COLORING OF ANODIZED ALUMINIUM BY AC ELECTROLYSIS IN COFFER SULFATE SOLUTION = COLORATION DE L'ALUMINIUM ANODISE PAR ELECTROLYSE SOUS COURANT ALTERNATIF DANS UNE SOLUTION DE SULFATE DE CUSAJI T; KOMINE H; AKIYAMA A et al.1979; PLAT. SURF. FINISH.; ISSN 0360-3164; USA; DA. 1979; VOL. 66; NO 11; PP. 40-43; BIBL. 9 REF.Article

IMPROVEMENTS IN ELECTROLESS COPPER FOR AUTOMOTIVE PLASTIC TRIM = AMELIORATIONS DU DEPOT CHIMIQUE DE CU SUR PLASTIQUESARCILESI DA.1981; PLAT. SURF. FINISH.; ISSN 0360-3164; USA; DA. 1981; VOL. 68; NO 6; PP. 90-94; BIBL. 23 REF.Article

HIGH SPEED ELECTROCHEMICAL COPPER DEPOSITIONLEVIT ML; TSVETKOV IV; DAVYDOV AD et al.1982; ELEKTROHIMIJA; ISSN 0424-8570; SUN; DA. 1982; VOL. 18; NO 12; PP. 1587-1591; BIBL. 16 REF.Article

THE ELECTRODEPOSITION OF COPPER INTO A COPPER SINGLE-CRYSTAL (111) PLANE IN THE PRESENCE OF SULPHANILAMIDE = ELECTRODEPOSITION DU CUIVRE SUR LA FACE (111) D'UN MONOCRISTAL DE CUIVRE EN PRESENCE DE SULFANILAMIDESUBRAMANIAN K; NAGESWAR S.1981; SURF. TECHNOL.; ISSN 0376-4583; CHE; DA. 1981; VOL. 12; NO 2; PP. 129-134; BIBL. 15 REF.Article

POWER DISPERSION OF COPPER ELECTROLYTESKUDRYAVTSEV NT; KUZNETSOV VP; NACHINOV GN et al.1981; Z. PRIKL. HIM.; ISSN 0044-4618; SUN; DA. 1981; VOL. 54; NO 9; PP. 2030-2035; BIBL. 10 REF.Article

ELECTRODE KINETICS OF COPPER DEPOSITION FROM COPPER CYANIDE SOLUTION = CINETIQUE DU DEPOT DE CU A PAR DE CYANURE DE CU SUR ELECTRODESINITSKI RE; SRINIVASAN V; HAYNES R et al.1980; J. ELECTROCHEM. SOC.; ISSN 0013-4651; USA; DA. 1980; VOL. 127; NO 1; PP. 47-51; BIBL. 6 REF.Article

A HERITAGE IN METALS = DES SCULTPTURES EN METAL SOUDEWEBER J.1980; WELD. J.; ISSN 0043-2296; USA; DA. 1980; VOL. 59; NO 11; PP. 16-21; LOC. ISArticle

ACCUMULATION OF BY PRODUCTS IN ELECTROLESS COPPER PLATING SOLUTIONS = ACCUMULATION DES SOUS-PRODUITS LORS DU DEPOT CHIMIQUE DE CUCOUROUVELIS CI; SUTCLIFFE G.1980; PLAT. SURF. FINISH.; ISSN 0360-3164; USA; DA. 1980; VOL. 67; NO 9; PP. 71-75; BIBL. 6 REF.Article

PROPERTIES OF ELECTROPLATED TITANIUM = PROPRIETE DU TI RECOUVERT PAR DEPOT ELECTROLYTIQUETHOMA M.1983; PLATING AND SURFACE FINISHING; ISSN 0360-3164; USA; DA. 1983; VOL. 70; NO 6; PP. 76-78; BIBL. 4 REF.Article

ANODIC BEHAVIOR OF CU ELECTRODEPOSITS FROM ACID COPPER SULFATE BATHS WITH ORGANIC SULFUR COMPOUNDSNAWAFUNE H; MIZUMOTO S; KAWASAKI M et al.1983; KINZOKU HYOMEN GIJUTSU. (JOURNAL OF THE METAL FINISHING SOCIETY OF JAPAN); ISSN 0026-0614; JPN; DA. 1983; VOL. 34; NO 2; PP. 71-75; ABS. ENG; BIBL. 11 REF.Article

EFFECT OF ACIDITY AND CHLORIDE DE IONS ON STRUCTURAL DEFECTS AND INTERNAL FRICTION CU ELECTROCOATINGSMAMONTOV EA; KURBATOVA LA; GUSLIKOV VM et al.1982; ELEKTROHIMIJA; ISSN 0424-8570; SUN; DA. 1982; VOL. 18; NO 4; PP. 552-555; BIBL. 8 REF.Article

ELECTRICAL DISCHARGE MACHINING IN DISTILLED WATERJESWANI ML.1981; WEAR; CHE; DA. 1981-10-01; VOL. 72; NO 1; PP. 81-88; BIBL. 6 REF.Article

MICRODISTRIBUTION OF ELECTRODEPOSITED CU ON A CATHODE COATED WITH CU₂SKUZNETSOVA LA; KOVARSKIJ N YA.1981; ELEKTROHIMIJA; ISSN 0424-8570; SUN; DA. 1981; VOL. 17; NO 11; PP. 1633-1637; BIBL. 4 REF.Article

STRUCTURE AND PROPERTIES OF ION PLATED COPPER FILMSTSUNASAWA E; YAMANAKA K.1981; KINZOKU HYOMEN GIJUTSU; ISSN 0026-0614; JPN; DA. 1981; VOL. 32; NO 10; PP. 515-520; ABS. ENG; BIBL. 10 REF.Article

SOME ASPECTS OF THE STRUCTURE OF THE ELECTROLESS COPPER DEPOSIT = QUELQUES ASPECTS DE LA STRUCTURE DES DEPOTS CHIMIQUES D'AUEL MALLAH AT; EL RAGHY SM; ABOU SALF EA et al.1980; PLAT. SURF. FINISH.; ISSN 0360-3164; USA; DA. 1980; VOL. 67; NO 10; PP. 61-64; BIBL. 8 REF.Article

COBALTAGE BRILLANT SANS INHIBITEUR = BRIGH COBALT COATING WITHOUT INHIBITORDEGREZ M; HUBEAU V; WINAND R et al.1980; METALLURGIE (MONS); ISSN 0543-5757; BEL; DA. 1980; VOL. 20; NO 3-4; PP. 95-101; BIBL. 14 REF.Article

AN ELECTROCHEMICAL CONTROL SYSTEM FOR ELECTROLESS COPPER BATH = UN SYSTEME DE CONTROLE ELECTROCHIMIQUE POUR LE DEPOT CHIMIQUE DE CUPAUNOVIC M.1980; J. ELECTROCHEM. SOC.; ISSN 0013-4651; USA; DA. 1980; VOL. 127; NO 2; PP. 365-369; BIBL. 45 REF.Article

CHARACTERIZATION OF DEFECT GROWTH STRUCTURES IN IMPLATED FILMS BY SCANNING ELECTRON MICROSCOPY = CARACTERISATION PAR MICROSCOPIE ELECTRONIQUE A BALAYAGE DES STRUCTURES DE CROISSANCE DE DEFAUTS DANS DES COUCHES MINCES PLAQUEES PAR IONSSPALVINS T.1979; THIN SOLID FILMS; ISSN 0040-6090; CHE; DA. 1979; VOL. 64; NO 1; PP. 143-148; BIBL. 9 REF.Conference Paper

COPPER AND SILVER ELECTROPLATING ON ALUMINUM TUBE ENDS = DEPOTS ELECTROLYTIQUES DE CU ET AG SUR TUBES D'ALGHOUSE M; DURGA PRASAD KA; KRISHNAMOORTHY PR et al.1983; PLATING AND SURFACE FINISHING; ISSN 0360-3164; USA; DA. 1983; VOL. 70; NO 5; PP. 100-101Article

ELECTROLERS COPPER COATING IMPROVMENT OF DIELECTRIC MATERIALS BY A MATHEMATICAL PLANIFICATION OF THE EXPERIMENTAL STUDYKOROVIN NV; GODRINA LS; IPPOLITOV VM et al.1982; Z. PRIKL. HIM.; ISSN 0044-4618; SUN; DA. 1982; VOL. 55; NO 6; PP. 1319-1322; BIBL. 6 REF.Article

USE OF ACID COPPER FOR ELECTROPLATING PLASTIC = UTILISATION DE BAINS DE CUIVRAGE ACIDES POUR LE REVETEMENT ELECTROLYTIQUE DE MATIERES PLASTIQUESCOMBS DJ.1981; PLAT. SURF. FINISH.; ISSN 0360-3164; USA; DA. 1981; VOL. 68; NO 7; PP. 58-61; BIBL. 7 REF.Article

ELIMINATION OF THE ACTIVE CENTERS OF A PYROGRAPHITE ELECTRODE DURING ELECTRODEPOSITION OF CUTROFIMENKO VV; ZHITNIK VN; LOSHKAREV YU M et al.1981; ELEKTROHIMIJA; ISSN 0424-8570; SUN; DA. 1981; VOL. 17; NO 11; PP. 1644-1651; BIBL. 15 REF.Article

ENHANCEMENT OF ADHESION IN CU FILMS USING ION PLATING PROCESS AND CONTRIBUTION OF ION BOMBARDMENTTSUNASAWA E; YAMANAKA K.1981; KINZOKU HYOMEN GIFUTSU; ISSN 0026-0614; JPN; DA. 1981; VOL. 32; NO 4; PP. 172-177; ABS. ENG; BIBL. 8 REF.Article

STRUCTURE AND PROPERTIES OF CU COATINGS OBTAINE IN H₂SO₄ SOLUTIONS WITH TRIAZOLE AND ACRYLAMIDEGAMBURG YU D; LIKHOSHERSTOVA LI; TROFIMENKO VV et al.1981; ELEKTROHIMIJA; ISSN 0424-8570; SUN; DA. 1981; VOL. 17; NO 10; PP. 1491-1494; BIBL. 11 REF.Article

A CORRELATION BETWEEN MACHINING PARAMETERS AND MACHINABILITY IN EDMBHATTACHARRYA SK; EL MENSHAWY MF; GARBER S et al.1981; INT. J. PROD. RES.; ISSN 0020-7543; GBR; DA. 1981; VOL. 19; NO 2; PP. 111-122; ABS. FRE/GER; BIBL. 7 REF.Article