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Results 1 to 25 of 3384

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A review and prediction of chip scale solder joint reliabilityGHAFFARIAN, R.SPIE proceedings series. 1997, pp 109-110, isbn 0-930815-50-5Conference Paper

New wafer level structure for stress free area array solder attachFILLION, R; MEYER, L; DUROCHER, K et al.SPIE proceedings series. 2003, pp 687-692, isbn 0-8194-5189-4, 6 p.Conference Paper

Reliability of a wafer level packaging method with plastic-core solder bumps: Utilizing Sn-Ag solder at 0.3 mm diameterSUMIKAWA, Masato; MURAYAMA, Rina; OGAWA, Masashi et al.SPIE proceedings series. 2003, pp 693-698, isbn 0-8194-5189-4, 6 p.Conference Paper

Splice testing for LHC quadrupole magnetsBARZI, E; BOSSERT, R; FEHER, S et al.IEEE transactions on applied superconductivity. 2003, Vol 13, Num 2, pp 1301-1304, issn 1051-8223, 4 p., 2Conference Paper

Unleading the wayRICHARDS, Brian.Materials world. 2001, Vol 9, Num 1, pp 19-21, issn 0967-8638Article

Reflow of AuSn Solder Creates Strong JointsGOLOSKER, Ilya; FLORANDO, Jeffrey.Welding journal. 2013, Vol 92, Num 2, pp 48-59, issn 0043-2296, 12 p.Article

2009 Pb-Free SoldersKANG, Sung K; ANDERSON, Iver; HANDWERKER, Carol et al.Journal of electronic materials. 2009, Vol 38, Num 12, issn 0361-5235, 362 p.Conference Proceedings

No-fault-found and intermittent failures in electronic productsHAIYU QI; GANESAN, Sanka; PECHT, Michael et al.Microelectronics and reliability. 2008, Vol 48, Num 5, pp 663-674, issn 0026-2714, 12 p.Article

Wetting interaction between Pb-free Sn-Zn series solders and Cu, Ag substratesKWANG LUNG LIN; PEI CHI LIU; JENN MING SONG et al.Proceedings - Electronic Components Conference. 2004, issn 0569-5503, isbn 0-7803-8365-6, 2Vol, Vol 2, 1310-1313Conference Paper

Estimation of Sn-3.0Ag-0.5Cu solder joint reliability by Weibull distribution and modified Coffin-Manson equationYAMABE, Mitsuharu.SPIE proceedings series. 2003, pp 823-828, isbn 0-8194-5189-4, 6 p.Conference Paper

A micromachined Ball Grid Array test socket for fine-pitch interconnectHUANG, B; ANG, S. S; PORTER, E. V et al.SPIE proceedings series. 2000, pp 172-177, isbn 0-930815-62-9Conference Paper

A novel measurement technique for stencil printed solder pasteDUSEK, Milos; HUNT, Christopher.Soldering & surface mount technology. 2003, Vol 15, Num 2, issn 0954-0911, 5, 35-45 [12 p.]Article

Lead free soldering technology for mobile equipmentTANAKA, Yasunori; TAKAHASHI, Junichi; KAWASHIMA, Kazuyuki et al.SPIE proceedings series. 2000, pp 314-319, isbn 0-930815-62-9Conference Paper

Systemintegration in der Mikroelektronik (Nürnberg, 4-6 Mai 1999) = System integration in micro electronicsReichl, Herbert.Systemintegration in der Mikroelektronik. Kongress. 1999, isbn 3-8007-2456-1, 282 p., isbn 3-8007-2456-1Conference Proceedings

Pb-free Solders and Materials for Emerging Interconnect and Packaging TechnologiesFREAR, Darrel.Journal of electronic materials. 2012, Vol 41, Num 2, issn 0361-5235, 256 p.Serial Issue

Hydrocarbon fluxes for ionic compound free soldering : improvement by peroxide additivesMIYAKE, Toshihiro; ISHIDA, Masaru; INAGAKI, Satoshi et al.Soldering & surface mount technology. 2008, Vol 20, Num 4, pp 28-36, issn 0954-0911, 9 p.Article

Hydrocarbon fluxes for ionic compound free solderingMIYAKE, Toshihiro; ISHIDA, Masaru; INAGAKI, Satoshi et al.Soldering & surface mount technology. 2007, Vol 19, Num 4, pp 11-17, issn 0954-0911, 7 p.Article

Cure processing effects of conductive adhesives as solder alternatives: Performance and reliabilityO'HARA, Wanda; CHENG, Chih-Min; SMITH, Sherri L et al.SPIE proceedings series. 2003, pp 859-863, isbn 0-8194-5189-4, 5 p.Conference Paper

Optocoupler BGA packageJOSHI, R; WU, Chung-Lin; NARAYANAN, M et al.Proceedings - Electronic Components Conference. 2002, pp 1680-1682, issn 0569-5503, isbn 0-7803-7430-4, 3 p.Conference Paper

IMS: Injection Molded solderingDANOVITCH, David; GRUBER, Peter A.SPIE proceedings series. 2000, pp 449-453, isbn 0-930815-62-9Conference Paper

Lead-free soldering : An overview and comparison of the viable solutionsSEELIG, Karl; SURASKI, David.SPIE proceedings series. 2000, pp 558-563, isbn 0-930815-62-9Conference Paper

Cure behavior of a no flow underfill encapsulantHSU, D. T; KIM, H. K; SHI, F. G et al.Microelectronics international. 2000, Vol 17, Num 1, pp 22-26, issn 1356-5362Article

Evaluation of reliability of μBGA solder joints through twisting and bendingPERERA, D. U. D.SPIE proceedings series. 1997, pp 402-407, isbn 0-930815-50-5Conference Paper

Reliability evaluation for solder joints in embed electronic packageYAMABE, Masashi; QIANG YU; SHIBUTANI, Tadahiro et al.Proceedings of SPIE, the International Society for Optical Engineering. 2008, Vol 6798, pp 67980S.1-67980S.10, issn 0277-786X, isbn 978-0-8194-6969-4 0-8194-6969-6, 1VolConference Paper

Verbesserte Momentenübertragung in Welle-Nabe-Verbindungen durch Press-Presslöt-Verbindungen = Improved moment transfer in shaft hub joints through press soldered fittingsFÜSSEL, Uwe; KÜPPERS, Martin; LIPOTH, Istvan et al.VDI-Berichte. 2003, pp 247-258, issn 0083-5560, isbn 3-18-091790-3, 12 p.Conference Paper

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