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Fabrication and characterization of fine pitch on-chip copper interconnects for advanced wafer level packaging by a high aspect ratio through AZ9260 resist electroplatingDIXIT, Pradeep; CHEE WEE TAN; LUHUA XU et al.Journal of micromechanics and microengineering (Print). 2007, Vol 17, Num 5, pp 1078-1086, issn 0960-1317, 9 p.Article
