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Wafer direct bonding : tailoring adhesion between brittle materialsPLÖSSL, A; KRÄUTER, G.Materials science & engineering. R, Reports. 1999, Vol 25, Num 1-2, pp 1-88, issn 0927-796XArticle
Thixotropic joining of large ceramic articlesERDMANN, D.Interceram. 2007, Vol 56, Num 1, pp 29-29, issn 0020-5214, 1 p.Article
How to join plasticsREITZ, Wayne E; OMAN, Rebecca M.Advanced materials & processes. 2000, Vol 158, Num 3, pp 49-52, issn 0882-7958Article
Interfacial microstructure of anodic-bonded Al/glassXING QINGFENG; SASAKI, G; FUKUNAGA, H et al.Journal of materials science. Materials in electronics. 2002, Vol 13, Num 2, pp 83-88, issn 0957-4522Article
Estimation of bonding quality between bitumen and aggregate under asphalt mixture manufacturing condition by thermal contact resistance measurementCIRYLE SOME, Saannibe; GAUDEFROY, Vincent; DELAUNAY, Didier et al.International journal of heat and mass transfer. 2012, Vol 55, Num 23-24, pp 6854-6863, issn 0017-9310, 10 p.Article
Simple technology for bulk accelerometer based on bond and etch back silicon on insulator wafersPLAZA, J. A; ESTEVE, J; LORA-TAMAYO, E et al.Sensors and actuators. A, Physical. 1998, Vol 68, Num 1-3, pp 299-302, issn 0924-4247Conference Paper
Low-temperature silicon wafer-to-wafer bonding using gold at eutectic temperatureWOLFFENBUTTEL, R. F; WISE, K. D.Sensors and actuators. A, Physical. 1994, Vol 43, Num 1-3, pp 223-229, issn 0924-4247Conference Paper
Role of large-scale slip in mode II fracture of bimaterial interface produced by diffusion bondingFOX, M. R; GHOSH, A. K.Metallurgical and materials transactions. A, Physical metallurgy and materials science. 2001, Vol 32, Num 8, pp 2109-2114, issn 1073-5623Article
Analytical modelling of solidification during temperature gradient TLP diffusion bondingSHIRZADI, A. A; WALLACH, E. R.Materials science forum. 2000, pp 351-360, issn 0255-5476, isbn 0-87849-852-4Conference Paper
Anodic bonding of lead zirconate titanate ceramics to silicon with intermediate glass layerTANAKA, K; TAKATA, E; OHWADA, K et al.Sensors and actuators. A, Physical. 1998, Vol 69, Num 2, pp 199-203, issn 0924-4247Article
Ultrasonic wire-bond quality monitoring using piezoelectric sensorOR, S. W; CHAN, H. L. W; LO, V. C et al.Sensors and actuators. A, Physical. 1998, Vol 65, Num 1, pp 69-75, issn 0924-4247Article
A fiber optical voltage sensor prepared by micromachining and wafer bondingXIAO, Z; NORRMAN, S; ENGSTRÖM, O et al.Sensors and actuators. A, Physical. 1994, Vol 41, Num 1-3, pp 334-337, issn 0924-4247Conference Paper
COPPER WIRE BONDINGMAYER, Michael; LAI, YI-Shao.Microelectronics and reliability. 2011, Vol 51, Num 1, issn 0026-2714, 189 p.Serial Issue
2006 TMS Annual MeetingJournal of electronic materials. 2006, Vol 35, Num 11, pp 1917-1917, issn 0361-5235, 1 p.Conference Paper
New photosensitive ultrathin films fabricated by the Langmuir-Blodgett techniqueHAFIZ, H. R.Smart materials and structures. 2004, Vol 13, Num 4, pp N68-N71, issn 0964-1726Article
Interface evolution and bond strength when diffusion bonding materials with stable oxide filmsSHIRZADI, A. A; ASSADI, H; WALLACH, E. R et al.Surface and interface analysis. 2001, Vol 31, Num 7, pp 609-618, issn 0142-2421Article
A high accuracy resonant pressure sensor by fusion bonding and trench etchingWELHAM, C. J; GREENWOOD, J; BERTIOLI, M. M et al.Sensors and actuators. A, Physical. 1999, Vol 76, Num 1-3, pp 298-304, issn 0924-4247Conference Paper
Effect of silicon oxide, silicon nitride and polysilicon layers on the electrostatic pressure during anodic bondingPLAZA, J. A; ESTEVE, J; LORA-TAMAYO, E et al.Sensors and actuators. A, Physical. 1998, Vol 67, Num 1-3, pp 181-184, issn 0924-4247Conference Paper
Assembling three-dimensional microstructures using gold-silicon eutectic bondingTIENSUU, A.-L; BEXELL, M; SCHWEITZ, J.-Å et al.Sensors and actuators. A, Physical. 1994, Vol 45, Num 3, pp 227-236, issn 0924-4247Article
Vacuum packaging for microsensors by glass-silicon anodic bondingHENMI, H; SHOJI, S; SHOJI, Y et al.Sensors and actuators. A, Physical. 1994, Vol 43, Num 1-3, pp 243-248, issn 0924-4247Conference Paper
Joining organic materials with inorganic glass : An opportunity for a strengthened glass futureBROWN, John T.American Ceramic Society bulletin. 2005, Vol 84, Num 7, pp 38-42, issn 0002-7812, 5 p.Article
Topological interlocking of platonic solids: a way to new materials and structuresDYSKIN, A. V; ESTRIN, Y; KANEL-BELOV, A. J et al.Philosophical magazine letters. 2003, Vol 83, Num 3, pp 197-203, issn 0950-0839, 7 p.Article
Transient liquid phase diffusion bonding under a temperature gradient : Modelling of the interface morphologyASSADI, H; SHIRZADI, A. A; WALLACH, E. R et al.Acta materialia. 2001, Vol 49, Num 1, pp 31-39, issn 1359-6454Article
Chip-size-packaged silicon microphonesMÜLLENBORN, M; ROMBACH, P; BOUWSTRA, S et al.Sensors and actuators. A, Physical. 2001, Vol 92, Num 1-3, pp 23-29, issn 0924-4247Conference Paper
Metal/ceramic interfaces : a microscopic analysisDE HOSSON, Jeff Th. M; KOOI, Bart J.Surface and interface analysis. 2001, Vol 31, Num 7, pp 637-658, issn 0142-2421Article