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Thick-Film Acoustic Emission Sensors for Use in Structurally Integrated Condition-Monitoring ApplicationsPICKWELL, Andrew J; DOREY, Robert A; MBA, David et al.IEEE transactions on ultrasonics, ferroelectrics, and frequency control. 2011, Vol 58, Num 9, pp 1994-2000, issn 0885-3010, 7 p.Article
