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IMAPS : international symposium on microelectronics (Denver CO, 4-6 September 2002)SPIE proceedings series. 2002, isbn 0-930815-66-1, XX, 957 p, isbn 0-930815-66-1Conference Proceedings

Beyond periodic pulse reverseGUTIERREZ, Enrique JR.SPIE proceedings series. 2002, pp 708-714, isbn 0-930815-66-1, 7 p.Conference Paper

New lead-free thick film resistorsHORMADALY, J.SPIE proceedings series. 2002, pp 543-547, isbn 0-930815-66-1, 5 p.Conference Paper

Solder joint reliability of wafer scale CSP packagesSMETANA, Joe.SPIE proceedings series. 2002, pp 216-222, isbn 0-930815-66-1, 7 p.Conference Paper

Cold Low Pressure Lamination of LTCC'sROOSEN, Andreas.SPIE proceedings series. 2002, pp 45-50, isbn 0-930815-66-1, 6 p.Conference Paper

Die Place Pickup TipsBLAKELOCK, Kevin.SPIE proceedings series. 2002, pp 617-621, isbn 0-930815-66-1, 5 p.Conference Paper

LMDS applications and RF radio links go for SMD based module technology: Reality, experience and future trendsOPPERMANN, Martin.SPIE proceedings series. 2002, pp 273-278, isbn 0-930815-66-1, 6 p.Conference Paper

A study of factors affecting characteristics of thick film NTC thermistorsNABATIAN, David J.SPIE proceedings series. 2002, pp 433-436, isbn 0-930815-66-1, 4 p.Conference Paper

Amb ceramic substrates, a conventional alternative to unconventional thermal requirementsEASIER, Keith.SPIE proceedings series. 2002, pp 533-537, isbn 0-930815-66-1, 5 p.Conference Paper

Biomedical sensors: New application horizons? A reviewHARSANYI, Gabor.SPIE proceedings series. 2002, pp 806-811, isbn 0-930815-66-1, 6 p.Conference Paper

High density packaging Technology research & Development roadmap in JapanBONKOHARA, Manabu.SPIE proceedings series. 2002, pp 336-341, isbn 0-930815-66-1, 6 p.Conference Paper

High density stacked packaging solution for SiP applications: A flex based multiple die chip-scale package technologySOLBERG, Vern.SPIE proceedings series. 2002, pp 812-817, isbn 0-930815-66-1, 6 p.Conference Paper

High-density interconnect and systems packaging (Santa Clara CA, 17-20 April 2001)SPIE proceedings series. 2001, isbn 0-8194-4139-2, X, 380 p, isbn 0-8194-4139-2Conference Proceedings

International conference on high density packaging and MCMs (Denver CO, 6-9 April 1999)SPIE proceedings series. 1999, isbn 0-930815-57-2, X, 456 p, isbn 0-930815-57-2Conference Proceedings

Fluxless high-vacuum packaging of MEMS and IR sensorsJENKINS, Cory.SPIE proceedings series. 2002, pp 447-452, isbn 0-930815-66-1, 6 p.Conference Paper

Analysis of PCB power/ground plane decoupling with new solver technologyREMSKI, Richard.SPIE proceedings series. 2002, pp 903-908, isbn 0-930815-66-1, 6 p.Conference Paper

Experiences in obtaining cross belt uniformity of ±1°C in a 24 inch wide thick film conveyor furnaceDIMOCK, Fred.SPIE proceedings series. 2002, pp 860-863, isbn 0-930815-66-1, 4 p.Conference Paper

System-on-package (SOP): Next generation convergent microminiaturized Microsystems package solutionGACUSAN, Rodolfo L.SPIE proceedings series. 2002, pp 188-193, isbn 0-930815-66-1, 6 p.Conference Paper

Thermal modeling and measurement of large high power silicon devices with asymmetric power distributionDEENEY, Jeffrey.SPIE proceedings series. 2002, pp 300-305, isbn 0-930815-66-1, 6 p.Conference Paper

Waspp program: Advanced passivation and near hermetic seals for advanced packages and harsh environmentsREUSNOW, Charles.SPIE proceedings series. 2002, pp 715-720, isbn 0-930815-66-1, 6 p.Conference Paper

IMAPS : international symposium on microelectronics (Chicago IL, 26-28 October 1999)SPIE proceedings series. 1999, isbn 0-930815-58-0, XIX, 806 p, isbn 0-930815-58-0Conference Proceedings

Curing low yields in photonicsGARARD, Richard S.SPIE proceedings series. 2002, pp 933-935, isbn 0-930815-66-1, 3 p.Conference Paper

Packaging technologies for automotive Electronics in the Lead-Free eraDANIELSSON, Hans.SPIE proceedings series. 2002, pp 518-523, isbn 0-930815-66-1, 6 p.Conference Paper

Potential of flip chip technologies for chip stacking applicationsWOERNER, Holger.SPIE proceedings series. 2002, pp 500-505, isbn 0-930815-66-1, 6 p.Conference Paper

Ceramic interconnect technology : the next generation (Denver CO, 7-9 April 2003)SPIE proceedings series. 2003, isbn 0-8194-5105-3, 254 p., isbn 0-8194-5105-3Conference Proceedings

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