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kw.\*:("Lead-free composite solders")

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Novel SiC nanoparticles-containing Sn―1.0Ag―0.5Cu solder with good drop impact performanceEL-DALY, A. A; FAWZY, A; MANSOUR, S. F et al.Materials science & engineering. A, Structural materials : properties, microstructure and processing. 2013, Vol 578, pp 62-71, issn 0921-5093, 10 p.Article

Tensile deformation behavior and melting property of nano-sized ZnO particles reinforced Sn-3.0Ag―0.5Cu lead-free solderEL-DALY, A. A; ELMOSALAMI, T. A; DESOKY, W. M et al.Materials science & engineering. A, Structural materials : properties, microstructure and processing. 2014, Vol 618, pp 389-397, issn 0921-5093, 9 p.Article

Formation and growth of intermetallics around metallic particles in eutectic Sn-Ag solderLEE, J. G; CHEN, K. C; SUBRAMANIAN, K. N et al.Journal of electronic materials. 2003, Vol 32, Num 11, pp 1240-1248, issn 0361-5235, 9 p.Conference Paper

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