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Results 1 to 25 of 41093

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ELEMENTS DE CIRCUITS DE MICROELECTRONIQUEMEJNDL D.1979; USP. FIZ. NAUK; SUN; DA. 1979; VOL. 127; NO 2; PP. 297-317; BIBL. 4 REF.Article

INTERNATIONAL MICROELECTRONIC SYMPOSIUM; BOSTON, MASS.; 1974.1974; MONTGOMERY, ALA.; INT. SOC. HYBRID MICROELECTRON.; DA. 1974; PP. (496P.); BIBL. DISSEM.Conference Paper

STREIFLICHTER VON DER ELECTRONICA 1972 = APERCU SUR LA FOIRE D'ELECTRONIQUE DE MUNICH EN 19721973; GALVANOTECHNIK; DTSCH.; DA. 1973; VOL. 64; NO 1; PP. 35-46; ABS. ANGL. FR.; BIBL. 50 REF.Serial Issue

LASER BEAM TECHNOLOGY FOR THE MICROELECTRONICS INDUSTRYWHITEHOUSE DR; ILGENFRITZ RW.1972; SOLID STATE TECHNOL.; U.S.A.; DA. 1972; VOL. 15; NO 7; PP. 32-35; BIBL. 2 REF.Serial Issue

ELEKTRONIKTECHNOLOGIE UND MIKROELECTRONIK-WESENTLICHE FAKTOREN DES WISSENSCHAFTLICHTECHNISCHEN FORTSCHRITTS. VI: WISSENSCHAFTLICHE KONFERENZ DER INGENIEURHOCHSCHULE MITTWEIDA VOM 8. BIS 10. SEPTEMBER 1982 = LA TECHNOLOGIE ELECTRONIQUE ET LA MICROELECTRONIQUE, FACTEURS ESSENTIELS DU PROGRES SCIENTIFIQUE ET TECHNIQUE. 6EME CONFERENCE SCIENTIFIQUE DE L'ECOLE D'INGENIEURS DE MITTWEIDA, DU 8 AU 10 SEPTEMBRE 1982ZSCHERPE G.1982; NACHRICHTENTECHNIK. ELEKTRONIK; ISSN 0323-4657; DDR; DA. 1982; VOL. 32; NO 8; PP. 312Article

SYMPOSIUM ON ELECTRON, ION AND PHOTON BEAM TECHNOLOGY. 13. PROCEEDINGS; COLORADO SPRINGS; 1975.1975; J. VACUUM SCI. TECHNOL.; U.S.A.; DA. 1975; VOL. 12; NO 6; PP. (335P.); BIBL. DISSEM.Conference Paper

LASER TRIMMING TECHNIQUES1973; IN: 23RD ELECTRON. COMPONENTS CONF. PROC.; WASHINGTON, D.C.; 1973; NEW YORK; INST. ELECTR. ELECTRON. ENG.; DA. 1973; PP. 38-62; BIBL. DISSEM.Conference Proceedings

MICROCIRCUIT PRODUCTION EQUIPMENT. SPECIAL SECTION: A BUYER'S GUIDE TO MANUFACTURERS AND SUPPLIERS1972; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1972; VOL. 12; NO 10; PP. 83-135 (34 P.)Serial Issue

RELIABILITY ENGINEERING IN MICROELECTRONICSJOWETT CE.1978; MICROELECTRON. AND RELIABIL.; GBR; DA. 1978; VOL. 17; NO 5; PP. 505-512Article

NEW ROLE IN IC MANUFACTURE.1975; LASER FOCUS; U.S.A.; DA. 1975; VOL. 11; NO 2; PP. 34-35Article

MICROFABRICATION USING LASER-BEAM INTERFEROMETRIC TECHNIQUE COUPLED WITH SIMULTANEOUS EXPOSURE AND DEVELOPMENT METHOD.WON TIEN TSANG; SHYH WANG.1975; J. VACUUM SCI. TECHNOL.; U.S.A.; DA. 1975; VOL. 12; NO 6; PP. 1336-1339; BIBL. 8 REF.; (SYMP. ELECTRON ION PHOTON BEAM TECHNOL. 13. PROC.; COLORADO SPRINGS; 1975)Conference Paper

MICROELECTRONICS TECHNOLOGY1972; IN: 1972 INTER. MICROELECTRON. SYMP.; WASHINGTON, D.C.; 1972; PARK RIDGE; INTER. SOC. HYBRID MICROELECTRON.; DA. 1972; PP. (39 P.); BIBL. DISSEM.Conference Paper

STATIC ELECTRICITY CAN CAUSE BIPOLAR IC FAILURESROSE SE.1971; EVAL. ENGNG; U.S.A.; DA. 1971; VOL. 10; NO 3; PP. 21-24; BIBL. 3 REF.Serial Issue

LASER SCRIBING AND DRILLING OF CERAMIC SUBSTRATES.BELLAND R.1975; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1975; VOL. 15; NO 1; PP. 56-58Article

CARACTERISTIQUES DES COMPOSANTS ELEMENTAIRES.GASCHI J.1974; PARIS; TECH. ING.; DA. 1974; VOL. H 760; PP. 1-7; (TRAITE PRAT. INF. H 15)Miscellaneous

LASER USE SUCCESSFULLY SIMPLIFIES MANUFACTURING PROCESSES.OKAMOTO E.1973; JAP. ELECTRON. ENGNG; JAP.; DA. 1973; NO 83; PP. 56-58Article

ELECTRON, ION AND LASER BEAM TECHNOLOGY: ANALYSIS1971; IN: 11TH SYMP. ELECTRON ION TECHNOL. BOULDER, COLO, 1971. REC.; SAN FRANCISCO; SAN FRANCISCO PRESS; DA. 1971; PP. 77-140; BIBL. DISSEM.Conference Proceedings

FILIERE TECHNOLOGIQUE POUR COMPOSANTS HYPERFREQUENCES MICROMINIATURISES EN BOITIERS DE SERIES DU TYPE TO ET "FLAT-PACK" INTEGRALESCHARLET Y.1981; ; FRA; DA. 1981; DGRST/78 7 3052; 64 P.; 30 CM; ACTION CONCERTEE: FILIERES TECHNOLOGIQUES POUR COMPOSANTSReport

LASER TRIMMER BRANCHES OUT.SCHMIDLING J.1975; ELECTRO-OPT. SYST. DESIGN; U.S.A.; DA. 1975; VOL. 7; NO 7; PP. 54-55Article

INTERNATIONAL ELECTRONIC PACKAGING & PRODUCTION CONFERENCE. BRIGHTON, ENGLAND, 19-21 OCTOBER 1971. PROCEEDINGS OF THE TECHNICAL PROGRAMME1971; CHICAGO; IND. SCI. CONF. MANAGE.; DA. 1971; PP. 1-374; BIBL. DISSEM.Conference Proceedings

6TH INTERNATIONAL CONGRESS MICROELECTRONICS; MUENCHEN; 1974.sd; S.L.; DA. S.D.; PP. (246P.); H.T. 100; BIBL. DISSEM.Conference Paper

LES TECHNOLOGIES ET LEUR MISE EN OEUVRELAVIRON E.1980; ANN. MINES; FRA; DA. 1980; VOL. 186; NO 3; PP. 9-20Article

VARIANTE DE LA METHODE DE PROJECTION POUR TRAITEMENT LASER DES COUCHES MINCESANISIMOVA RN; KAMENSKIJ AG; LEVINSON GR et al.1976; PRIBORY TEKH. EKSPER.; S.S.S.R.; DA. 1976; NO 1; PP. 225-226; BIBL. 6 REF.Article

LEAD FORMING AND OUTER LEAD BOND PATTERN DESIGN FOR TAPE-BONDED HYBRIDSRODRIGUES DE MIRANDA WR; OSWALD RG; BROWN D et al.1978; I.E.E.E. TRANS. COMPON. HYBR. MANUFG TECHNOL.; USA; DA. 1978; VOL. 1; NO 4; PP. 377-383; BIBL. 8 REF.Article

OPTIMIZING LASER TRIMMING THROUGH PUT REDUCING TRIM CYCLE BOOTS PRODUCTIONSHIBUT D; CONRADT R; ANTONI B et al.1978; CIRCUITS MANUF.; USA; DA. 1978; VOL. 18; NO 10; PP. 30-32; (2 P.)Article

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