Au-In-based Hermetic Sealing for MEMS Packaging for Down-Hole ApplicationCHIDAMBARAM, Vivek; CHEN BANGTAO; GAN CHEE LIP et al.Journal of electronic materials. 2014, Vol 43, Num 7, pp 2498-2509, issn 0361-5235, 12 p.Article

Effect of Alcohol-Assisted Annealing on the Quality of Silicon Oxide Thin FilmITO, Takuya; OTA, Yasuyuki; SHIOMORI, Koichiro et al.Journal of electronic materials. 2014, Vol 43, Num 7, pp 2683-2687, issn 0361-5235, 5 p.Article

Effect of Pd Interlayer on Electrochemical Properties of ENIG Surface Finish in 3.5 wt.% NaCl SolutionNAM, N. D; BUI, Q. V; NHAN, H. T et al.Journal of electronic materials. 2014, Vol 43, Num 9, pp 3307-3316, issn 0361-5235, 10 p.Article

Effects of NiO Layer on Anisotropic Magnetoresistance and Sensitivity of Ni₈₁Fe₁₉ FilmsSHUYUN WANG; HUI ZHANG; YUAN YAO et al.Journal of electronic materials. 2014, Vol 43, Num 9, pp 3493-3498, issn 0361-5235, 6 p.Article

Effects of Partial Replacement of Iron with Tungsten on Microstructure, Electrical, Magnetic and Humidity Properties of Copper-Zinc Ferrite MaterialTUDORACHE, Florin; PETRILA, Iulian.Journal of electronic materials. 2014, Vol 43, Num 9, pp 3522-3526, issn 0361-5235, 5 p.Article

Electrical Characteristics of Al/Poly(methyl methacrylate)/p-Si Schottky DeviceSELCUK, A. B; BILGE OCAK, S; ARAS, F. G et al.Journal of electronic materials. 2014, Vol 43, Num 9, pp 3263-3269, issn 0361-5235, 7 p.Article

Emission Properties of Sn²⁺ and Sm³⁺ Co-doped Barium Phosphate GlassJIMENEZ, J. A.Journal of electronic materials. 2014, Vol 43, Num 9, pp 3588-3592, issn 0361-5235, 5 p.Article

Long-Term Structural Instabilities in Undoped and Nitrogen-Doped Ge₂Sb₂Te₅ FilmsKIM, Ki-Hong; YUN, Dong-Jin; KYOUNG, Yong-Koo et al.Journal of electronic materials. 2014, Vol 43, Num 9, pp 3082-3086, issn 0361-5235, 5 p.Article

Low-Temperature Synthesis of High-Adhesion Cu(Mg) Alloy Films on Glass SubstratesITO, Kazuhiro; HAMASAKA, Keiji; KOHAMA, Kazuyuki et al.Journal of electronic materials. 2014, Vol 43, Num 7, pp 2540-2547, issn 0361-5235, 8 p.Article

Luminescence and EPR Studies of Gd³⁺-Activated Strong UV-Emitting CaZrO₃ Phosphors Prepared via Solution Combustion MethodSINGH, Vijay; SIVARAMAIAH, G; RAO, J. L et al.Journal of electronic materials. 2014, Vol 43, Num 9, pp 3486-3492, issn 0361-5235, 7 p.Article

Microwave Synthesis and Characterization of the Series Co_1―xFe_xSb₃ High Temperature Thermoelectric MaterialsIOANNIDOU, A. A; RULL, M; MARTIN-GONZALEZ, M et al.Journal of electronic materials. 2014, Vol 43, Num 7, pp 2637-2643, issn 0361-5235, 7 p.Article

Relationships Between Strain and Recombination in Intermediate Growth Stages of GaNARNATKEVICIUTE, A; REKLAITIS, I; KADYS, A et al.Journal of electronic materials. 2014, Vol 43, Num 7, pp 2667-2675, issn 0361-5235, 9 p.Article

Review on Joint Shear Strength of Nano-Silver Paste and Its Long-Term High Temperature ReliabilityKHAZAKA, R; MENDIZABAL, L; HENRY, D et al.Journal of electronic materials. 2014, Vol 43, Num 7, pp 2459-2466, issn 0361-5235, 8 p.Article

Sputter-Deposited AITiO Thin Films for Semi-Transparent Silicon Thin Film Solar CellsLEE, Seung-Yun; KI SU BANG; JUNG WOOK LIM et al.Journal of electronic materials. 2014, Vol 43, Num 9, pp 3204-3210, issn 0361-5235, 7 p.Article

Structural and Optical Characterizations of Electrochemically Grown Connected and Free-Standing TiO₂ Nanotube ArrayHAZRA, A; DUTTA, K; BHOWMIK, B et al.Journal of electronic materials. 2014, Vol 43, Num 9, pp 3229-3235, issn 0361-5235, 7 p.Article

Structural, Magnetic, and Reflection Loss Characteristics of Ni/Co/Sn-Substituted Strontium Ferrite/Functionalized MWCNT NanocompositesMOUSAVINIA, Mohammad; GHASEMI, Ali; PAIMOZD, Ebrahim et al.Journal of electronic materials. 2014, Vol 43, Num 7, pp 2573-2583, issn 0361-5235, 11 p.Article

Study of Undercooling and Recalescence During Solidification of Sn_62.5Pb_36.5Ag₁ and Sn_96.5Ag₃Cu_0.5 Solders in Real Electronic JointsRUDAJEVOVA, A; DUSEK, K.Journal of electronic materials. 2014, Vol 43, Num 7, pp 2479-2486, issn 0361-5235, 8 p.Article

Synthesis and Characterization of Li-Modified AgTaO₃HIDAYAT ULLAH KHAN; IQBAL, Yaseen.Journal of electronic materials. 2014, Vol 43, Num 9, pp 3550-3558, issn 0361-5235, 9 p.Article

Synthesis and Physicochemical Properties of Yttrium Oxide Doped with Neodymium and LanthanumKRUK, A; MROZEK, M; DOMAGALA, J et al.Journal of electronic materials. 2014, Vol 43, Num 9, pp 3611-3617, issn 0361-5235, 7 p.Article

The Influence of CNT Contents on the Electrical and Electromagnetic Properties of CNT/VinylesterRAFIEE, Roham; SABOUR, Mohammad H; NIKFARJAM, Alireza et al.Journal of electronic materials. 2014, Vol 43, Num 9, pp 3477-3485, issn 0361-5235, 9 p.Article

The Isothermal Section of the Sn-Sb-Ni Ternary System at 270°CCHEN, Yue-Ting; GU FANG; CHEN, Chih-Chi et al.Journal of electronic materials. 2014, Vol 43, Num 9, pp 3324-3332, issn 0361-5235, 9 p.Article

Theoretical Investigations of Half-Metallicity in Cr-Substituted GaN, GaP, GaAs, GaSb Material SystemsHANEEF, Muhammad; ARIF, Suneela; AKBAR, Jehan et al.Journal of electronic materials. 2014, Vol 43, Num 9, pp 3169-3176, issn 0361-5235, 8 p.Article

Thin Film Deposition of Semiconducting Ni-Co Oxide Spinel with Adequate Electrical and Optical Properties for Energy ApplicationTSAI, Shu-Yi; FUNG, Kuan-Zong; WEI, Chao-Nan et al.Journal of electronic materials. 2014, Vol 43, Num 7, pp 2584-2587, issn 0361-5235, 4 p.Article

Ultrafine-Grain and Isotropic Cu/SAC305/Cu Solder Interconnects Fabricated by High-Intensity Ultrasound-Assisted SolidificationHONGJUN JI; QIANG WANG; MINGYU LI et al.Journal of electronic materials. 2014, Vol 43, Num 7, pp 2467-2478, issn 0361-5235, 12 p.Article

A Study of Pb-Rich Dendrites in a Near-Eutectic 63Sn-37Pb Solder Microstructure via Laboratory-Scale Micro X-ray Computed Tomography (μXCT) : Pb-FREE SOLDERS AND MATERIALS FOR EMERGING INTERCONNECT AND PACKAGING TECHNOLOGIESMERTENS, J. C. E; WILLIAMS, J. J; CHAWLA, Nikhilesh et al.Journal of electronic materials. 2014, Vol 43, Num 12, pp 4442-4456, issn 0361-5235, 15 p.Article