Structure and performance of γ-alumina washcoat deposited by plasma sprayingXIAODONG WU; DUAN WENG; LUHUA XU et al.Surface & coatings technology. 2001, Vol 145, Num 1-3, pp 226-232, issn 0257-8972Article

Nanoindentation on SnAgCu lead-free solder joints and analysisLUHUA XU; PANG, John H. L.Journal of electronic materials. 2006, Vol 35, Num 12, pp 2107-2115, issn 0361-5235, 9 p.Article

Effects of plasma-sprayed NiCrAl/ZrO₂ intermediate on the combination ability of coatingsXIAODONG WU; DUAN WENG; ZHEN CHEN et al.Surface & coatings technology. 2001, Vol 140, Num 3, pp 231-237, issn 0257-8972Article

The thermal stability and catalytic performance of Ce-Zr promoted Rh-Pd/γ-Al₂O₃ automotive catalystsXIAODONG WU; LUHUA XU; DUAN WENG et al.Applied surface science. 2004, Vol 221, Num 1-4, pp 375-383, issn 0169-4332, 9 p.Article

Influence of aging on the morphology and wettability of polytetrafluoroethylene implanted by high-fluence carbon ionJIZHONG ZHANG; LUHUA XU; XIAOJUN YU et al.Materials letters (General ed.). 2002, Vol 56, Num 4, pp 410-417, issn 0167-577X, 8 p.Article

In-situ electromigration study on Sn-Ag-Cu solder joint by digital image speckle analysisLUHUA XU; PANG, John H. L.Journal of electronic materials. 2006, Vol 35, Num 11, pp 1993-1999, issn 0361-5235, 7 p.Conference Paper

Surface characterization and catalytic performance of La_0.7Sr_0.3MnO_3+λ coating deposited by plasma sprayingXIAODONG WU; LUHUA XU; BIN YANG et al.Surface & coatings technology. 2004, Vol 184, Num 1, pp 40-46, issn 0257-8972, 7 p.Article

Electromigration effect on intermetallic growth and Young's modulus in SAC solder jointLUHUA XU; PANG, John H. L; FEI REN et al.Journal of electronic materials. 2006, Vol 35, Num 12, pp 2116-2125, issn 0361-5235, 10 p.Article

Intermetallic growth studies on Sn-Ag-Cu lead-free solder jointsPANG, John H. L; LUHUA XU; SHI, X. Q et al.Journal of electronic materials. 2004, Vol 33, Num 10, pp 1219-1226, issn 0361-5235, 8 p.Conference Paper

Nano-indentation characterization of Ni-Cu-Sn IMC layer subject to isothermal agingLUHUA XU; PANG, John H. L.Thin solid films. 2006, Vol 504, Num 1-2, pp 362-366, issn 0040-6090, 5 p.Conference Paper

Fabrication and characterization of fine pitch on-chip copper interconnects for advanced wafer level packaging by a high aspect ratio through AZ9260 resist electroplatingDIXIT, Pradeep; CHEE WEE TAN; LUHUA XU et al.Journal of micromechanics and microengineering (Print). 2007, Vol 17, Num 5, pp 1078-1086, issn 0960-1317, 9 p.Article

Evaluation on Influencing Factors of Board-Level Drop Reliability for Chip Scale Packages (Fine-Pitch Ball Grid Array)CHONG, Desmond Y. R; CHE, F. X; PANG, John H. L et al.IEEE transactions on advanced packaging. 2008, Vol 31, Num 1, pp 66-75, issn 1521-3323, 10 p.Article