AN ELECTRON MICROSCOPY STUDY OF ARSENIC SEGREGATION IN SILICON.KOMEM Y.1977; ACTA METALLURG.; E.U.; DA. 1977; VOL. 25; NO 7; PP. 809-814; ABS. FR. ALLEM.; BIBL. 9 REF.Article

ON THE MOBILITY OF IONS ALONG GRAIN BOUNDARIESKOMEM Y.1972; SCRIPTA METALLURG.; E.U.; DA. 1972; VOL. 6; NO 10; PP. 941-942; BIBL. 11 REF.Serial Issue

THE EFFECT OF GERMANIUM ION IMPLANTATION DOSE ON THE AMORPHIZATION AND RECRYSTALLIZATION OF POLYCRYSTALLINE SILICON FILMSKOMEM Y; HALL IW.1981; J. APPL. PHYS.; ISSN 0021-8979; USA; DA. 1981; VOL. 52; NO 11; PP. 6655-6658; BIBL. 14 REF.Article

THE INCREASE IN THE ELECTRICAL RESISTANCE OF HEAT-TREATED AU/CR FILMS = L'AUGMENTATION DANS LA RESISTANCE ELECTRIQUE DE COUCHES MINCES AU/CR TRAITEES THERMIQUEMENTMUNITZ A; KOMEM Y.1980; THIN SOLID FILMS; ISSN 0040-6090; CHE; DA. 1980; VOL. 71; NO 2; PP. 177-188; BIBL. 11 REF.Article

PRECIPITATION AT COHERENCY LOSS IN CU-0.35 WT PCT CRKOMEM Y; REZEK J.1975; METALLURG. TRANS. A; U.S.A.; DA. 1975; VOL. 6; NO 3; PP. 549-551; BIBL. 8 REF.Article

ON THE STRUCTURE OF ION-IMPLANTED BICRYSTALLINE GOLD FILMS = SUR LA STRUCTURE DE COUCHES D'OR BICRISTALLINES IMPLANTEES PAR DES IONSGREENBERG A; KOMEM Y; BAUER CL et al.1982; THIN SOLID FILMS; ISSN 0040-6090; CHE; DA. 1982; VOL. 90; NO 1; PP. 77-83; BIBL. 8 REF.Conference Paper

THE EFFECT OF THE ELECTRON BOMBARDMENT OF NACL SUBSTRATES ON THE EPITAXIAL GROWTH OF GOLD AND SILVER FILMSCOSANDEY F; KOMEM Y; BAUER CL et al.1979; THIN SOLID FILMS; NLD; DA. 1979; VOL. 59; NO 2; PP. 165-174; BIBL. 28 REF.Article

SHOCK INDUCED HARDNESS IN ALPHA -IRON.GANIN E; KOMEM Y; ROSEN A et al.1978; MATER. SCI. ENGNG; NETHERL.; DA. 1978; VOL. 33; NO 1; PP. 1-4; BIBL. 14 REF.Article

THE EFFECT OF SUBSTRUCTURE ON CREEP PROPERTIES OF MO-5W ALLOY = EFFET DE LA SOUS-STRUCTURE SUR LE FLUAGE D'UN ALLIAGE MO-5WBENDERSKY L; KOMEM Y; ROSEN A et al.1981; HIGH TEMPERATURES- HIGH PRESSURES; ISSN 0018-1544; GBR; DA. 1981; VOL. 13; NO 5; PP. 511-520; BIBL. 9 REF.Article

RECRYSTALLIZATION NEAR LOW-ANGLE (001) TILT BOUNDARIES FOLLOWING COBALT IMPLANTATION IN BICRYSTALLINE THIN FILMS OF GOLDKOMEM Y; GREENBERG A; BAUER CL et al.1981; PHYS. STATUS SOLIDI (A), APPL. RES.; ISSN 0031-8965; DDR; DA. 1981; VOL. 64; NO 1; PP. 317-324; ABS. GER; BIBL. 17 REF.Article

DIRECT OBSERVATION OF GRAIN BOUNDARY DISLOCATION CLIMB IN ION-IRRADIATED GOLD BICRYSTALSKOMEM Y; PETROFF P; BALLUFFI RW et al.1972; PHILOS. MAG.; G.B.; DA. 1972; VOL. 26; NO 1; PP. 239-252; BIBL. 18 REF.Serial Issue

LATTICE IMAGING OF LOW-ANGLE (001) TILT BOUNDARIES IN BICRYSTALLINE FILMS OF GOLDCOSANDEY F; KOMEM Y; BAUER CL et al.1978; SCRIPTA METALLURG.; USA; DA. 1978; VOL. 12; NO 6; PP. 577-582; BIBL. 14 REF.Article

Dislocations and twins formed in zone melted recrystallized Si on SiO₂KOMEM, Y; WEINBERG, Z. A.Journal of applied physics. 1984, Vol 56, Num 8, pp 2213-2217, issn 0021-8979Article

On the I-V characteristics of contacts made of Al/Ti:W films on amorphized (100)Si = Caractéristique I-V de contacts constitués de couches de Al/Ti:W sur Si(100) amorphiséBERGER, S; KOMEM, Y.Journal of applied physics. 1989, Vol 66, Num 12, pp 5890-5893, issn 0021-8979Article

Diffusional processes in thin films of Au/CeO₂ on Ni-Cr superalloyGENUT, M; KOMEM, Y.Thin solid films. 1986, Vol 144, Num 2, pp 211-222, issn 0040-6090Article

Diffusional processes in thin films of Au/CeO₂ on Ni-Cr superalloy = Processus de diffusion dans les couches minces Au/ceO₂ sur un superalliage Ni-CrGENUT, M; KOMEM, Y.Thin solid films. 1986, Vol 144, Num 2, pp 211-222, issn 0040-6090Article

On the microstructure, composition and electrical properties of Al/TiW/poly-Si systemBERGER, S; KOMEM, Y; WEISS, B. Z et al.Applied surface science. 1991, Vol 48-49, pp 281-287, issn 0169-4332, 7 p.Conference Paper

Phase separation in reactions of Ni-Ta thin films with GaAs = Séparation de phases lors des réactions des couches minces Ni-Ta avec GaAsLAHAV, A; EIZENBERG, M; KOMEM, Y et al.Journal of applied physics. 1987, Vol 62, Num 5, pp 1768-1777, issn 0021-8979Article

The structure of joint zone in an explosively bonded Cu/Cu-2Be system = Die Struktur der Grenzzonen in einem sprengplattierten (Cu/Cu-2Be)-SystemGANIN, E; KOMEM, Y; WEISS, B.Z et al.Acta metallurgica. 1986, Vol 34, Num 1, pp 147-158, issn 0001-6160Article

Martensitic transformation in Cu-2Be alloys induced by explosive cladding = Transformation martensique induite par un placage par explosion = Martensitische Umwandlung in Cu-2Be-Legierungen beim ExplosionsplattierenGANIN, E; WEISS, B.Z; KOMEM, Y et al.Metallurgical transactions. A, Physical metallurgy and materials science. 1986, Vol 17, Num 11, pp 1885-1890, issn 0360-2133Article

Diffusion of arsenic in bilayer polycrystalline silicon filmsARIENZO, M; KOMEM, Y; MICHEL, A. E et al.Journal of applied physics. 1984, Vol 55, Num 2, pp 365-369, issn 0021-8979Article

Segregation of solute atoms at dislocations in low-angle grain boundaries = Ségrégation des atomes de soluté aux dislocations dans les joints de grains à petit angleGREENBERG, A; KOMEM, Y; BAUER, C. L et al.Scripta metallurgica. 1983, Vol 17, Num 3, pp 405-410, issn 0036-9748Article

Low temperature reoxidation mechanism in nanocrystalline TiO_2-δ thin filmsROTHSCHILD, A; KOMEM, Y; COSANDEY, F et al.Journal of the Electrochemical Society. 2001, Vol 148, Num 8, pp H85-H89, issn 0013-4651Article

Growth mechanisms of silicon films produced by laser-induced chemical vapor depositionTAMIR, S; KOMEM, Y; EIZENBERG, M et al.Thin solid films. 1995, Vol 261, Num 1-2, pp 251-255, issn 0040-6090Article

Electrical activation of arsenic ion-implanted polycrystalline silicon by rapid thermal annealingWONG, C. Y; KOMEM, Y; HARRISON, H. B et al.Applied physics letters. 1987, Vol 50, Num 3, pp 146-148, issn 0003-6951Article