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Exploring CMP solutions to planarity challenges with tungsten plugsMENDONCA, J; MURELLA, K; KIM, I et al.Thin solid films. 1998, Vol 320, Num 1, pp 103-109, issn 0040-6090Conference Paper

Copper post-CMP cleaning process on a dry-in/dry-out toolBASAK, S; GRIEF, M; GUPTA, A et al.SPIE proceedings series. 1998, pp 155-159, isbn 0-8194-2967-8Conference Paper

Method for measuring feature-scale planarization in copper chemical mechanical polishing processingLAURSEN, T; RUNNELS, S. R; BASAK, S et al.Journal of the Electrochemical Society. 2003, Vol 150, Num 4, pp G279-G283, issn 0013-4651Article

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