au.\*:("MURELLA, K")
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Exploring CMP solutions to planarity challenges with tungsten plugsMENDONCA, J; MURELLA, K; KIM, I et al.Thin solid films. 1998, Vol 320, Num 1, pp 103-109, issn 0040-6090Conference Paper
Method for measuring feature-scale planarization in copper chemical mechanical polishing processingLAURSEN, T; RUNNELS, S. R; BASAK, S et al.Journal of the Electrochemical Society. 2003, Vol 150, Num 4, pp G279-G283, issn 0013-4651Article
