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Venture investing in semiconductorsPRABHAKAR, Arati.IEEE Compound Semiconductor Integrated Circuit Symposium. 2004, isbn 0-7803-8616-7, 1Vol, p.12Conference Paper

A computer aided cost estimation system for BGA/DCA technologyNAGARAJAN, K; SANTOS, D. L; SRIHARI, K et al.Computers & industrial engineering. 1996, Vol 31, Num 1-2, pp 119-122, issn 0360-8352Conference Paper

Performance analysis of 802.15.4 wireless standardLOSAVIO, Emanuele; ORCIONI, Simone; CONTI, Massimo et al.Proceedings of SPIE, the International Society for Optical Engineering. 2011, Vol 8067, issn 0277-786X, isbn 978-0-8194-8656-1, 806707.1-806707.11Conference Paper

ASMC 2002 : advancing the science and technology of semiconductor manufacturing (Boston MA, 30 April - 2 May 2002)ASMC proceedings. 2002, issn 1078-8743, isbn 0-7803-7158-5, V, 430 p, isbn 0-7803-7158-5Conference Proceedings

An analysis of technology trends within the electronics industryPALMER, P. J; WILLIAMS, D. J.Microelectronics international. 2000, Vol 17, Num 1, pp 13-16, issn 1356-5362Conference Paper

Applications of X-Ray Characterization for Advanced Materials in the Electronics Industry : Neutron and X-Ray Studies of Advanced MaterialsVIGLIANTE, A; KASPER, N; BRECHBUEHL, J et al.Metallurgical and materials transactions. A, Physical metallurgy and materials science. 2010, Vol 41, Num 5, pp 1167-1173, issn 1073-5623, 7 p.Article

Environmental leadership in electronics manufacturing : Lead-free and beyondSHANGGUAN, Dongkai.Electronics recycling summitIEEE international symposium on electronics and the environment (ISEE). 2004, pp 33-39, isbn 0-7803-8250-1, 1Vol, 7 p.Conference Paper

Lavorazioni con laser di potenza nell'industria elettronica e meccanica = Usinage par laser de puissance dans les industries électronique et mécanique = Power-laser machining in electronic and mechanic industriesCERRI, W; GARIFO, L; MOR, G. P et al.Alta frequenza. 1988, Vol 57, Num 4, pp 77-104, issn 0002-6557Article

The role of success factors and obstacles in design for environment : A survey among asian electronics companiesBOKS, Casper; PASCUAL, Oriol.Electronics recycling summitIEEE international symposium on electronics and the environment (ISEE). 2004, pp 208-213, isbn 0-7803-8250-1, 1Vol, 6 p.Conference Paper

The impact of software growth on the electronics industryVAN GENUCHTEN, Michiel.Computer (Long Beach, CA). 2007, Vol 40, Num 1, pp 106-108, issn 0018-9162, 3 p.Article

Capital equipment Reuse : From strategy to executionWEISBERG, P; RIGONI, J.IEEE international symposium on semiconductor manufacturing conference. 1999, pp 307-310, isbn 0-7803-5403-6Conference Paper

La fonction maintenance chez Seipel = Maintenance function by SeipelCAU, P; DUMAS, M.Maintenance & entreprise (Paris). 1991, Num 437, pp 37-42, issn 1154-6433, 4 p.Article

L'innovation locale dans la filière électronique : pour une autre modernisation. Le cas de l'UruguaySUTZ, J.Tiers monde (Paris). 1994, Vol 35, Num 138, pp 425-441, issn 0040-7356Article

Optimum burn-in time: model and applicationSULTAN, T. I.Microelectronics and reliability. 1986, Vol 26, Num 5, pp 909-916, issn 0026-2714Article

A systematic process for spare part and chemical cost reductionKEITH, C; MANENTE, M; KRAUS, J et al.IEEE international symposium on semiconductor manufacturing conference. 1999, pp 289-293, isbn 0-7803-5403-6Conference Paper

La solution peintures conductrices = Conductive paintings are the solutionBANGA, B.Maintenance & entreprise (Paris). 1997, Num 504, pp 80-81, issn 1154-6433Article

Consumer electronics : an important driver of integrated circuit technologySACK, E. A.Proceedings of the IEEE. 1994, Vol 82, Num 4, pp 465-468, issn 0018-9219Article

Industrieroboterbaukasten IRB 95 = Les modules de robots industriels IRB 95 = Robot building block IRB 95ROBEL, G; THIEL, M.Fertigungstechnik und Betrieb. 1987, Vol 37, Num 7, pp 399-401, issn 0015-024XArticle

The Silicone ConundrumWOLFGONG, W. John; WIGGINS, Kirk.Journal of failure analysis and prevention. 2010, Vol 10, Num 4, pp 264-269, issn 1547-7029, 6 p.Article

Characterization of slurries used for chemical-mechanical polishing (CMP) in the semiconductor industryKUNTZSCH, Timo; WITNIK, Ulrike; HOLLATZ, Mark et al.Chemical engineering & technology. 2003, Vol 26, Num 12, pp 1235-1239, issn 0930-7516, 5 p.Article

Le Brésil ne peut compter que sur son propre marché = Brazil can rely only on his own marketFERRARI, T.Technologies internationales (Strasbourg). 2000, Num 64, pp 6-8, issn 1165-8568Article

Materials demands increase as electronics shrinkCAMPBELL, R.Molding systems. 1999, Vol 57, Num 1, pp 26-30, issn 1520-2585Article

A unique team model for yield improvement across the Fab/Sort manufacturing (F/SM) to assembly/test manufacturing (A/TM) divideMCGOVERN, E. J; WALLACE, B; TAPP, K. A et al.IEEE international symposium on semiconductor manufacturing conference. 1999, pp 299-302, isbn 0-7803-5403-6Conference Paper

Ceramic and glass-ceramic packaging in the 1990sTUMMALA, R. R.Journal of the American Ceramic Society. 1991, Vol 74, Num 5, pp 895-908, issn 0002-7820, 14 p.Article

Speed and precision from novel assembly robotAssembly automation. 1989, Vol 9, Num 2, pp 85-87, issn 0144-5154Article

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