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Results 1 to 25 of 408

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EINFLUSS DER HAFTKRAEFTE AUF DAS FLIESSVERHALTEN KOHAESIVER SCHUETTGUETER = INFLUENCE DES FORCES D'ADHESION SUR LE COMPORTEMENT A L'ECOULEMENT DE MATIERES COHESIVESMOLERUS O.1977; V.D.I. BER.; DEU; DA. 1977 PUBL. 1978; NO 315; PP. 563-577; BIBL. 8 REF.Article

TANKS FOR DEVELOPING, ETCHING PRINTED CIRCUITS QUICKLY ASSEMBLED WITH SILICONE SEALANTS, PRIMER1973; INSULAT./CIRCUITS; U.S.A.; DA. 1973; VOL. 19; NO 1; PP. 42-43Serial Issue

INFLUENCE DE L'EPAISSEUR DU FILM DE COLLE SUR LA TENUE MECANIQUE DES ASSEMBLAGES COLLES.GIRAUD JM.1978; ; FRA; DA. 1978; DGRST-7671276; 98 P.: ILL.; 30 CM; BIBL. 14 REF.; ACTION CONCERT.: MEC.Report

DE-ADHESION BY THE GROWTH OF PENNY-SHAPED BUBBLES IN AN ADHESIVE LAYER.RISHI RAJ; DANG CH.1975; PHILOS. MAG.; G.B.; DA. 1975; VOL. 32; NO 5; PP. 909-922; BIBL. 4 REF.Article

ASSEMBLING ALUMINIUM OUTDOOR LIGHTS1972; MANUF. ENGNG MANAG.; U.S.A.; DA. 1972; VOL. 69; NO 5; PP. 34Serial Issue

ADHESIVE BOND STRESSES AND STRAINS AT DISCONTINUITIES AND CRACKS IN BONDED STRUCTURES.HART SMITH LJ.1978; J. ENGNG MATER. TECHNOL.; U.S.A.; DA. 1978; VOL. 100; NO 1; PP. 16-24; BIBL. 8 REF.Article

USING ADHESIVES IN COIL FABRICATIONALLIES V.1979; ELECTRON. PACKAG. PRODUCT.; USA; DA. 1979; VOL. 19; NO 3; PP. 91-96; (4 P.)Article

DEVELOPING CRITERIA FOR ADHESIVE JOINTS UNDER COMPLEX LOADING.MULVILLE DR; HUNSTON DL; MAST PW et al.1978; J. ENGNG MATER. TECHNOL.; U.S.A.; DA. 1978; VOL. 100; NO 1; PP. 25-31; BIBL. 22 REF.Article

SPECTRUM CRACK GROWTH IN ADHESIVELY BONDED STRUCTURE.JOHNSON WS; RISTER WC; SPAMER T et al.1978; J. ENGNG MATER. TECHNOL.; U.S.A.; DA. 1978; VOL. 100; NO 1; PP. 57-63; BIBL. 21 REF.Article

DEVELOPMENT OF RANDOM FATIGUE DATA FOR ADHESIVELY BONDED AND WELDBONDED STRUCTURES SUBJECTED TO DYNAMIC EXCITATION.WENTZ KR; WOLFE HF.1978; J. ENGNG MATER. TECHNOL.; U.S.A.; DA. 1978; VOL. 100; NO 1; PP. 70-76; BIBL. 9 REF.Article

STARK GENEIGTE SIEBMASCHINEN: EIN WEG ZUR LEISTUNGSSTEIGERUNG UND ABSIEBUNG SIEBSCHWIERIGER MATERIALIEN = CRIBLES FORTEMENT INCLINES: UNE POSSIBILITE D'AUGMENTER LE RENDEMENT ET DE CRIBLER DES MATIERES DIFFICILESLEYMANN H.1983; AUFBEREITUNGS-TECHNIK; ISSN 0004-783X; DEU; DA. 1983; VOL. 24; NO 7; PP. 392-395; ABS. FRE/SPA; IDEM ENGArticle

THE EFFECTS OF INHERENT FLAWS ON THE TIME AND RATE DEPENDENT FAILURE OF ADHESIVELY BONDED JOINTSSANCAKTAR E; PADGILWAR S.1982; J. MECH. DES.; ISSN 0161-8458; USA; DA. 1982; VOL. 104; NO 3; PP. 643-650; BIBL. 20 REF.Article

FATIGUE CRACK GROWTH OF BONDLINE CRACKS IN STRUCTURAL BONDED JOINTS.BRUSSAT TR; CHIU ST.1978; J. ENGNG MATER. TECHNOL.; U.S.A.; DA. 1978; VOL. 100; NO 1; PP. 39-45; BIBL. 7 REF.Article

THICK-FILM BASE-METAL CONDUCTORS ON BERYLLIAPOVOLNY HR.1980; ELECTRON. PACKAG. PRODUCT.; USA; DA. 1980; NO 209; PP. 101-109; (6 P.); BIBL. 4 REF.Article

FRACTURE ANALYSIS OF ADHESIVELY BONDED CRACKED PANELS.SWIFT T.1978; J. ENGNG MATER. TECHNOL.; U.S.A.; DA. 1978; VOL. 100; NO 1; PP. 10-15; BIBL. 9 REF.Article

MASS CHANGES OF ADHESIVES DURING CURING, EXPOSURE TO WATER VAPOR, EVACUATION, AND OUTGASSING, PART I: ABLEFILMS 529, 535 AND 550VASOFSKY RW; CSANDERNA AW; CSANDERNA KK et al.1978; I.E.E.E. TRANS. COMPON. HYBR. MANUFG TECHNOL.; USA; DA. 1978; VOL. 1; NO 4; PP. 405-411; BIBL. 20 REF.Article

BEKLEBEEINRICHTUNG BE2 EINER NEUARTIGEN AUSRUESTUNGSKETTE FUER MASCHINELLES LOETEN. = EQUIPEMENT DE COLLAGE D'UNE NOUVELLE MACHINE A SOUDERWALTHER V; URBAN H; WERNER V et al.1977; FEINGERAETETECHNIK; DTSCH.; DA. 1977; VOL. 26; NO 12; PP. 539-541; ABS. ANGL. FR.; BIBL. 3 REF.Article

RATING HYBRID ADHESIVES RELIABILITY TESTS FOR HIGH-RATE PRODUCTIONBRASSELL GW; FANCHER DR.1978; CIRCUITS MANUF.; USA; DA. 1978; VOL. 18; NO 10; PP. 50-54; (3 P.); BIBL. 5 REF.Article

INFRARED REFRACTOMETER MEASUREMENTS OF ADHESIVESKORNISHI RJ; WOLFE WL.1978; APPL. OPT.; USA; DA. 1978; VOL. 17; NO 19; PP. 3138-3142; BIBL. 13 REF.Article

THE EFFECT OF ADHESION BETWEEN TURNS ON THE TRAINING OF SUPERCONDUCTING MAGNETS.EDWARDS VW; WILSON MN.1978; CRYOGENICS; GBR; DA. 1978; VOL. 18; NO 7; PP. 423-425; BIBL. 4 REF.Article

A SIMPLE CREEP TORSIOMETER AND ITS USE IN THE THERMORHEOLOGICAL CHARACTERIZATION OF A STRUCTURAL ADHESIVEKENNER VH; KNAUSS WG; CHAI H et al.1982; EXP. MECH.; ISSN 0014-4851; USA; DA. 1982; VOL. 22; NO 2; PP. 75-80; BIBL. 7 REF.Article

APPLICATION OF CONDUCTIVE ADHESIVES IN MICROCIRCUITS FOR "LONG LIFE" EQUIPMENTKOORING CWL; RIPHAGEN D.1979; EUROPEAN HYBRID MICROELECTRONICS CONFERENCE. 2/1978/GHENT; NLD; PIJNAKCER: DUTCH EFFICIENCY BUREAU; DA. 1979; PP. 425-440Conference Paper

ELECTRICALLY INSULATIVE ADHESIVES FOR HYBRID MICROELECTRONIC FABRICATIONBRASSELL GW; FANCHER DR.1978; I.E.E.E. TRANS. COMPON. HYBR. MANUFG TECHNOL.; USA; DA. 1978; VOL. 1; NO 2; PP. 192-197; BIBL. 5 REF.Article

RELATIONS ENTRE LA RESISTANCE A LA STRUCTURE PLONGEANTE ET LA PERMEABILITE A L'HUMIDITE DE CIRCUITS IMPRIMES ADHESIFSNAMIKI I.1974; KOBUNSHI RONBUNSHU; JAP.; DA. 1974; VOL. 31; NO 8; PP. 489-492; ABS. ANGL.; BIBL. 7 REF.Article

THERMAL STRESS-INDUCED BREAKDOWN IN AN S-BAND ISOLATORBUCK DC; KING ML.1978; I.E.E.E. TRANS. MICROWAVE THEORY TECH.; USA; DA. 1978; VOL. 26; PP. 357-360; BIBL. 2 REF.Article

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