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Unleading the wayRICHARDS, Brian.Materials world. 2001, Vol 9, Num 1, pp 19-21, issn 0967-8638Article

Thermodynamic properties of liquid Au―Bi―Sn alloysZHONGNAN GUO; WENXIA YUAN; HINDLER, Michael et al.Journal of chemical thermodynamics. 2012, Vol 48, pp 201-206, issn 0021-9614, 6 p.Article

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Effect of cooling rate during solidification of Sn―9Zn lead-free solder alloy on its microstructure, tensile strength and ductile―brittle transition temperaturePRABHU, K. N; DESHAPANDE, Parashuram; SATYANARAYAN et al.Materials science & engineering. A, Structural materials : properties, microstructure and processing. 2012, Vol 533, pp 64-70, issn 0921-5093, 7 p.Article

Effective diffusivity of lead free solder alloysSHIDONG LI; BASARAN, Cemal.Computational materials science. 2009, Vol 47, Num 1, pp 71-78, issn 0927-0256, 8 p.Article

Thermoelectric characteristics and tensile properties of Sn-9Zn-xAg lead-free soldersHUNG, Fei-Yi; WANG, Chih-Jung; HUANG, Sung-Min et al.Journal of alloys and compounds. 2006, Vol 420, Num 1-2, pp 193-198, issn 0925-8388, 6 p.Article

Effect of graphene nanosheets reinforcement on the performance of Sn-Ag-Cu lead-free solderLIU, X. D; HAN, Y. D; JING, H. Y et al.Materials science & engineering. A, Structural materials : properties, microstructure and processing. 2013, Vol 562, pp 25-32, issn 0921-5093, 8 p.Article

Microstructural evolution of ε-AgZn₃ and η-Zn phases in Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga solder during aging treatmentHSUAN, Teng-Chun; LIN, Kwang-Lung.Journal of alloys and compounds. 2009, Vol 469, Num 1-2, pp 350-356, issn 0925-8388, 7 p.Article

Effect of cooling rate on the room-temperature impression creep of lead-free Sn-9Zn and Sn-8Zn-3Bi soldersMAHMUDI, R; GERANMAYEH, A. R; NOORI, H et al.Materials science & engineering. A, Structural materials : properties, microstructure and processing. 2008, Vol 487, Num 1-2, pp 20-25, issn 0921-5093, 6 p.Article

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The growth and roughness evolution of intermetallic compounds of Sn-Ag-Cu/Cu interface during soldering reactionYU, D. Q; WANG, L.Journal of alloys and compounds. 2008, Vol 458, Num 1-2, pp 542-547, issn 0925-8388, 6 p.Article

Effects of Zn addition on microstructure and tensile properties of Sn―1Ag―0.5Cu alloySONG, H. Y; ZHU, Q. S; WANG, Z. G et al.Materials science & engineering. A, Structural materials : properties, microstructure and processing. 2010, Vol 527, Num 6, pp 1343-1350, issn 0921-5093, 8 p.Article