NICKEL DIFFUSION ALONG ISOLATED INTERPHASE BOUNDARIESBOKSHTEJN BS; VIDENSKIJ IV; KLINGER LM et al.1982; IZVESTIJA VYSSIH UCEBNYH ZAVEDENIJ. CERNAJA METALLURGIJA; ISSN 0368-0797; SUN; DA. 1982; NO 9; PP. 13-14; BIBL. 5 REF.Article

THE INFLUENCE OF THE ANION ON COPPER ELECTROCRYSTALLIZATION = EFFET DE L'ANION SUR L'ELECTROCRISTALLISATION DU CUCARNEVAL G; BEBCZUK DE CUSMINSKY J.1981; J. ELECTROCHEM. SOC.; ISSN 0013-4651; USA; DA. 1981; VOL. 128; NO 6; PP. 1215-1221; BIBL. 28 REF.Article

BACK SCATTERING OF 4-30 KEV ELECTRONS FROM THE AL-CU-AL SYSTEMKORNYUSHKIN YU D; MUZIL' NA; TRUNEV VV et al.1981; ZH. TEKH. FIZ.; SUN; DA. 1981-05; VOL. 51; NO 5; PP. 1036-1038; BIBL. 5 REF.Article

A STUDY OF INTERDIFFUSION IN MULTILAYER CU/NI FILMS BY AUGER ELECTRON DEPTH PROFILING = ETUDE DE L'INTERDIFFUSION DANS LES COUCHES MULTIPLES CU/NI PAR PROFIL DE PROFONDEUR D'ELECTRONS AUGERROLL K; REILL W.1982; THIN SOLID FILMS; ISSN 0040-6090; CHE; DA. 1982; VOL. 82; NO 2; PP. 221-224; BIBL. 11 REF.Conference Paper

PROTECTION OF FOOD INDUSTRY MATERIALS DURING STEEL-COPPER CONTACTMAJKO LP; PROKOP'EV IA; CHIRSHUKOV ES et al.1980; KHIM. TEKHNOL. TOPL. MASEL; SUN; DA. 1980; NO 6; PP. 43-44; BIBL. 3 REF.Article

MODEL EXPERIMENTS FOR GROWTH OF INTERMEDIATE PHASE LAYERS FORMED SUCCESSIVELY IN BINARY DIFFUSION COUPLESWAKAMATSU Y; TAKAAZE F; ONISHI M et al.1980; NIPPON KINZOKU GAKKAISHI (1952); ISSN 0021-4876; JPN; DA. 1980; VOL. 44; NO 2; PP. 144-151; ABS. ENG; BIBL. 14 REF.Article

EFFECT OF TRANSVERSE RESISTANCE OF MULTIFIBER SUPERCONDUCTING WIRE ON ITS CURRENT-VOLTAGE CHARACTERISTICSDOROFEEV GL; KLIMENKO E YU.1979; DOKL. AKAD. NAUK SSSR; SUN; DA. 1979-10; VOL. 248; NO 1; PP. 97-101; BIBL. 9 REF.Article

MAGNETIC INTERACTION BETWEEN ION-IMPLANTED LIQUID PHASE EPITAXIALLY GROWN MAGNETIC GARNET FILMS AND PATTERNED THIN METALLIC FILMS = INTERACTION MAGNETIQUE ENTRE DES COUCHES MINCES DE GRENAT MAGNETIQUE PREPAREES PAR CROISSANCE EPITAXIQUE ET AYANT SUBI UNE IMPLANTATION IONIQUE EN PHASE LIQUIDE ET DES COUCHES MINCES METALLIQUES PREPAREES SELON UN MODELE DE METALLISATIONGILL HS.1981; J. APPL. PHYS.; ISSN 0021-8979; USA; DA. 1981; VOL. 52; NO 1; PP. 369-372; BIBL. 8 REF.Article

TRANSMISSION ELECTRON MICROSCOPE STUDY OF THIN CU-NI LAMINATES OBTAINED BY VAPOR DEPOSITION = ETUDE PAR MICROSCOPIE ELECTRONIQUE EN TRANSMISSION DE FINES LAMELLES DE CU-NI PREPAREES PAR DEPOT EN PHASE VAPEURNAKAHARA S; SCHUTZ RJ; TESTARD LR et al.1980; THIN SOLID FILMS; ISSN 0040-6090; CHE; DA. 1980; VOL. 72; NO 2; PP. 277-284; BIBL. 10 REF.Conference Paper

EXPLOSIVE WELDING TUBES INTO CLADDED TUBE PLATES = LE SOUDAGE PAR EXPLOSION DE TUBES SUR PLAQUES TUBULAIRES PLAQUEESWILLIAMS PEG.1978; ADVANCES IN WELDING PROCESSES. INTERNATIONAL CONFERENCE. 4/1978/HARROGATE; GBR; ABINGTON, CAMBRIDGE: WELD. INST.; DA. 1978; PP. 49-64; BIBL. 7 REF.; LOC. ISConference Paper

HYDROGEN DIFFUSION THROUGH THE TWO-PHASE METAL LAYER OF ELECTRODEPOSITS (PD AND CU)/NI FOIL COMPOSITESSAKAMOTO Y; NAKAMICHI Y.1981; J. JAP. INST. MET.; JPN; DA. 1981-09; VOL. 45; NO 9; PP. 927-934; BIBL. 28 REF.Article

ULTRASONIC WAVE EFFECT ON RECIPROCAL DIFFUSION IN CU-ZN SYSTEMKULEMIN AV; SHCHERBEDINSKIJ GV; BORISOV VI et al.1981; METALLOFIZIKA (KIEV); ISSN 0368-9662; UKR; DA. 1981; VOL. 3; NO 6; PP. 96-100; BIBL. 5 REF.Article

MICROSTRUCTURAL ANALYSIS OF KOVAR/MOLYBDENUM AND COPPER/MOLYBDENUM INTERDIFFUSION = ANALYSE PAR LA MICROSTRUCTURE DE L'INTERDIFFUSION KOVAR/MOLYBDENE ET CUIVRE/MOLYBDENEKELLY MD; BREAKALL KL JR; ROESCH DL et al.1982; MICROSTRUCTURAL SCIENCE; ISSN 511552; NLD; DA. 1982; VOL. 10; PP. 59-65Conference Paper

SUPERCONDUCTIVITY OF NB/CU SUPERLATTICES = SUPRACONDUCTIVITE DES SURSTRUCTURES NB/CUINDRAJIT BANERJEE; YANG QS; FALCO CM et al.1982; SOLID STATE COMMUNICATIONS; ISSN 0038-1098; USA; DA. 1982; VOL. 41; NO 11; PP. 805-808; BIBL. 20 REF.Article

DIFFUSION PERMEABILITY OF ISOLATED INTERFACES IN COPPER-MOLYBDENUM SYSTEMBOKSHTEJN BS; VIDENSKIJ IV; KLINGER LM et al.1982; METALLOFIZIKA (KIEV); ISSN 0368-9662; UKR; DA. 1982; VOL. 4; NO 3; PP. 109-110; BIBL. 12 REF.Article

AMBIENT-INDUCED DIFFUSION IN METAL FILM/HALIDE SYSTEMS = DIFFUSION INDUITE A L'AMBIANTE DANS LES SYSTEMES COUCHE METALLIQUE/HALOGENURESIMANOVSKY AA; STOLYAROVA SV; UPIT GP et al.1982; THIN SOLID FILMS; ISSN 0040-6090; CHE; DA. 1982; VOL. 97; NO 4; PP. 301-311; BIBL. 17 REF.Article

INVESTIGATION OF INTERFACIAL REACTIONS IN THIN FILM COUPLES OF ALUMINUM AND COPPER BY MEASUREMENT OF LOW TEMPERATURE CONTACT RESISTANCE = ETUDE DES REACTIONS AUX INTERFACES DANS LES COUPLES DE COUCHES MINCES AL ET CU PAR MESURE DE LA RESISTANCE DE CONTACT A BASSE TEMPERATURERAYNE JA; SHEARER MP; BAUER CL et al.1980; THIN SOLID FILMS; ISSN 0040-6090; CHE; DA. 1980; VOL. 65; NO 3; PP. 381-391; BIBL. 18 REF.Article

RAPID AND ACCURATE MEASUREMENT OF THE THICKNESS OF THIN FILMS BY AN X-RAY FLUORESCENCE TECHNIQUE USING A NEW BACKGROUND SUBTRACTION METHOD = MESURE RAPIDE ET PRECISE DE L'EPAISSEUR DES COUCHES MINCES PAR UNE TECHNIQUE DE FLUORESCENCE X EMPLOYANT UNE METHODE NOUVELLE DE SOUSTRACTION DU FOND CONTINUCIRONE R; GIGANTE GE; GUALTIERI G et al.1982; THIN SOLID FILMS; ISSN 0040-6090; CHE; DA. 1982; VOL. 88; NO 1; PP. 81-85; BIBL. 6 REF.Article

INTERDIFFUSION AND KIRKENDALL EFFECT IN CU-SB ALLOYS = INTERDIFFUSION ET EFFET KIRKENDALL DANS LES ALLIAGES CU-SBHOSHINO K; IIJIMA Y; HIRANO KI et al.1981; TRANS. JPN. INST. MET.; ISSN 0021-4434; JPN; DA. 1981; VOL. 22; NO 8; PP. 527-534; BIBL. 25 REF.Article

INTERDIFFUSION OF THIN BILAYERS OF COPPER AND NICKEL = INTERDIFFUSION DE BICOUCHES MINCES DE CUIVRE ET DE NICKELSUNI I; NICOLET MA; MAEENPAEA M et al.1981; THIN SOLID FILMS; ISSN 0040-6090; CHE; DA. 1981; VOL. 79; NO 1; PP. 69-73; BIBL. 9 REF.Article

MARKER DISPLACEMENTS AS A RESULT OF DIFFUSION IN BINARY METAL SYSTEMS = DEPLACEMENTS DE MARQUEUR RESULTANT DE LA DIFFUSION DANS DES SYSTEMES METALLIQUES BINAIRESVAN LOO FJJ; GASTIN GF; RIECK GD et al.1979; SCI. OF SINTERG; YUG; DA. 1979; VOL. 11; NO SPEC.; PP. 9-26; BIBL. 10 REF.Article

FORMATION OF INTERMETALLICS AND GRAIN BOUNDARY DIFFUSION IN CU-AL AND AU-AL THIN FILM COUPLES = FORMATION DE COMPOSES INTERMETALLIQUES ET DIFFUSION AUX JOINTS DE GRAINS DANS LES COUPLES DE COUCHES MINCES CU-AL ET AU-ALVANDENBERG JM; DEN BROEDER FJA; HAMM RA et al.1982; THIN SOLID FILMS; ISSN 0040-6090; CHE; DA. 1982; VOL. 93; NO 3-4; PP. 277-280; BIBL. 16 REF.Conference Paper

INITIAL EPITAXIAL GROWTH OF (111) AU/(111) CU AND (111) CU/(111) AU = CROISSANCE EPITAXIQUE INITIALE DE AU(111)/CU (111) ET CU(111)/AU(111)MACUR JE; VOOK RW.1980; THIN SOLID FILMS; ISSN 0040-6090; CHE; DA. 1980; VOL. 66; NO 3; PP. 371-379; BIBL. 18 REF.Article

A TECHNIQUE FOR INVESTIGATING THE PROPERTIES OF SURFACES, THIN FILMS, AND INTERFACES BY MEANS OF A MECHANICAL MARGINAL OSCILLATOR = UNE TECHNIQUE POUR L'ETUDE DES PROPRIETES DES SURFACES, DES COUCHES MINCES ET DES INTERFACES AU MOYEN D'UN OSCILLATEUR MARGINAL MECANIQUEMILLER GL; SONI M; FENSTERMACHER RL et al.1982; J. APPL. PHYS.; ISSN 0021-8979; USA; DA. 1982; VOL. 53; NO 2; PP. 979-983; BIBL. 12 REF.Article

LOW TEMPERATURE COMPOUND FORMATION IN CU/SN THIN FILM COUPLES = FORMATION DE COMPOSE AUX BASSES TEMPERATURES DANS LES COUPLES DE COUCHES MINCES CU/SNCHOPRA R; OHRING M; OSWALD RS et al.1982; THIN SOLID FILMS; ISSN 0040-6090; CHE; DA. 1982; VOL. 94; NO 4; PP. 279-288; BIBL. 14 REF.Article