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Interfaces in lead-free solder alloys : Enthalpy of formation of binary Ag-Sn, Cu-Sn and Ni-Sn intermetallic compoundsFLANDORFER, H; SAEED, U; LUEF, C et al.Thermochimica acta. 2007, Vol 459, Num 1-2, pp 34-39, issn 0040-6031, 6 p.Article
