Copper nucleation on platinum in the presence of additives in acid-copper solutionJIANWEN HAN; KING, Mackenzie; STAWASZ, Michele et al.Proceedings - Electrochemical Society. 2003, pp 63-78, issn 0161-6374, isbn 1-56677-390-3, 16 p.Conference Paper

Planarization of copper layer for damascene interconnection by electrochemical polishing in alkali-based solutionPARK, Gyung-Soon; OH, Youn-Jin; CHUNG, Chan-Hwa et al.Proceedings - Electrochemical Society. 2003, pp 244-252, issn 0161-6374, isbn 1-56677-390-3, 9 p.Conference Paper

Characterization of a colloidal silica slurry for 0.13μm and 0.18μm devices in a copper CMP processCADENHEAD, J; HUFFMAN, G; LEWIS, D et al.Proceedings - Electrochemical Society. 2003, pp 253-258, issn 0161-6374, isbn 1-56677-390-3, 6 p.Conference Paper

The influence of 2,2'-dipyridyl on non-formaldehyde electroless copper platingJUN LI; HAYDEN, Harley; KOHL, Paul A et al.Proceedings - Electrochemical Society. 2003, pp 99-111, issn 0161-6374, isbn 1-56677-390-3, 13 p.Conference Paper

Copper electrodeposition of high-aspect-ratio vias for three dimensional packagingKONDO, Kazuo; YONEZAWA, Toshihiro; TOMISAKA, Manabu et al.Proceedings - Electrochemical Society. 2003, pp 28-32, issn 0161-6374, isbn 1-56677-390-3, 5 p.Conference Paper

Detection of accelerator breakdown products in copper plating bathsPAVLOV, M; SHALYT, E; BRATIN, P et al.Proceedings - Electrochemical Society. 2003, pp 53-62, issn 0161-6374, isbn 1-56677-390-3, 10 p.Conference Paper

Characterization of plasma strip processes on OSG low-K dielectric filmsSENZI LI; OSTROWSKI, Kirk; KALINOVSKI, Ilia J et al.Proceedings - Electrochemical Society. 2003, pp 224-231, issn 0161-6374, isbn 1-56677-390-3, 8 p.Conference Paper

Thickness effect on the diffusion barrier properties of ZrN in Cu/ZrN/Si systemsCHEN, Cheng-Shi; LIU, Chuan-Pu; YANG, Heng-Ghieh et al.Proceedings - Electrochemical Society. 2003, pp 146-153, issn 0161-6374, isbn 1-56677-390-3, 8 p.Conference Paper

Three-dimensional simulation of superconformal copper deposition based on the curvature-enhanced accelerator coverage mechanismBÄR, E; LORENZ, J; RYSSEL, H et al.Proceedings - Electrochemical Society. 2003, pp 21-27, issn 0161-6374, isbn 1-56677-390-3, 7 p.Conference Paper

Mechanisms of using organic acids to clean copper surfacesYAGISHITA, Teruo; ISHIKAWA, Kenji; NAKAMURA, Moritaka et al.Proceedings - Electrochemical Society. 2003, pp 259-263, issn 0161-6374, isbn 1-56677-390-3, 5 p.Conference Paper

An in-situ FTIR study on palladium displacement reaction for autocatalytic electroless copper depositionOH, Youn-Jin; CHUNG, Chan-Hwa.Proceedings - Electrochemical Society. 2003, pp 79-87, issn 0161-6374, isbn 1-56677-390-3, 9 p.Conference Paper

Investigation of copper bath ageing in the damascene process by electrochemical impedance spectroscopyGABRIELLI, C; MOCOTEGUY, P; PERROT, H et al.Proceedings - Electrochemical Society. 2003, pp 129-136, issn 0161-6374, isbn 1-56677-390-3, 8 p.Conference Paper

Process-induced voiding in copper interconnect metallizationLINDGREN, Peter; DOWNES, Keith; COLE, Stephen et al.Proceedings - Electrochemical Society. 2003, pp 237-243, issn 0161-6374, isbn 1-56677-390-3, 7 p.Conference Paper

ECD seed<^TM> copper layer for seed enhancement in advanced interconnectsHAUMESSER, P. H; DA SILVA, S; CORDEAU, M et al.Proceedings - Electrochemical Society. 2003, pp 6-15, issn 0161-6374, isbn 1-56677-390-3, 10 p.Conference Paper

Relation of contact resistance reduction and process parameters of bonded copper interconnects in three-dimensional integration technologyCHEN, K. N; FAN, A; TAN, C. S et al.Proceedings - Electrochemical Society. 2003, pp 1-5, issn 0161-6374, isbn 1-56677-390-3, 5 p.Conference Paper

Eletrical and mechanical properies of nitrogen and fluorine incorporated organosilicate glass prepared by plasma enhanced chemical vapor depositionJANGJIAN, Shiu-Ko; LIU, Chuan-Pu; HWANG, Weng-Sing et al.Proceedings - Electrochemical Society. 2003, pp 188-194, issn 0161-6374, isbn 1-56677-390-3, 7 p.Conference Paper

Effect of Ta₂N crystallinity on diffusion barrier propertiesCHUNG, Hung-Chin; LIU, Chuan-Pu.Proceedings - Electrochemical Society. 2003, pp 161-166, issn 0161-6374, isbn 1-56677-390-3, 6 p.Conference Paper

Development of spin-on dielectric (Silk<^TM>) etch process for 0.13μm Cu-low K interconnects technologyRAMANA MURTHY, B; CHEN, Y. W; CHEN, X. T et al.Proceedings - Electrochemical Society. 2003, pp 195-203, issn 0161-6374, isbn 1-56677-390-3, 9 p.Conference Paper

The proposal of all-wet fabrication process for ULSI interconnects technologies: Application of electroless NiB deposition to capping and barrier layersYOSHINO, Masahiro; NONAKA, Yuichi; YOKOSHIMA, Tokihiko et al.Proceedings - Electrochemical Society. 2003, pp 137-145, issn 0161-6374, isbn 1-56677-390-3, 9 p.Conference Paper

The role of chloride ion in copper electrodeposition from acidic baths containing Cl^-, PEG, and SPSMIN TAN; HARB, John N.Proceedings - Electrochemical Society. 2003, pp 94-98, issn 0161-6374, isbn 1-56677-390-3, 5 p.Conference Paper

Use of Ti_xTiN as cap layer for the formation of cobalt silicideVULPIO, M; FAZIO, D; BILECI, M et al.Proceedings - Electrochemical Society. 2003, pp 167-173, issn 0161-6374, isbn 1-56677-390-3, 7 p.Conference Paper

Studies on the chemical structure of neutral glycosphingolipids in eggs of the sea hare, Aplysia julianaYAMAGUCHI, Y; KONDA, K; HAYASHI, A et al.Biochimica et biophysica acta, L. Lipids and lipid metabolism. 1992, Vol 1165, Num 1, pp 110-118, issn 0005-2760Article

Toxicité de l'administration combinée pendant 4 semaines du carunomam et de 5 antibiotiques chez le ratKONDA, K; TAKAGI, M; WATANABE, S et al.Yakuri to chiryo. 1988, Vol 16, Num 6, pp 55-76, issn 0386-3603Article

Epidemiology of male same-sex behaviour and associated sexual health indicators in low-and middle-income countries : 2003-2007 estimatesCACERES, C. F; KONDA, K; SEGURA, E. R et al.Sexually transmitted infections. 2008, Vol 84, issn 1368-4973, i49-i56, SUP1Article