DOUBLE-SIDED PHOTOLITHOGRAPHY.HEINZ RA; CHUSS JT; SCHROEDER CM et al.1978; SOLID STATE TECHNOL.; USA; DA. 1978; VOL. 21; NO 8; PP. 55-60; BIBL. 2 REF.Article

PHOTOLITHOGRAPHIC LINEWITH CONTROL.MCGILLIS DA; FEHRS DL.1975; I.E.E.E. TRANS. ELECTRON DEVICES; U.S.A.; DA. 1975; VOL. 22; NO 7; PP. 471-477; BIBL. 3 REF.Article

NOUVEAUX DEVELOPPEMENTS DANS LA TECHNOLOGIE DES CIRCUITS INTEGRESWIEDENHOF N; WAALWIJK JM.1978; ELECTRONIQUE; CHE; DA. 1978; NO 10-11; PP. EL1-EL3Article

PHOTOLITHOGRAPHY IN INTEGRATED CIRCUIT MASK METROLOGY.ROTTMANN HR.1975; SOLID STATE TECHNOL.; U.S.A.; DA. 1975; VOL. 18; NO 6; PP. 29-34; BIBL. 37 REF.Article

FABRICATION TECHNIQUES FOR MICRODEVICES IN SOFT SUPERCONDUCTORSBERCHIER JL; SANCHEZ DH.1978; REV. SCI. INSTRUM.; USA; DA. 1978; VOL. 49; NO 10; PP. 1452-1459; BIBL. 34 REF.Article

TRENDS IN SEMICONDUCTOR PHOTOLITHOGRAPHY.MARKSTEIN HW.1977; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1977; VOL. 17; NO 3; PP. 25-33 (6P.); BIBL. 2 REF.Article

OPTICAL LIMITATION IN FINE PATTERN PHOTOLITHOGRAPHY.WADA Y; UEHARA K.1974; JAP. J. APPL. PHYS.; JAP.; DA. 1974; VOL. 13; NO 12; PP. 2014-2018; BIBL. 9 REF.Article

PHOTOFABRICATION MATERIALS AND TECHNIQUES.BERGMAN DW.1974; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1974; VOL. 14; NO 7; PP. 52-69 (8P.); BIBL. 3 REF.Article

LUBRICATION IN PHOTOLITHOGRAPHY. RESIST PROTECT COATS.FLOWERS DL.1977; J. ELECTROCHEM. SOC.; U.S.A.; DA. 1977; VOL. 124; NO 10; PP. 1608-1612; BIBL. 15 REF.Article

ON THE USE OF PHOTOMASK COATINGS IN PHOTOLITHOGRAPHY.FLOWERS DL; HUGHES HG.1977; J. ELECTROCHEM. SOC.; U.S.A.; DA. 1977; VOL. 124; NO 10; PP. 1599-1602; BIBL. 9 REF.Article

PC EXPOSURE SYSTEMS: A SURVEY.RAMEY D.1977; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1977; VOL. 17; NO 6; PP. 49-53Article

THE QUALITY OF PHOTOMASKS.HANSON AJA.1976; IN: INT. ELECTRON. PACKAG. PROD. CONF. PROC. TECH. PROGRAMME; BRIGHTON, ENGL.; 1976; SURBITON; KIVER COMMUNICATIONS; DA. 1976; PP. 72-82; BIBL. 12 REF.Conference Paper

OBJECTIFS POUR LA PHOTOLITHOGRAVURE DE PROJECTIONGRAMMATIN AP; LARINA RM; GORBUNOVA VA et al.1976; OPT.-MEKH. PROMYSHL.; S.S.S.R.; DA. 1976; NO 11; PP. 60-69; BIBL. 26 REF.Article

PRACTICAL AUTOMATION FOR PHOTOLITHOGRAPHIC WAFER PROCESSING.HARRELL S.1974; SOLID STATE TECHNOL.; U.S.A.; DA. 1974; VOL. 17; NO 8; PP. 47-49; BIBL. 1 REF.Article

PHOTOGRAPHIC TECHNIQUES FOR MICROELECTRONICS.STEVENS GWW.1977; J. PHOTOGR. SCI.; G.B.; DA. 1977; VOL. 25; NO 2; PP. 70-78; BIBL. 23 REF.Article

NACHWEIS VON LEISTUNGSPARAMETERN BEI FOTOREPEATERN. I. = DETECTION DES PARAMETRES DE PUISSANCE DANS LE CAS DE PHOTOREPETEURSGARTNER W.1976; FEINGERAETETECHNIK; DTSCH.; DA. 1976; VOL. 25; NO 9; PP. 416-418; ABS. RUSSE ANGL. FR.; BIBL. 3 REF.Article

PHOTOLITHOGRAPHIC CONTACT PRINTING OF 4000 A LINEWIDTH PATTERNS.SMITH HI; EFREMOW N; KELLEY PL et al.1974; J. ELECTROCHEM. SOC.; U.S.A.; DA. 1974; VOL. 121; NO 11; PP. 1503-1506; BIBL. 20 REF.Article

NEUE LITHOGRAFIEVERFAHREN IN DER HALBLEITERTECHNIK = NOUVELLES METHODES LITHOGRAPHIQUES DANS LA TECHNIQUE DES SEMICONDUCTEURSHANNO S.1978; ELEKTRONIK; DEU; DA. 1978; VOL. 27; NO 11; PP. 59-66; BIBL. 9 REF.Article

OPTICAL LITHOGRAPHY.DILL FH.1975; I.E.E.E. TRANS. ELECTRON DEVICES; U.S.A.; DA. 1975; VOL. 22; NO 7; PP. 440-444; BIBL. 6 REF.Article

TECHNOLOGICAL IMPLICATIONS IN THE PHOTOMASKING PROCESS.O'MALLEY AJ.1975; SOLID STATE TECHNOL.; U.S.A.; DA. 1975; VOL. 18; NO 6; PP. 40-45Article

CHOIX D'UN REGIME OPTIMAL DE PHOTOLITHOGRAPHIE POUR LES COMPOSITIONS PHOTORESISTIVES NEGATIVESGUK EG; YURRE TA; SYRIKINA LK et al.1976; ZH. PRIKL. KHIM.; S.S.S.R.; DA. 1976; VOL. 49; NO 3; PP. 543-545; BIBL. 7 REF.Article

A PROCESS TECHNIQUE TO REDUCE METALLIZATION SHORTS IN IC'S DUE TO PINHOLES IN OXIDE.SETHI GL; KUNDU NN; MARATHE BR et al.1973; J. INSTIT. ELECTRON. TELECOMMUNIC. ENGRS; INDIA; DA. 1973; VOL. 19; NO 9; PP. 481-484; BIBL. 2 REF.Article

IDENTIFICATION OF INTEGRATED CIRCUIT PROCESS AREAS AMENABLE TO DIAGNOSIS AND CONTROL BY ANALYTICAL BEAM TECHNIQUES.DEAL BE.1976; NATION. BUR. STAND., SPEC. PUBL.; U.S.A.; DA. 1976; NO 400-23; PP. 7-20; BIBL. 14 REF.Article

OPTICAL MTF EVALUATION TECHNIQUES FOR MICROELECTRONIC PRINTERS.KING MC; GOLDRICK MR.1977; SOLID STATE TECHNOL.; U.S.A.; DA. 1977; VOL. 19; NO 2; PP. 37-42; BIBL. 2 REF.Article

ELABORATION D'UNE METHODE PHOTOLITHOGRAPHIQUE DE MASQUE PHOTOSENSIBLE INVERSE, A CONTACT, POUR LA FORMATION DE LA TOPOLOGIE DE CIRCUITS A COUCHES MINCES A BASE DE COUCHES PHOTOSENSIBLES A^IIB^VIVERZUNOV SV; KAGANOVICH EH B; PERSHINA NF et al.1977; POLUPROVODN. TEKH. MIKROELEKTRON., U.S.S.R.; S.S.S.R.; DA. 1977; NO 26; PP. 32-34; BIBL. 2 REF.Article