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Results 1 to 25 of 46

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ACA bonding technology for low cost electronics packaging applications : current status and remaining challengesLIU, Johan.Soldering & surface mount technology. 2001, Vol 13, Num 3, pp 39-57, issn 0954-0911Article

The comparison studies on growth kinetic of IMC of Cu/Sn3.0Ag0.5Cu (Sn0.4Co0.7Cu)/Cu joints during isothermal aging and their tensile strengthsJU, Guo-Kui; WEI, Xi-Cheng; SUN PENG et al.Soldering & surface mount technology. 2008, Vol 20, Num 3, pp 4-10, issn 0954-0911, 7 p.Article

Advanced manufacturing processes, lead free interconnect materials and reliability modelling for electronics packagingBAILEY, Christopher; LIU, Johan.Soldering & surface mount technology. 2006, Vol 18, Num 2, issn 0954-0911, 53 p.Serial Issue

Thermodynamic assessment of the Sn-Co lead-free solder systemLIBIN LIU; CRISTINAANDERSSON; LIU, Johan et al.Journal of electronic materials. 2004, Vol 33, Num 9, pp 935-939, issn 0361-5235, 5 p.Article

Surface characterisation of oxygen plasma treated electrospun polyurethane fibres and their interaction with red blood cellsZANDEN, Carl; VOINOVA, Marina; GOLD, Julie et al.European polymer journal. 2012, Vol 48, Num 3, pp 472-482, issn 0014-3057, 11 p.Article

Study of interfacial reactions in Sn-3.5Ag-3.0Bi and Sn-8.0Zn-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substratePENG SUN; ANDERSSON, Cristina; XICHENG WEI et al.Journal of alloys and compounds. 2007, Vol 437, Num 1-2, pp 169-179, issn 0925-8388, 11 p.Article

Intermetallic compound formation and diffusion path evolution in eutectic tin-lead flip chip solder bumps after agingHSIAO, Li-Yin; DUH, Jenq-Gong.Soldering & surface mount technology. 2006, Vol 18, Num 2, pp 18-26, issn 0954-0911, 9 p.Conference Paper

A fluxless flip-chip bonding for VCSEL arrays using silver-coated indium solder bumpsCHU, Kun-Mo; LEE, Jung-Sub; HAN SEO CHO et al.IEEE transactions on electronics packaging manufacturing. 2004, Vol 27, Num 4, pp 246-253, issn 1521-334X, 8 p.Conference Paper

Characterization of liquid crystal polymer for high frequency system-in-a-package applicationsGANG ZOU; GRÖNQVIST, Hans; STARSKI, J. Piotr et al.IEEE transactions on advanced packaging. 2002, Vol 25, Num 4, pp 503-508, issn 1521-3323, 6 p.Article

Selected papers from the 9th International Symposium on High Density Design, Packaging and Microsystem Integration (HDP'07)LIU, Johan; DAOQIANG LU; ANDERSSON, Cristina et al.Soldering & surface mount technology. 2009, Vol 21, Num 2, issn 0954-0911, 70 p.Conference Proceedings

The growth behaviours of IMC layers in solid-liquid interfacial reactions of Sn1.5Cu/Cu in high magnetic fieldsCHENG, Cong-Qian; JIE ZHAO; YANG XU et al.Soldering & surface mount technology. 2009, Vol 21, Num 2, pp 14-18, issn 0954-0911, 5 p.Conference Paper

Tensile properties and microstructural characterization of Sn-0.7Cu-0.4Co bulk solder alloy for electronics applicationsANDERSSON, Cristina; PENG SUN; LIU, Johan et al.Journal of alloys and compounds. 2008, Vol 457, Num 1-2, pp 97-105, issn 0925-8388, 9 p.Article

Interface modelling of microsystem interconnections using micropolar theory and discontinuous approximationYAN ZHANG; LARSSON, Ragnar; FAN, Jing-Yu et al.Computers & structures. 2007, Vol 85, Num 19-20, pp 1500-1513, issn 0045-7949, 14 p.Article

Process and pad design optimization for 01005 passive component surface mount assemblyYU WANG; OLORUNYOMI, Michael; DAHLBERG, Martin et al.Soldering & surface mount technology. 2007, Vol 19, Num 1, pp 34-44, issn 0954-0911, 11 p.Article

Uncertainty estimation by Monte Carlo simulation applied to life cycle inventory of cordless phones and microscale metallization processesANDRAE, Anders S. G; MÖLLER, Patrik; ANDERSON, Johan et al.IEEE transactions on electronics packaging manufacturing. 2004, Vol 27, Num 4, pp 233-245, issn 1521-334X, 13 p.Conference Paper

Properties of two new medium temperature soldersCHUNYUAN LI; XITAO WANG; WENXIA YUAN et al.Soldering & surface mount technology. 2009, Vol 21, Num 2, pp 4-8, issn 0954-0911, 5 p.Conference Paper

Experimental Investigation and Micropolar Modelling of the Anisotropic Conductive Adhesive Flip-Chip InterconnectionYAN ZHANG; LIU, Johan; LARSSON, Ragnar et al.Journal of adhesion science and technology. 2008, Vol 22, Num 14, pp 1717-1731, issn 0169-4243, 15 p.Article

High strain rate testing of solder interconnectionsTSAI, K. T; LIU, F.-L; WONG, E. H et al.Soldering & surface mount technology. 2006, Vol 18, Num 2, pp 12-17, issn 0954-0911, 6 p.Conference Paper

High performance anisotropic conductive adhesives for lead-free interconnectsYI LI; WONG, C. P.Soldering & surface mount technology. 2006, Vol 18, Num 2, pp 33-39, issn 0954-0911, 7 p.Conference Paper

Effect of curing conditions on the electrical properties of isotropic conductive adhesives composed of an epoxy-based binderINOUE, Masahiro; SUGANUMA, Katsuaki.Soldering & surface mount technology. 2006, Vol 18, Num 2, pp 40-45, issn 0954-0911, 6 p.Conference Paper

The impact of lead-free-legislation exemptions on the electronics industryPECHT, Michael; FUKUDA, Yuki; RAJAGOPAL, Subramanian et al.IEEE transactions on electronics packaging manufacturing. 2004, Vol 27, Num 4, pp 221-232, issn 1521-334X, 12 p.Conference Paper

Through-Silicon Vias Filled With Densified and Transferred Carbon Nanotube ForestsTENG WANG; SI CHEN; DI JIANG et al.IEEE electron device letters. 2012, Vol 33, Num 3, pp 420-422, issn 0741-3106, 3 p.Article

Application of through silicon via technology for in situ temperature monitoring on thermal interfacesYIFENG FU; TENGWANG; JONSSON, Ove et al.Journal of micromechanics and microengineering (Print). 2010, Vol 20, Num 2, issn 0960-1317, 025027.1-025027.5Article

Interfacial reactions between Sn-Cu based multicomponent solders and Ni substrates during soldering and agingNING ZHAO; MA, Hai-Tao; LAI WANG et al.Soldering & surface mount technology. 2009, Vol 21, Num 2, pp 19-23, issn 0954-0911, 5 p.Conference Paper

Finite element analysis of fleXBGA reliabilityGANG CHEN; XU CHEN.Soldering & surface mount technology. 2006, Vol 18, Num 2, pp 46-53, issn 0954-0911, 8 p.Article

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