitization of polymide film NovaxINAGAKI, M; LI-JUN MENG; IBUKI, T et al.Carbon (New York, NY). 1991, Vol 29, Num 8, pp 1239-1243, issn 0008-6223Article

Curing of polyimidesFEGER, C.Polymer engineering and science. 1989, Vol 29, Num 5, pp 347-351, issn 0032-3888Article

A polyimide-based capacitive humidity sensorSCHUBERT, P. J; NEVIN, J. H.I.E.E.E. transactions on electron devices. 1985, Vol 32, Num 7, pp 1220-1223, issn 0018-9383Article

Progress in polyimide chemistry. IIKRICHELDORF, H. R.Advances in polymer science. 1999, Vol 141, issn 0065-3195, 251 p.Serial Issue

Effect of cold-drawing on the carbonization of polyimide filmsTAKEICHI, T; TAKENOSHITA, H; OGURA, S et al.Chemistry Letters. 1993, Num 4, pp 657-658, issn 0366-7022Article

Comparison of finite element stress analysis results with peel strength at the copper-polyimide interfaceLACOMBE, R. H; BUCHWALTER, L. P; HOLLOWAY, K et al.Journal of adhesion science and technology. 1993, Vol 7, Num 12, pp 1293-1307, issn 0169-4243Article

The use of peel tests to examine the self adhesion of polyimide filmsBROWN, H. R; YANG, A. C. M.Journal of adhesion science and technology. 1992, Vol 6, Num 3, pp 333-346, issn 0169-4243Article

Etude Cinétique de polymères thermostables. Application aux matériaux de structure (préimprégnés) et à la microélectronique (photoréactivité) = Kinetical study of high temperature polymers. Application for structural materials (prepregs) and for microelectronic (photosensitivity)Loisel, Bernard; Abadie, Marc.1992, 207 p.Thesis

Structuring of polyimide by ArF excimer laser ablationSPIESS, W; STRACK, H.Semiconductor science and technology. 1989, Vol 4, Num 6, pp 486-490, issn 0268-1242, 5 p.Article

Large-aperture focusing of high-energy x rays with a rolled polyimide filmNILLIUS, Peter; KARLSSON, Staffan; CEDERSTRÖM, Bjorn et al.Optics letters. 2011, Vol 36, Num 4, pp 555-557, issn 0146-9592, 3 p.Article

Functionalization of carbon nanofibers with diamine and polyimide oligmerXIAOBING LI; COLEMAN, Maria R.Carbon (New York, NY). 2008, Vol 46, Num 8, pp 1115-1125, issn 0008-6223, 11 p.Article

Adhesion properties of Cu/Cr films on polyimide substrate treated by dielectric barrier discharge plasmaSOO HONG KIM; SU HYEUN CHO; LEE, N.-E et al.Surface & coatings technology. 2005, Vol 193, Num 1-3, pp 101-106, issn 0257-8972, 6 p.Conference Paper

Effect of isothermal aging on the imidization of PMR-15JORDAN, K; IROH, J. O.Polymer engineering and science. 1996, Vol 36, Num 20, pp 2550-2555, issn 0032-3888Article

A new generation of polyimide filmsMaterials engineering. 1992, Vol 109, Num 6, pp 17-18, issn 0025-5319Article

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