Korean adolescents' Health risk behaviors and their relationships with the selected psychological constructsKIM, Young-Ho.Journal of adolescent health. 2001, Vol 29, Num 4, pp 298-306, issn 1054-139XArticle

Korean adolescents' Exercise behavior and its relationship with psychological variables based on stages of change modelKIM, Young-Ho.Journal of adolescent health. 2004, Vol 34, Num 6, pp 523-530, issn 1054-139X, 8 p.Article

Lipopolysaccharide synergizes with interferon-γ to induce expression of Mig mRNA in mouse peritoneal macrophagesKIM YOUNG HO; HEE SUN KIM.Journal of microbiology and biotechnology. 2000, Vol 10, Num 5, pp 599-605, issn 1017-7825Article

The microstructure characterization of ultrasmall eutectic Bi-Sn solder bumps on Au/Cu/Ti and Au/Ni/Ti under-bump metallizationKANG, Un-Byoung; KIM, Young-Ho.Journal of electronic materials. 2004, Vol 33, Num 1, pp 61-69, issn 0361-5235, 9 p.Article

A hybrid classification system for cancer diagnosis with proteomic bio-markersKIM, Jung-Ja; KIM, Young-Ho; WON, Yonggwan et al.Lecture notes in computer science. 2005, pp 167-177, issn 0302-9743, isbn 3-540-30737-0, 1Vol, 11 p.Conference Paper

Some mean values related to the quasi-arithmetic meanJEONG SHEOK UME; KIM, Young-Ho.Journal of mathematical analysis and applications. 2000, Vol 252, Num 1, pp 167-176, issn 0022-247XArticle

Voltammetric approach to redox behavior of various elements in cathode ray tube glass meltsKIM, Ki-Dong; KIM, Young-Ho.Journal of non-crystalline solids. 2008, Vol 354, Num 2-9, pp 553-557, issn 0022-3093, 5 p.Conference Paper

Characteristics of the interfacial microstructure of chip-on-plastic joints under thermal cycling and aging treatmentZHI GANG CHEN; KIM, Young-Ho.Journal of electronic materials. 2007, Vol 36, Num 1, pp 45-55, issn 0361-5235, 11 p.Article

New hybrid interpolation method for motion transfer in fluid-structure interactionsKIM, Young-Ho; KIM, Jong-Eun.Journal of aircraft. 2006, Vol 43, Num 2, pp 567-569, issn 0021-8669, 3 p.Article

A new COP bonding using non-conductive adhesives for LCDs driver IC packagingZHI GANG CHEN; KIM, Young-Ho.Displays. 2006, Vol 27, Num 3, pp 130-135, issn 0141-9382, 6 p.Article

Bandwidth enhancement technique for CMOS RGC transimpedance amplifierKIM, Young-Ho; JUNG, Eui-Suk; LEE, Sang-Soo et al.Electronics letters. 2014, Vol 50, Num 12, pp 882-884, issn 0013-5194, 3 p.Article

Glioperazine B, as a new antimicrobial agent against Staphylococcus aureus, and glioperazine C : Two new dioxopiperazines from Bionectra byssicolaZHENG, Chang-Ji; KIM, Young-Ho; KIM, Won-Gon et al.Bioscience, biotechnology, and biochemistry. 2007, Vol 71, Num 8, pp 1979-1983, issn 0916-8451, 5 p.Article

Protective glottic closure : Biomechanical effects of selective laryngeal denervationSASAKI, Clarence T; HUNDAL, Jagdeep S; KIM, Young-Ho et al.The Annals of otology, rhinology & laryngology. 2005, Vol 114, Num 4, pp 271-275, issn 0003-4894, 5 p.Conference Paper

Effect of Pd Thickness on the Interfacial Reaction and Shear Strength in Solder Joints Between Sn-3.0Ag-0.5Cu Solder and Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Surface FinishYOUNG MIN KIM; PARK, Jin-Young; KIM, Young-Ho et al.Journal of electronic materials. 2012, Vol 41, Num 4, pp 763-773, issn 0361-5235, 11 p.Article

Chip to Chip Bonding Using Cu Bumps Capped with Thin Sn Layers and the Effect of Microstructure on the Shear Strength of JointsYANG HO KIM; SUNG WOO MA; KIM, Young-Ho et al.Journal of electronic materials. 2014, Vol 43, Num 9, pp 3296-3306, issn 0361-5235, 11 p.Article

Adhesion improvement of electroless plated Ni layer by ultrasonic agitation during zincating processJIN, Jeong-Gi; LEE, Sung-Ki; KIM, Young-Ho et al.Thin solid films. 2004, Vol 466, Num 1-2, pp 272-278, issn 0040-6090, 7 p.Article

Interfacial reactions between Sn―3.0Ag―0.5Cu solder and Cu―xZn (x = 0―35 wt%) or Cu―xZn―yNi (x = 20 and 25 wt%, y = 15 and 10 wt%) substratesYOUNG MIN KIM; TAE JIN KIM; MIN YOUNG CHOI et al.Journal of alloys and compounds. 2013, Vol 575, pp 350-358, issn 0925-8388, 9 p.Article

Wetting characteristics of Cu―xZn layers for Sn―3.0Ag―0.5Cu soldersJI HYUN LEE; YOUNG MIN KIM; JI HWAN HWANG et al.Journal of alloys and compounds. 2013, Vol 567, pp 10-14, issn 0925-8388, 5 p.Article

Sodium butyrate sensitizes TRAIL-mediated apoptosis by induction of transcription from the DR5 gene promoter through Sp1 sites in colon cancer cellsKIM, Young-Ho; PARK, Jong-Wook; LEE, Jai-Youl et al.Carcinogenesis (New York. Print). 2004, Vol 25, Num 10, pp 1813-1820, issn 0143-3334, 8 p.Article

Kinetics of Intermetallic Compound Formation at the Interface Between Sn-3.0Ag-0.5Cu Solder and Cu-Zn Alloy SubstratesYOUNG MIN KIM; ROH, Hee-Ra; KIM, Sungtae et al.Journal of electronic materials. 2010, Vol 39, Num 12, pp 2504-2512, issn 0361-5235, 9 p.Conference Paper

What controls phase-locking of ENSO to boreal winter in coupled GCMs?HAM, Yoo-Geun; KUG, Jong-Seong; DAEHYUN KIM et al.Climate dynamics. 2013, Vol 40, Num 5-6, pp 1551-1568, issn 0930-7575, 18 p.Article

Structural performance of welded built-up square CFST stub columnsLEE, Seong-Hui; CHOI, Young-Hwan; KIM, Young-Ho et al.Thin-walled structures. 2012, Vol 52, pp 12-20, issn 0263-8231, 9 p.Article

Tunicamycin sensitizes human prostate cells to TRAIL-induced apoptosis by upregulation of TRAIL receptors and downregulation of cIAP2JUNG, Young-Hwa; EUN JIN LIM; HEO, Jeonghoon et al.International journal of oncology. 2012, Vol 40, Num 6, pp 1941-1948, issn 1019-6439, 8 p.Article

Comparison of visibility measurement techniques for forklift truck design factorsCHOI, Chin-Bong; PARK, Peom; KIM, Young-Ho et al.Applied Ergonomics. 2009, Vol 40, Num 2, pp 280-285, issn 0003-6870, 6 p.Article

Electrical characteristics of fine pitch flip chip solder joints fabricated using low temperature soldersKANG, Un-Byoung; KIM, Young-Ho.Proceedings - Electronic Components Conference. 2004, issn 0569-5503, isbn 0-7803-8365-6, 2Vol, Vol 2, 1952-1958Conference Paper