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Results 1 to 25 of 12263

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Balancing electrical and optical interconnection resources at low levelsDRABIK, T. J.SPIE proceedings series. 1998, pp 556-559, isbn 0-8194-2949-XConference Paper

Interconnections and shattered illusionsKIELMAS, Maria.Petroleum review (London. 1968). 2011, Vol 65, Num 774, issn 0020-3076, 36-37, 40 [3 p.]Article

Reliability evaluation of high Density microvia structuresJOSHI, Jaydutt; MARQUEZ, Ursula; PRIMAVERA, Anthony et al.SPIE proceedings series. 2002, pp 249-254, isbn 0-930815-65-3Conference Paper

Advanced Hi-Fill® for interconnect liner applicationsURBANSKY, N; BURGESS, S. R; SCHMIDBAUER, S et al.Microelectronic engineering. 2002, Vol 64, Num 1-4, pp 99-105, issn 0167-9317Conference Paper

Low-k materials etch and strip optimization for sub 0.25μm technologyGAO, T; GRAY, W. D; VAN HOVE, M et al.IEEE 1999 international interconnect technology conference. 1999, pp 53-55, isbn 0-7803-5174-6Conference Paper

Non-Blocking Conditions for EGS NetworksBUSI, Italo; PATTAVINA, Achille.IEEE communications letters. 2010, Vol 14, Num 6, pp 572-574, issn 1089-7798, 3 p.Article

Gold ball bonding on copper substrates at ambient temperaturesLUM, I; NOOLU, N. J; ZHOU, Y et al.SPIE proceedings series. 2003, pp 130-135, isbn 0-8194-5189-4, 6 p.Conference Paper

Novel advanced interconnectsLABENNETT, Richard; BONAFEDE, Salvatore; HUFFMAN, Alan et al.SPIE proceedings series. 2003, pp 282-285, isbn 0-8194-5189-4, 4 p.Conference Paper

Lifetime RC time delay of on-chip copper interconnectMING SUN; PECHT, Michael G; BARBE, David et al.IEEE transactions on semiconductor manufacturing. 2002, Vol 15, Num 2, pp 253-259, issn 0894-6507Article

An interconnecting mechanism for resilient packet ringsXIAOBO ZHOU; LIU LIU; LIEGUANG ZENG et al.Proceedings of SPIE, the International Society for Optical Engineering. 2005, pp 60222F.1-60222F.8, issn 0277-786X, isbn 0-8194-6053-2, 2VolConference Paper

IEEE 2004 international interconnect technology conference (Proccedings)IEEE international interconnect technology conference. 2004, isbn 0-7803-8308-7, 1Vol, 253 p., isbn 0-7803-8308-7Conference Proceedings

Dynamic characterization of NiTiNOL for interconnection applicationsMIZAR SHIVANANDA PAI; PRYPUTNIEWICZ, Ryszard J.SPIE proceedings series. 2003, pp 145-150, isbn 0-8194-5189-4, 6 p.Conference Paper

Proceedings of the fifth european workshop on materials for advanced metallization (MAM 2001), Sigtuna, Sweden, March 5-7, 2001ZHANG, Shi-Li; ÖSTLING, Mikael.Microelectronic engineering. 2002, Vol 60, Num 1-2, issn 0167-9317, 293 p.Conference Proceedings

Directional multiplexing for optical board to board interconnectionsBRENNER, K.-H; KRACKHARDT, U. W; KLUG, R et al.SPIE proceedings series. 1998, pp 416-418, isbn 0-8194-2949-XConference Paper

National technology roadmap for semiconductors : an analysis and perspectiveRIZVI, S. A.SPIE proceedings series. 1998, pp 190-196, isbn 0-8194-2776-4Conference Paper

Ormocer®S: Inorganic-organic hybrid materials for e/o-interconnection-technologyPOPALL, M; DABEK, A; ROBERTSSON, M. E et al.Molecular crystals and liquid crystals science and technology. Section A, Molecular crystals and liquid crystals. 2000, Vol 354, pp 123-142, issn 1058-725XConference Paper

Giga-Cache : A high performance opto-electronic memory architectureLUKOWICZ, Paul.SPIE proceedings series. 2000, pp 189-197, isbn 0-8194-3754-9Conference Paper

Role of temperature gradients in blanket tungsten for microelectronic contactsDEEPAK; GAUR, Anshu.Semiconductor science and technology. 2001, Vol 16, Num 8, pp 665-675, issn 0268-1242Article

Fault-tolerant distributed-shared-memory on a broadcast-based interconnection networkHECHT, D; KATSINIS, C.Lecture notes in computer science. 2000, pp 1281-1285, issn 0302-9743, isbn 3-540-67442-XConference Paper

Wire-bonded through-silicon vias with low capacitive substrate couplingFISCHER, A. C; GRANGE, M; ROXHED, N et al.Journal of micromechanics and microengineering (Print). 2011, Vol 21, Num 8, issn 0960-1317, 085035.1-085035.8Article

Toward the integration of a single carbon nanofibre as via interconnectCOIFFIC, J. C; LE POCHE, H; MARIOLLE, D et al.Microelectronic engineering. 2008, Vol 85, Num 10, pp 1971-1974, issn 0167-9317, 4 p.Conference Paper

Hybrid Preservation of Conditionally Nonblocking Switches under 2-Stage InterconnectionJONATHAN TAN, Xuesong; ROBERT LI, Shuo-Yen.IEEE transactions on communications. 2009, Vol 57, Num 4, pp 940-942, issn 0090-6778, 3 p.Article

The effect of the interconnection architecture on the FPGA performance and energy consumptionVASSILIADIS, N; NIKOLAIDIS, S; SISKOS, S et al.Mediterranean electrotechnical conference. 2004, isbn 0-7803-8271-4, 3Vol, Vol.1, 213-216Conference Paper

Dual damascene photo process using negative tone resistXUELONG SHI; FUNG, Allen; HSU, Stephen et al.SPIE proceedings series. 2000, pp 835-842, isbn 0-8194-3617-8Conference Paper

Stress-induced voiding in stacked tungsten via structureDOMAE, S; ETO, R; OKUMA, K et al.Microelectronics and reliability. 1999, Vol 39, Num 4, pp 507-513, issn 0026-2714Article

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