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Suppression of tin whisker formation on fine pitch connectors by surface rougheningTAKEUCHI, Makoto; KAMIYAMA, Kouichi; SUGANUMA, Katsuaki et al.Journal of electronic materials. 2006, Vol 35, Num 11, pp 1918-1925, issn 0361-5235, 8 p.Conference Paper

Lead-free solder bump technologies for flip-chip electronic packaging applicationsKARIM, Zaheed S; CHOW, Alice; CHEUNG, Edwin et al.SPIE proceedings series. 2002, pp 570-575, isbn 0-8194-4500-2, 2VolConference Paper

Lead-free electronic soldersSUBRAMANIAN, K. N.Journal of materials science. Materials in electronics. 2007, Vol 18, Num 1-3, issn 0957-4522, 366 p.Serial Issue

A case study of lead free thick film conductors with lead free solder alloysBOKALO, Peter; SHAHBAZI, Samson; SLIMS, Theresa D et al.SPIE proceedings series. 2003, pp 71-76, isbn 0-8194-5189-4, 6 p.Conference Paper

Thermodynamic properties of liquid Au―Bi―Sn alloysZHONGNAN GUO; WENXIA YUAN; HINDLER, Michael et al.Journal of chemical thermodynamics. 2012, Vol 48, pp 201-206, issn 0021-9614, 6 p.Article

The surface tension and density of the Cu-Ag-In alloysFIMA, Przemyslaw; WIATER, Katarzyna; KUCHARSKI, Marian et al.Surface science. 2007, Vol 601, Num 16, pp 3481-3487, issn 0039-6028, 7 p.Article

Lead-free solder alloys: Thermodynamic properties of the (Au + Sb + Sn) and the (Au + Sb) systemHINDLER, Michael; GUOA, Zhongnan; MIKULA, Adolf et al.Journal of chemical thermodynamics. 2012, Vol 55, pp 102-109, issn 0021-9614, 8 p.Article

Evaluation of lead free soldering development by means of a holistic considerationTÜRPE, M.Advanced engineering materials (Print). 2006, Vol 8, Num 3, issn 1438-1656, 138, 161-164 [5 p.]Conference Paper

Enhancing overall mechanical performance of metallic materials using two-directional microwave assisted rapid sinteringGUPTA, M; WONG, W. L. E.Scripta materialia. 2005, Vol 52, Num 6, pp 479-483, issn 1359-6462, 5 p.Article

Enthalpies of mixing of liquid systems for lead free soldering: Al-Cu-Sn systemFLANDORFERA, Hans; RECHCHACH, Meryem; ELMAHFOUDI, A et al.Journal of chemical thermodynamics. 2011, Vol 43, Num 11, pp 1612-1622, issn 0021-9614, 11 p.Article

Microstructures of eutectic Sn-Ag-Zn solder solidified with different cooling ratesWEI, C; LIU, Y. C; HAN, Y. J et al.Journal of alloys and compounds. 2008, Vol 464, Num 1-2, pp 301-305, issn 0925-8388, 5 p.Article

Effects of addition participation in the interfacial reaction on the growth patterns of Cu₆Sn₅-based IMCs during reflow processGAO, F; TAKEMOTO, T.Journal of alloys and compounds. 2006, Vol 421, Num 1-2, pp 283-288, issn 0925-8388, 6 p.Article

Thermodynamic assessment of the Bi-Sn-Zn SystemVIZDAL, Jiri; BRAGA, Maria Helena; KROUPA, Ales et al.Calphad. 2007, Vol 31, Num 4, pp 438-448, issn 0364-5916, 11 p.Article

Phase stability of Ag-Sn alloy nanoparticlesKIJOO SIM; JOONHO LEE.Journal of alloys and compounds. 2014, Vol 590, pp 140-146, issn 0925-8388, 7 p.Article

Effects of small addition of In on the structure of the rapidly cooled Sn-Ag-Zn solderCHEN WEI; YONGCHANG LIU; ZHIMING GAO et al.Journal of alloys and compounds. 2009, Vol 470, Num 1-2, pp 145-149, issn 0925-8388, 5 p.Article

Sn whisker growth in Sn-9Zn-0.5Ga-0.7Pr lead-free solderHUAN YE; SONGBAI XUE; LIANG ZHANG et al.Journal of alloys and compounds. 2011, Vol 509, Num 5, issn 0925-8388, L52-L55Article

Thermodynamic modelling and assessment of the Au-In-Sn systemCACCIAMANI, G; BORZONE, G; WATSON, A et al.Calphad. 2009, Vol 33, Num 1, pp 100-108, issn 0364-5916, 9 p.Article

Thermodynamic investigation of the Ag-Bi-Sn ternary systemZUOAN LI; ZHANMIN CAO; KNOTT, Sabine et al.Calphad. 2008, Vol 32, Num 1, pp 152-163, issn 0364-5916, 12 p.Article

Solidification behavior of Sn-9Zn-xAg lead-free solder alloysTSAI, Ying-Ling; HWANG, Weng-Sing.Materials science & engineering. A, Structural materials : properties, microstructure and processing. 2005, Vol 413-14, pp 312-316, issn 0921-5093, 5 p.Conference Paper

The effect of lead-free solder paste on component placement accuracy and self-alignment during reflowLIUKKONEN, Timo; NUMMENPÄÄ, Pekka; TUOMINEN, Aulis et al.Soldering & surface mount technology. 2004, Vol 16, Num 1, pp 44-47, issn 0954-0911, 4 p.Article

Mechanism of fillet lifting in Sn-Bi alloysBOETTINGER, W. J; HANDWERKER, C. A; NEWBURY, B et al.Journal of electronic materials. 2002, Vol 31, Num 5, pp 545-550, issn 0361-5235Article

New lead-free thick film resistorsHORMADALY, J.SPIE proceedings series. 2002, pp 543-547, isbn 0-930815-66-1, 5 p.Conference Paper

Results of comparative reliability tests on lead-free solder alloysGROSSMANN, Gunter; NICOLETTI, Giovanni; SOLER, Ursin et al.Proceedings - Electronic Components Conference. 2002, pp 1232-1237, issn 0569-5503, isbn 0-7803-7430-4, 6 p.Conference Paper

Selection of Sn-Ag-Cu lead-free alloysSUGANUMA, K; KIM, K. S; HUH, S. H et al.SPIE proceedings series. 2001, pp 529-534, isbn 0-8194-4317-4Conference Paper