Pascal and Francis Bibliographic Databases

Help

Search results

Your search

au.\*:("JU, B.-K")

Publication Year[py]

A-Z Z-A Frequency ↓ Frequency ↑
Export in CSV

Discipline (document) [di]

A-Z Z-A Frequency ↓ Frequency ↑
Export in CSV

Author Country

A-Z Z-A Frequency ↓ Frequency ↑
Export in CSV

Results 1 to 25 of 25

  • Page / 1
Export

Selection :

  • and

Fabrication of high-yield Si micro-diaphragms using electrochemical etch-stop in TMAH/IPA/pyrazine solutionCHUNG, G.-S; PARK, C.-S; JU, B.-K et al.SPIE proceedings series. 1999, pp 346-355, isbn 0-8194-3493-0Conference Paper

Deformable single wall carbon nanotube electrode for transparent tactile touch screenKIM, K; SHIN, K; HAN, J.-H et al.Electronics letters. 2011, Vol 47, Num 2, pp 118-120, issn 0013-5194, 3 p.Article

Fabrication and field emission properties of-poly-diamond filmsJU, B.-K; LEE, Y.-H; OH, M.-H et al.Microelectronics journal. 1998, Vol 29, Num 11, pp 855-859, issn 0959-8324Conference Paper

Anodic bonding technique for silicon-to-ITO coated glass bondingCHOI, W.-B; JU, B.-K; LEE, Y.-H et al.SPIE proceedings series. 1997, pp 336-341, isbn 0-8194-2459-5Conference Paper

Emission characteristics of the molybdenum-coated silicon field emitter arrayPARK, H.-W; JU, B.-K; LEE, Y.-H et al.Japanese journal of applied physics. 1996, Vol 35, Num 10A, pp L1301-L1304, issn 0021-4922, 2Article

Fabrication of un-cooled infrared sensor using pyroelectric thin filmPARK, Y.-K; JU, B.-K; PARK, H.-W et al.SPIE proceedings series. 1999, pp 356-363, isbn 0-8194-3493-0Conference Paper

Direct bonding between spacer and field emitter array using an electron-beam evaporated interlayerPARK, H.-W; JU, B.-K; LEE, Y.-H et al.SPIE proceedings series. 1997, pp 328-335, isbn 0-8194-2459-5Conference Paper

The application of a plastic diaphragm for a silicon micropumpKANG, I.-B; SON, M.-T; HASKARD, M. R et al.SPIE proceedings series. 1997, pp 148-155, isbn 0-8194-2459-5Conference Paper

Light-emitting devices using micromachined Si-tip mirror arraysLEE, Y.-H; LEE, S.-J; JU, B.-K et al.Sensors and actuators. A, Physical. 2000, Vol 80, Num 2, pp 138-142, issn 0924-4247Article

Application of electrostatic bonding to field emission display vacuum packagingLEE, D.-J; LEE, N.-Y; JUNG, S.-J et al.Journal of the Electrochemical Society. 2000, Vol 147, Num 6, pp 2385-2388, issn 0013-4651Article

Effects of a hydrophilic surface in anodic bondingLEE, D.-J; JU, B.-K; JANG, J et al.Journal of micromechanics and microengineering (Print). 1999, Vol 9, Num 4, pp 313-318, issn 0960-1317Article

Glass-to-glass electrostatic bonding for FED tubeless packaging applicationJU, B.-K; CHOI, W.-B; LEE, Y.-H et al.Microelectronics journal. 1998, Vol 29, Num 11, pp 839-844, issn 0959-8324Conference Paper

Experimental analysis on the anodic bonding with an evaporated glass layerCHOI, W.-B; JU, B.-K; LEE, Y.-H et al.Journal of micromechanics and microengineering (Print). 1997, Vol 7, Num 4, pp 316-322, issn 0960-1317Article

Modified low-temperature direct bonding method for vacuum microelectronics applicationJU, B.-K; LEE, D.-J; CHOI, W.-B et al.SPIE proceedings series. 1997, pp 342-348, isbn 0-8194-2459-5Conference Paper

Interfacial oxide growth and filling-up behaviour of the micro-gap in silicon fusion bonding processesJU, B. K; OH, M. H; TCHAH, K. H et al.Journal of materials science. 1993, Vol 28, Num 5, pp 1168-1174, issn 0022-2461Article

Fabrication of silicon membrane using fusion fonding and two-step electrochemical etch-stoppingJU, B. K; OH, M. H; TCHAH, K. H et al.Journal of materials science. 1994, Vol 29, Num 3, pp 664-668, issn 0022-2461Article

Solder bump creation by using droplet microgripper for electronic packagingLEE, S.-Y; CHANG, J.-H; KIM, D et al.Electronics letters. 2010, Vol 46, Num 19, pp 1336-1338, issn 0013-5194, 3 p.Article

On the anisotropically etched bonding interface of directly bonded (100) silicon wafer pairsJU, B. K; LEE, Y. H; TCHAH, K. H et al.Journal of the Electrochemical Society. 1995, Vol 142, Num 2, pp 547-553, issn 0013-4651Article

Silicon-to-indium tin oxide coated glass bonding for packaging of field emission arrays fabricated on silicon waferCHOI, W. B; JU, B. K; LEE, Y. H et al.Journal of materials science. 1999, Vol 34, Num 19, pp 4711-4717, issn 0022-2461Article

The influence of surface roughness on the electric conduction process in amorphous Ta2O5 thin filmsKIM, Y. S; SUNG, M. Y; LEE, Y. H et al.Journal of the Electrochemical Society. 1999, Vol 146, Num 9, pp 3398-3402, issn 0013-4651Article

Characteristics on the gate insulator of metal tip field emitter arrays after wet etching processJUNG, Y. H; JU, B. K; JUNG, J. H et al.Japanese journal of applied physics. 1997, Vol 36, Num 6A, pp 3576-3579, issn 0021-4922, 1Article

Fabrication and characterization of diamond-like carbon coated knife edge field emitter arrayKO, C. G; JU, B. K; LEE, Y. H et al.Japanese journal of applied physics. 1996, Vol 35, Num 10A, pp L1305-L1307, issn 0021-4922, 2Article

Effect of multilayered SrS-SrS:Ce-SrS phosphor prepared by multi-source deposition method on the thin film electroluminescent devicesLEE, Y. H; KIM, D. H; JU, B. K et al.Journal of crystal growth. 1995, Vol 147, Num 3-4, pp 326-332, issn 0022-0248Article

New vacuum packaging method of field emission displayJU, B. K; CHOI, W. B; JEONG, S. J et al.SPIE proceedings series. 1997, pp 246-252, isbn 0-8194-2680-6Conference Paper

Glass-to-glass bonding for vacuum packaging of field emission display in an ultra-high-vacuum chamber using silicon thin filmCHOI, W. B; JU, B. K; LEE, Y. H et al.Journal of the Electrochemical Society. 1999, Vol 146, Num 1, pp 400-404, issn 0013-4651Article

  • Page / 1