A Method to Identify Steady Creep Strain from Indentation Creep Using a New Reference Area of IndentationTAKITA, Atsuko; SASAKI, Katsuhiko; OHGUCHI, Ken-Ichi et al.Journal of electronic materials. 2014, Vol 43, Num 7, pp 2530-2539, issn 0361-5235, 10 p.Article

A Thermally Conductive Composite with a Silica Gel Matrix and Carbon-Encapsulated Copper Nanoparticles as FillerJIN LIN; HAIYAN ZHANG; HAOQUN HONG et al.Journal of electronic materials. 2014, Vol 43, Num 7, pp 2759-2769, issn 0361-5235, 11 p.Article

Ab Initio Investigation of Bi-Rich Bi_1-xSb_x AlloysKHABIBULLIN, A. R; WOODS, L. M.Journal of electronic materials. 2014, Vol 43, Num 9, pp 3110-3116, issn 0361-5235, 7 p.Article

All-Inkjet-Printed Bottom-Gate Thin-Film Transistors Using UV Curable Dielectric for Well-Defined Source-Drain ElectrodesCASTRO, H. F; SOWADE, E; ROCHA, J. G et al.Journal of electronic materials. 2014, Vol 43, Num 7, pp 2631-2636, issn 0361-5235, 6 p.Article

Behaviour of Diffuse Phase Transition in Ba_0.999Pr_0.001 TiO₃ CeramicsPANIGRAHI, M. R.Journal of electronic materials. 2014, Vol 43, Num 9, pp 3646-3652, issn 0361-5235, 7 p.Article

Buckling and Delamination of Ti/Cu/Si Thin Film During AnnealingQIJING LIN; SHUMING YANG; WEIXUAN JING et al.Journal of electronic materials. 2014, Vol 43, Num 9, pp 3351-3356, issn 0361-5235, 6 p.Article

CIGS Thin Films for Cd-Free Solar Cells by One-Step Sputtering ProcessJUN XIANG; XING HUANG; GENGQI LIN et al.Journal of electronic materials. 2014, Vol 43, Num 7, pp 2658-2666, issn 0361-5235, 9 p.Article

Comparative Study of Shallow Acceptor Levels in Unintentionally Doped p-Type GaSe Crystals Prepared by the Bridgman and Liquid Phase Solution Growth MethodsNAGAI, Yuki; MAEDA, Kensaku; SUZUKI, Kohei et al.Journal of electronic materials. 2014, Vol 43, Num 9, pp 3117-3120, issn 0361-5235, 4 p.Article

Development of a Novel Polishing Pad with a Phyllotactic Pattern, and Experimental StudiesYUSHAN LU; JUN WANG; YUEMING LIU et al.Journal of electronic materials. 2014, Vol 43, Num 7, pp 2738-2746, issn 0361-5235, 9 p.Article

Dielectric Properties of Polypropylene-Based Nanocomposites with Ionic Liquid-Functionalized Multiwalled Carbon NanotubesPEI XU; HAOGUAN GUI; YADONG HU et al.Journal of electronic materials. 2014, Vol 43, Num 7, pp 2754-2758, issn 0361-5235, 5 p.Article

Effect of Heat Treatments on the Structural and Magnetic Properties of La-Co Substituted Strontium Ferrite FilmsYAJUAN HUI; WEIMING CHENG; GENGQI LIN et al.Journal of electronic materials. 2014, Vol 43, Num 9, pp 3640-3645, issn 0361-5235, 6 p.Article

Effect of Sintering Temperature on the Properties of Fused Silica Ceramics Prepared by GelcastingWEI WAN; HUANG, Chun-E; JIAN YANG et al.Journal of electronic materials. 2014, Vol 43, Num 7, pp 2566-2572, issn 0361-5235, 7 p.Article

Electrical Properties and Current Transport Mechanisms of the Au/n-GaN Schottky Structure with Solution-Processed High-k BaTiO₃ InterlayerRAJAGOPAL REDDY, V; MANJUNATH, V; JANARDHANAM, V et al.Journal of electronic materials. 2014, Vol 43, Num 9, pp 3499-3507, issn 0361-5235, 9 p.Article

Evaluation the Impact of Annealing on Phase Evolution, Microstructure, and Magnetic Properties of Nanocrystalline Ball-Milled LiSm FerriteMAHMOUDI, M; KAVANLOUEI, M; MALEKI-GHALEH, H et al.Journal of electronic materials. 2014, Vol 43, Num 9, pp 3618-3624, issn 0361-5235, 7 p.Article

Full-Potential Study of the Electronic and Optical Properties of the Transparent Oxide ZnCo₂O₄ by Use of PBE and TB-mBJ PotentialsSAMANTA, Saurabh; SAPAN MOHAN SAINI.Journal of electronic materials. 2014, Vol 43, Num 9, pp 3659-3665, issn 0361-5235, 7 p.Article

Investigations on the Structure, Morphology, and Optoelectronic Properties of Chemically Deposited ZnSe Thin Films: The Effect of Solution pHDEEPA, K; DHANYA, A. C; REMADEVI, T. L et al.Journal of electronic materials. 2014, Vol 43, Num 9, pp 3155-3161, issn 0361-5235, 7 p.Article

Joining of Broken Multiwalled Carbon Nanotubes Using an Electron Beam-Induced Deposition (EBID) TechniqueDHALL, Shivani; VAIDYA, Gayatri; JAGGI, Neena et al.Journal of electronic materials. 2014, Vol 43, Num 9, pp 3283-3289, issn 0361-5235, 7 p.Article

Rate of Sublimation of Yb₁₄MnSb₁₁, a Thermoelectric Material for Space Power ApplicationsNESBITT, James A.Journal of electronic materials. 2014, Vol 43, Num 9, pp 3128-3137, issn 0361-5235, 10 p.Article

Selective Growth of CdTe on Nano-patterned CdS via Close-Space SublimationAGUIRRE, Brandon A; ZUBIA, David; MCCLURE, John C et al.Journal of electronic materials. 2014, Vol 43, Num 7, pp 2651-2657, issn 0361-5235, 7 p.Article

Surface Roughness and Critical Exponent Analyses of Boron-Doped Diamond Films Using Atomic Force Microscopy Imaging: Application of Autocorrelation and Power Spectral Density FunctionsGUPTA, S; VIERKANT, G. P.Journal of electronic materials. 2014, Vol 43, Num 9, pp 3436-3448, issn 0361-5235, 13 p.Article

Synthesis and Luminescence of BaWO₄:Ln³⁺ (Ln = Eu, Tb, and Dy) PowdersXIAOYU SUN; XIAODAN SUN; XINGANG LI et al.Journal of electronic materials. 2014, Vol 43, Num 9, pp 3534-3538, issn 0361-5235, 5 p.Article

Synthesis of Cu₂ZnSnS₄ Nanoparticles for Applications as Counter Electrodes of CdS Quantum Dot-Sensitized Solar CellsXIUQUAN GU; SHUANG ZHANG; YINGHUAI QIANG et al.Journal of electronic materials. 2014, Vol 43, Num 7, pp 2709-2714, issn 0361-5235, 6 p.Article

Thermoelectric Properties of Magnesium Silicide Deposited by Use of an Atmospheric Plasma Thermal SprayGAOSHENG FU; LEI ZUO; JON LONGTIN et al.Journal of electronic materials. 2014, Vol 43, Num 7, pp 2723-2730, issn 0361-5235, 8 p.Article

3D FEM Simulations of Drop Test Reliability on 3D-WLP: Effects of Solder Reflow Residual Stress and Molding Resin Parameters : MECHANICAL RELIABILITY OF ELECTRONIC COMPONENTSBELHENINI, Soufyane; TOUGUI, Abdellah; BOUCHOU, Abdelhake et al.Journal of electronic materials. 2014, Vol 43, Num 3, pp 708-716, issn 0361-5235, 9 p.Article

A Branched Beam-Based Vibration Energy HarvesterGUANGCHENG ZHANG; JUNHUI HU.Journal of electronic materials. 2014, Vol 43, Num 11, pp 3912-3921, issn 0361-5235, 10 p.Article