Une autre conception des activités et de la politique culturelle. Extrait du rapport de la FICEMEA présenté par J.-P. Lucas au colloque sous l'égide de l'UnescoLUCAS J.-P.Vers l'Education Nouvelle. 1977, Num 318, pp 5-9Article

Une intégration dans le milieu est-elle encore possible en centre de vacances?LUCAS J.-P.Vers l'Education Nouvelle. 1977, Num 312, pp 12-17Article

The Prohibition Imposed by a Tribunal : Law, Practice, Future DevelopmentLUCAS, J. P.The Jurist (Washington). 1985, Vol 45, Num 2, pp 588-617, issn 0022-6858Article

Stress relaxation behavior of composite and eutectic Sn-Ag solder jointsJADHAV, S. G; BIELER, T. R; SUBRAMANIAN, K. N et al.Journal of electronic materials. 2001, Vol 30, Num 9, pp 1197-1205, issn 0361-5235Conference Paper

Hygrothermal effects of epoxy resin. Part I : The nature of water in epoxyJIMING ZHOU; LUCAS, J. P.Polymer (Guildford). 1999, Vol 40, Num 20, pp 5505-5512, issn 0032-3861Article

Effects of radiation and hydrogen on the fracture resistance of borosilicate glassesMOODY, N. R; ROBINSON, S. L; LUCAS, J. P et al.Journal of the American Ceramic Society. 1995, Vol 78, Num 1, pp 114-120, issn 0002-7820Article

Intermetallic morphology around Ni particles in Sn-3.5Ag solderLEE, J. G; GUO, F; SUBRAMANIAN, K. N et al.Soldering & surface mount technology. 2002, Vol 14, Num 2, issn 0954-0911, 5, 7, 9, 11-17 [10 p.]Article

Residual-mechanical behavior of thermomechanically fatigued Sn-Ag based solder jointsLEE, J. G; GUO, F; CHOI, S et al.Journal of electronic materials. 2002, Vol 31, Num 9, pp 946-952, issn 0361-5235Article

The effects of a water environment on anomalous absorption behavior in graphite/epoxy compositesJIMING ZHOU; LUCAS, J. P.Composites science and technology. 1995, Vol 53, Num 1, pp 57-64, issn 0266-3538Article

Paranoid and aggressive behavior in two obsessive-compulsive adolescents treated with clomipramineALARCON, R. D; JOHNSON, B. R; LUCAS, J. P et al.Journal of the American Academy of Child and Adolescent Psychiatry. 1991, Vol 30, Num 6, pp 999-1002, issn 0890-8567Article

The effect of small additions of copper on the aging kinetics of the intermetallic layer and intermetallic particles of eutectic tin-silver solder jointsSIGELKO, J; CHOI, S; SUBRAMANIAN, K. N et al.Journal of electronic materials. 2000, Vol 29, Num 11, pp 1307-1311, issn 0361-5235Article

Effects of reflow on wettability, microstructure and mechanical properties in lead-free soldersGUO, F; CHOI, S; LUCAS, J. P et al.Journal of electronic materials. 2000, Vol 29, Num 10, pp 1241-1248, issn 0361-5235Conference Paper

Hygrothermal effects of epoxy resin. Part II : Variations of glass transition temperatureJIMING ZHOU; LUCAS, J. P.Polymer (Guildford). 1999, Vol 40, Num 20, pp 5513-5522, issn 0032-3861Article

Determining fracture toughness of vitreous silica glassLUCAS, J. P; MOODY, N. R; ROBINSON, S. L et al.Scripta metallurgica et materialia. 1995, Vol 32, Num 5, pp 743-748, issn 0956-716XArticle

A mathematical model of a spouted bed gasifierLIM, C. J; LUCAS, J. P; HAJI-SULAIMAN, M et al.Canadian journal of chemical engineering. 1991, Vol 69, Num 2, pp 596-606, issn 0008-4034Article

Grain-boundary character and grain growth in bulk tin and bulk lead-free solder alloysTELANG, A. U; BIELER, T. R; LUCAS, J. P et al.Journal of electronic materials. 2004, Vol 33, Num 12, pp 1412-1423, issn 0361-5235, 12 p.Conference Paper

Mechanical properties of intermetallic compounds associated with Pb-free solder joints using nanoindentationLUCAS, J. P; RHEE, H; GUO, F et al.Journal of electronic materials. 2003, Vol 32, Num 12, pp 1375-1383, issn 0361-5235, 9 p.Conference Paper

Micromechanical characterization of thermomechanically fatigued lead-free solder jointsRHEE, H; LUCAS, J. P; SUBRAMANIAN, K. N et al.Journal of materials science. Materials in electronics. 2002, Vol 13, Num 8, pp 477-484, issn 0957-4522Article

Effects of Pb contamination on the eutectic Sn-Ag solder jointCHOI, S; BIELER, T. R; SUBRAMANIAN, K. N et al.Soldering & surface mount technology. 2001, Vol 13, Num 2, pp 26-29, issn 0954-0911Article

Microstructural characterisation of reflowed and isothermally-aged Cu and Ag particulate reinforced Sn-3.5Ag composite soldersGUO, F; CHOI, S; LUCAS, J. P et al.Soldering & surface mount technology. 2001, Vol 13, Num 1, pp 7-18, issn 0954-0911Article

Creep properties of eutectic Sn-3.5Ag solder joints reinforced with mechanically incorporated Ni particlesGUO, F; LEE, J; LUCAS, J. P et al.Journal of electronic materials. 2001, Vol 30, Num 9, pp 1222-1227, issn 0361-5235Conference Paper

The effect of reinforcement stability on composition redistribution in cast aluminum metal matrix compositesLUCAS, J. P; STEPHENS, J. J; GREULICH, F. A et al.Materials science & engineering. A, Structural materials : properties, microstructure and processing. 1991, Vol 131, Num 2, pp 221-230, issn 0921-5093, 10 p.Article