TAB: NOW IN FACTORYKURZWEIL K.1979; EUROPEAN HYBRID MICROELECTRONICS CONFERENCE. 2/1978/GHENT; NLD; PIJNACKER: DUTCH EFFICIENCY BUREAU; DA. 1979; PP. 367-377; BIBL. 2 REF.Conference Paper

ECONOMIC CONSIDERATIONS IN MULTILAYER THICK FILM HYBRIDS.LOUGHRAN J; KURZWEIL K.1974; I.E.E.E. TRANS. PARTS HYBR. PACKAG.; U.S.A.; DA. 1974; VOL. 10; NO 2; PP. 120-131; BIBL. 12 REF.Article

THICK-FILM PASTES FOR MULTILAYER USEKURZWEIL K; LOUGHRAN J.1973; SOLID-STATE TECHNOL.; U.S.A.; DA. 1973; VOL. 16; NO 5; PP. 36-42; BIBL. 14 REF.Serial Issue

SEREEN: ESSENTIAL TOOL FOR THICK FILM PRINTING.FRANCONVILLE F; KURZWEIL K; STALNECKER SG et al.1974; SOLID STATE TECHNOL.; U.S.A.; DA. 1974; VOL. 17; NO 10; PP. 61-68; BIBL. 8 REF.Article

Electrical performance of interconnects in polyimide-copper thin-film multilayers on ceramic substrateBEDOUANI, M; LAMBERT, D; KURZWEIL, K et al.IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging. 1996, Vol 19, Num 2, pp 382-390, issn 1070-9894Article