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Interfaces in lead-free solder alloys : Enthalpy of formation of binary Ag-Sn, Cu-Sn and Ni-Sn intermetallic compoundsFLANDORFER, H; SAEED, U; LUEF, C et al.Thermochimica acta. 2007, Vol 459, Num 1-2, pp 34-39, issn 0040-6031, 6 p.Article

Effective diffusivity of lead free solder alloysSHIDONG LI; BASARAN, Cemal.Computational materials science. 2009, Vol 47, Num 1, pp 71-78, issn 0927-0256, 8 p.Article

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Microstructure and mechanical properties of Sn-Bi, Sn-Ag and Sn―Zn lead-free solder alloysOSÓRIO, Wislei R; PEIXOTO, Leandro C; GARCIA, Leonardo R et al.Journal of alloys and compounds. 2013, Vol 572, pp 97-106, issn 0925-8388, 10 p.Article

Effect of Lanthanum Doping on the Microstructure of Tin-Silver Solder AlloysMIN PEI; JIANMIN QU.Journal of electronic materials. 2008, Vol 37, Num 3, pp 331-338, issn 0361-5235, 8 p.Article

Microstructural development and mechanical properties of hypereutectic Sn―Cu solder alloysEDUARDO SPINELLI, Jose; GARCIA, Amauri.Materials science & engineering. A, Structural materials : properties, microstructure and processing. 2013, Vol 568, pp 195-201, issn 0921-5093, 7 p.Article

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Modeling Material Properties of Lead-Free Solder AlloysZHANLI GUO; SAUNDERS, Nigel; MIODOWNIK, Peter et al.Journal of electronic materials. 2008, Vol 37, Num 1, pp 23-31, issn 0361-5235, 9 p.Conference Paper