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THE PCB AS A COMPONENT: REEVALUATING THE PRINTED CIRCUIT BOARDMICHEL TJ.1979; CIRCUITS MANUF.; USA; DA. 1979; VOL. 19; NO 2; PP. 34-39; (4 P.)Article

PORCELAIN-ON-STEEL BOARDS CAN LAUNCH A THOUSAND CHIPSSPECTOR M.1979; ELECTRONICS; USA; DA. 1979; VOL. 52; NO 6; PP. 125-128Article

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HEAT TREATING ELECTRO-DEPOSITED COPPER FOILS IMPROVES SOLDER SHOCK DUCTILITYMATHER JC.1978; CIRCUITS MANUF.; USA; DA. 1978; VOL. 18; NO 11; PP. 17Article

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CONDUCTORS FOR MULTILAYER CERAMIC CIRCUIT BOARDSYOKOYAMA H; NIWA K; MURAKAWA K et al.1980; FUJITSU KCI. TECH. J.; ISSN 0016-2523; JPN; DA. 1980; VOL. 16; NO 3; PP. 135-150; BIBL. 6 REF.Article

MULTILAYER THIN FILM DISTRIBUTED BANDPASS FILTERAHMAD S; SINGH R.1982; THIN SOLID FILMS; ISSN 0040-6090; CHE; DA. 1982; VOL. 87; NO 1; PP. 79-86; BIBL. 7 REF.Article

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INDEFINITE IMMITANCE MATRICES OF A FIVE-LAYER CIRCULAR GEOMETRY THIN-FILM INTEGRATED STRUCTUREKHAN MJR.1980; MICROELECTRON. RELIAB.; ISSN 0026-2714; GBR; DA. 1980; VOL. 20; NO 4; PP. 501-504; BIBL. 7 REF.Article

DOUBLE-LEVEL METALLURGY DEFECT STUDYGREGORITSCH AJ JR.1979; IEEE TRANS. ELECTRON. DEVICES; USA; DA. 1979; VOL. 26; NO 1; PP. 34-37; BIBL. 1 REF.Article

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