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INFLUENCE OF EVAPORATION-DEPOSITION GEOMETRY ON CONDUCTIVE THIN FILMS = INFLUENCE DE LA GEOMETRIE DU DEPOT PAR EVAPORATION SUR LES COUCHES MINCES CONDUCTRICESGRIESSING J.1980; ELECTROCOMPON. SCI. TECHNOL.; ISSN 0305-3091; GBR; DA. 1980; VOL. 7; NO 1-3; PP. 171-179; BIBL. 11 REF.Article

CHARACTERIZATION OF THERMAL COMPRESSION WIRE BONDS TO THICK-FILM CONDUCTORS ON PORCELAIN SUBSTRATES = CARACTERISATION DES SOUDURES PAR PRESSION A CHAUD DE FILS SUR CONDUCTEURS EN COUCHE EPAISSE SUR UN SUPPORT EN PORCELAINEJOHNSON RW; WILSON LK; KINSER DL et al.1979; I.E.E.E. TRANS. COMPN. HYBR. MANUFG TECHNOL.; USA; DA. 1979; VOL. 2; NO 3; PP. 288-293; BIBL. 7 REF.Article

RELIABILITY OF CLIP-ON TERMINALS SOLDERED TO TA-TA2N-NICR-PD-AU THIN FILMS = FIABILITE DES COSSES DE CONNEXION BRASEES PAR BRASAGE TENDRE SUR DES COUCHES MINCES TA-TA2N-NICR-PD-AUKELLER HN.1979; I.E.E.E. TRANS. COMPN. HYBR. MANUFG TECHNOL.; USA; DA. 1979; VOL. 2; NO 3; PP. 294-301; BIBL. 11 REF.Article

CONTACT REACTION BETWEEN SI AND RARE EARTH METALS = REACTION DE CONTACT ENTRE SI ET LES LANTHANIDESTHOMPSON RD; TSAUR BY; TU KN et al.1981; APPL. PHYS. LETT.; ISSN 0003-6951; USA; DA. 1981; VOL. 38; NO 7; PP. 535-537; BIBL. 14 REF.Article

DIFFUSION AND REACTIONS IN GOLD FILMS = DIFFUSION ET REACTIONS DANS LES COUCHES MINCES D'ORPOATE JM.1981; GOLD BULL.; ISSN 0017-1557; ZAF; DA. 1981; VOL. 14; NO 1; PP. 2-11; BIBL. 17 REF.Article

STRUCTURE AND PROPERTY RELATIONSHIPS IN MICROLAMINATE NI-CU AND FE-CU CONDENSATES = RELATION ENTRE STRUCTURE ET PROPRIETES DANS DES DEPOTS EN MICROLAMELLES DE NI-CU ET FE-CUBUNSHAH RF; NIMMAGADDA R; DOERR HJ et al.1980; THIN SOLID FILMS; ISSN 0040-6090; CHE; DA. 1980; VOL. 72; NO 2; PP. 261-275; BIBL. 17 REF.Conference Paper

ADHESIVE CHOICE FOR THE ATTACH IN MICROCIRCUITS: PROPERTIES CHARACTERISATION AND RELIABILITY = CHOIX DE L'ADHESIF POUR LA FIXATION SUR LES MICROCIRCUITS: PROPRIETES ET FIABILITECURABE J.1979; EUROPEAN HYBRID CONFERENCE. 2/1978/CR HENT; NLD; PYNACKER: DUTCH EFFICIENCY BUREAU; DA. 1979; PP. 433-440Conference Paper

DIAMOND-TIPPED AND OTHER NEW THERMODES FOR DEVICE BONDING = OUTILS CHAUFFANTS A POINTE DE DIAMANT ET NOUVEAUX OUTILS DE SOUDAGEKERSHNER RC; PANOUSIS NT.1979; I.E.E.E. TRANS. COMPN. HYBR. MANUFG TECHNOL.; USA; DA. 1979; VOL. 2; NO 3; PP. 283-288; BIBL. 4 REF.Article

AGING OF SOLDER CONNECTIONS TO TI-PD-AU FILMS = VIEILLISSEMENT DES CONNEXIONS BRASEES PAR BRASAGE TENDRE SUR COUCHES MINCES D'ALLIAGE TI-PD-AUHALL PM; CONDRA LW.1979; I.E.E.E. TRANS. COMPN. HYBR. MANUFG TECHNOL.; USA; DA. 1979; VOL. 2; NO 3; PP. 279-283; BIBL. 8 REF.Article

CATHODIC DEPOSITION OF A TRIVALENT CHROMIUM FILM AS A BONDING INTERFACE BETWEEN COPPER AND POLYETHYLENE = DEPOSITION CATHODIQUE D'UN FILM DE CR3+ COMME AGENT DE LIAISON ENTRE CU ET LE POLYETHYLENESIMCHOCK F; RAMACHANDRAN K; HAYNES R et al.1980; J. ELECTROCHEM. SOC.; ISSN 0013-4651; USA; DA. 1980; VOL. 127; NO 4; PP. 879-881; BIBL. 4 REF.Article

INFLUENCE DE LA VALEUR DU PH, DE LA TENEUR EN O2 ET DE LA VITESSE D'ECOULEMENT D'EAU POTABLE FROIDE SUR LE COMPORTEMENT A LA CORROSION DE TUBES EN ACIER GALVANISE = EFFECT OF THE PH VALUE, OF THE OXIGEN CONTENT AND OF THE FLOW RATE OF COLD DRINKING WATER UPON CORROSION OF GALVANISED STEEL PIPESRUECKERT J.1979; TRIB. CEBEDEAU; ISSN 0577-1056; BEL; DA. 1979; VOL. 32; NO 427-428; PP. 221-234; BIBL. 8 REF.Article

ULTRASONIC BALL/WEDGE BONDING OF ALUMINIUM WIRES = LE SOUDAGE PAR ULTRASONS DE FILS EN ALUMINIUM PAR SPHERE ET PAR BOUT EN BISEAUDAWES CJ; JOHNSON KI; SCOTT MH et al.1980; ELECTROCOMPON. SCI. TECHNO..; ISSN 0305-3091; GBR; DA. 1980; VOL. 7; NO 1-3; PP. 119-124; BIBL. 4 REF.Article

BTAB'S FUTURE: AN OPTIMISTIC PROGNOSIS = L'AVENIR DU BTAB: DES PREVISIONS OPTIMISTESUNGER RF; KANZ JW.1980; SOLID STATE TECHNOL.; USA; DA. 1980; VOL. 23; NO 3; PP. 77-83; BIBL. 14 REF.Article

EXPERIMENTS ON FRACTURE BEHAVIOR OF SINGLE FIBER-BRITTLE ZONE MODEL COMPOSITES = EXPERIENCES SUR LA RUPTURE D'UN MODELE DE LA ZONE FRAGILE D'UN COMPOSITE RENFORCE PAR UNE FIBRE UNIQUEOCHIAI S; URAKAWA S; AMEYAMA K et al.1980; METALL. TRANS. A; ISSN 0360-2133; USA; DA. 1980; VOL. 11; NO 3; PP. 525-530; BIBL. 14 REF.Article

CALCULATION OF THERMAL DEFORMATIONS IN THIN LAYERS LASER MACHININGVEJKO VP; KRUTENKOVA EA; KOTOV GA et al.1980; FIZ. HIM., OBRAB. MATER.; ISSN 0015-3214; SUN; DA. 1980; NO 5; PP. 37-43; BIBL. 7 REF.Article

EFFECTS OF OVERHEATING OF PARTICULES SPORAYED AND OF THE OXIDE LAYER ON THE METALLIC SUBSTRATE ON THE THERMAL BEHAVIOUR BETWEEN POWDER AND SUBSTRATE IN THE HOT SPRAYINGKALININ GM; KUDINOV VV; IVANOV VM et al.1979; FIZ. KHIM., OBRAB. MATER.; ISSN 0015-3214; SUN; DA. 1979; NO 6; PP. 44-47; BIBL. 4 REF.Article

MEASUREMENT OF THE THICKNESS OF NI AND CU PLATINGS WITH THE THEORICAL X-RAY INTENSITIEMIZUTANI Y; ABE T.1981; KINZOKU HYOMEN GIJUTSU; ISSN 0026-0614; JPN; DA. 1981; VOL. 32; NO 8; PP. 396-402; ABS. ENG; BIBL. 11 REF.Article

ULTRASONIC TESTING OF THICKNESS OF HARDENED LAYERS AND SHIELDING COATINGSTROITSKIJ IV.1981; DEFEKTOSKOPIJA; ISSN 0130-3082; SUN; DA. 1981; NO 12; PP. 91-93; BIBL. 3 REF.Article

GARANTIC DE LA BRASABILITE DES COMPOSANTS ELECTRONIQUES DANS LES APPLICATIONS SPATIALES = ENSURING SOLDERABILITY IN ELECTRONIC COMPONENTS FOR SPACE APPLICATIONSDHAUSSY; FOUQUET; BILLOT et al.1981; ETAIN US.; ISSN 0014-1631; GBR; DA. 1981; NO 129; PP. 1-3; LOC. ISArticle

CLAD MATERIALS FOR FUSION APPLICATIONS = MATERIAUX PLAQUES POUR LES EQUIPEMENTS DE LA FUSION NUCLEAIREKAMINSKY M.1980; THIN SOLID FILMS; ISSN 0040-6090; CHE; DA. 1980; VOL. 73; NO 1; PP. 117-132; BIBL. 32 REF.Article

THE INTEGRATED SUBSTRATE PACKAGE: AN ECONOMIC APPROACH TO HERMETIC HYBRID PACKAGE = LE BOITIER INTEGRE AU SUBSTRAT: UNE APPROCHE ECONOMIQUE DES BOITIERS ECONOMIQUES POUR CIRCUITS HYBRIDESSERGENT JE; PETERSE ME.1979; EUROPEAN HYBRID MICROELECTRONICS CONFERENCE. 2/1978/CR HENT; NLD; PYNACKER: DUTCH EFFICIENCY BUREAU; DA. 1979; PP. 485-497Conference Paper

AN X-RAY STUDY OF DIFFUSION IN THE CU-AU SYSTEM = ETUDE PAR DIFFRACTION DE RX, DE LA DIFFUSION DANS LE SYSTEME CU-AUUNHAM J; TENNEY DR; HOUSKA CR et al.1981; METALL. TRANS. A; ISSN 0360-2133; USA; DA. 1981; VOL. 12; NO 6; PP. 1147-1150; BIBL. 22 REF.Article

MUTUAL DIFFUSION INTERMETALLIC COMPOUND FORMATION CHARACTERISTICS IN BRITTLE MATRIX (AL-SB SYSTEM)PARITSKAYA LN; BOGDANOV VV.1981; FIZ. MET. METALLOVED.; ISSN 0015-3230; SUN; DA. 1981; VOL. 51; NO 2; PP. 376-384; BIBL. 7 REF.Article

AN ELECTROCHEMICAL INVESTIGATION OF CORROSIVE WEAR OF AS-PLATED AND HEAT-TREATED NICKEL AND NI-SIC COATINGS = ETUDE ELECTROCHIMIQUE DE L'USURE AVEC CORROSION DE REVETEMENTS DE NICKEL ET DE NI-SIC BRUTS DE DEPOTS ET TRAITESWAGNER E; BROSZEIT E.1979; WEAR; NLD; DA. 1979; VOL. 55; NO 2; PP. 235-244; BIBL. 7 REF.Article

DIFFUSION BONDING OF PLATINUM TITANIUM ANODES = SOUDAGE PAR DIFFUSION D'ANODES PLATINE-TITANEREZKII YA; PETROV GL; SHAPOVALOV GD et al.1981; WELDG PRODUCT.; ISSN 0043-230X; GBR; DA. 1981; VOL. 28; NO 8; PP. 15-17; BIBL. 2 REF.; DE RUS; LOC. IS;[SVAR PROIZVOD; SUN; DA. 1981; NO 8; PP. 15-16]Article

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