au.\*:("KOJIMA, Kazumi")
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High-performance vertical interconnection for high-density 3D chip stacking packageUMEMOTO, Mitsuo; TANIDA, Kazumasa; NEMOTO, Yoshihiko et al.Proceedings - Electronic Components Conference. 2004, issn 0569-5503, isbn 0-7803-8365-6, 2Vol, Vol 1, 616-623Conference Paper
