Ultrasonic flexural vibration assisted chemical mechanical polishing for sapphire substrateWENHU XU; XINCHUN LU; GUOSHUN PAN et al.Applied surface science. 2010, Vol 256, Num 12, pp 3936-3940, issn 0169-4332, 5 p.Article

Effect of ionic strength on ruthenium CMP in H₂O₂-based slurriesLIANG JIANG; YONGYONG HE; YUZHUO LI et al.Applied surface science. 2014, Vol 317, pp 332-337, issn 0169-4332, 6 p.Article

Influence of slurry components on uniformity in copper chemical mechanical planarizationLEE, Hyunseop; PARK, Boumyoung; JEONG, Haedo et al.Microelectronic engineering. 2008, Vol 85, Num 4, pp 689-696, issn 0167-9317, 8 p.Article

Chemical Mechanical Polishing of Glass Disk Substrates: Preliminary Experimental InvestigationTIAN, Y. B; ANG, Y. J; ZHONG, Z. W et al.Materials and manufacturing processes. 2013, Vol 28, Num 4-6, pp 488-494, issn 1042-6914, 7 p.Article

Chemical mechanical polishing of polycarbonate and poly methyl methacrylate substratesZHONG, Z. W; WANG, Z. F; ZIRAJUTHEEN, B. M. P et al.Microelectronic engineering. 2005, Vol 81, Num 1, pp 117-124, issn 0167-9317, 8 p.Article

Influence of Zn (II) ion on abrasive-free polishing of hard disk substrateHONG LEI; RONG ZHAO; RULING CHEN et al.Thin solid films. 2014, Vol 562, pp 377-382, issn 0040-6090, 6 p.Article

Equivolumetric offsets for 2D machining with constant material removal rateHWAN PYO MOON.Computer aided geometric design. 2008, Vol 25, Num 6, pp 397-410, issn 0167-8396, 14 p.Article

Multiscale material removal modeling of chemical mechanical polishingSEOK, Jongwon; SUKAM, Cyriaque P; KIM, Andrew T et al.Wear. 2003, Vol 254, Num 3-4, pp 307-320, issn 0043-1648, 14 p.Article

Machining Performance and Surface Integrity of AISI D2 Die Steel Machined Using Electrical Discharge Surface Grinding ProcessCHOUDHARY, Rajesh; KUMAR, Harmesh; SINGH, Shankar et al.Journal of materials engineering and performance. 2013, Vol 22, Num 12, pp 3665-3673, issn 1059-9495, 9 p.Article

Effect of additives for higher removal rate in lithium niobate chemical mechanical planarizationJEONG, Sukhoon; LEE, Hyunseop; CHO, Hanchul et al.Applied surface science. 2010, Vol 256, Num 6, pp 1683-1688, issn 0169-4332, 6 p.Article

Comparison of EDG, Diamond Grinding, and EDM Processing of Conductive Alumina Ceramic CompositeSATYARTHI, M. K; PANDEY, Pulak M.Materials and manufacturing processes. 2013, Vol 28, Num 4-6, pp 369-374, issn 1042-6914, 6 p.Article

Modeling and Prediction of Material Removal Rate and Surface Roughness in Surface-Electrical Discharge Diamond Grinding Process of Metal Matrix CompositesSHYAM SUNDER AGRAWAL; YADAVA, Vinod.Materials and manufacturing processes. 2013, Vol 28, Num 4-6, pp 381-389, issn 1042-6914, 9 p.Article

An empirical approach to explain the material removal rate for copper chemical mechanical polishingPAN GUOSHUN; WANG NING; GONG HUA et al.Tribology international. 2012, Vol 47, pp 142-144, issn 0301-679X, 3 p.Article

Effect of process parameters on the performance of EDM process with ultrasonic assisted cryogenically cooled electrodeSRIVASTAVA, Vineet; PANDEY, Pulak M.Journal of manufacturing processes. 2012, Vol 14, Num 3, pp 393-402, issn 1526-6125, 10 p.Article

Process capability study of laser assisted micro milling of a hard-to-machine materialKUMAR, Mukund; MELKOTE, Shreyes N.Journal of manufacturing processes. 2012, Vol 14, Num 1, pp 41-51, issn 1526-6125, 11 p.Article

Polishing of polycrystalline diamond by the technique of dynamic friction, part 4: Establishing the polishing mapCHEN, Y; ZHANG, L. C.International journal of machine tools & manufacture. 2009, Vol 49, Num 3-4, pp 309-314, issn 0890-6955, 6 p.Article

Influence of current impulse on machining characteristics in EDMTSAIL, Y. Y; LU, C. T.Journal of mechanical science and technology. 2007, Vol 21, Num 10, pp 1617-1621, issn 1738-494X, 5 p.Conference Paper

Optimization of design of experiment for chemical mechanical polishing of a 12-inch waferTONGQING WANG; XINCHUN LU; DEWEN ZHAO et al.Microelectronic engineering. 2013, Vol 112, pp 5-9, issn 0167-9317, 5 p.Article

Multi-objective optimization of electric-discharge machining process using controlled elitist NSGA-IIBHARTI, Pushpendra S; MAHESHWARI, S; SHARMA, C et al.Journal of mechanical science and technology. 2012, Vol 26, Num 6, pp 1875-1883, issn 1738-494X, 9 p.Article

Near dry electrical discharge machiningKAO, C. C; JIA TAO; SHIH, Albert J et al.International journal of machine tools & manufacture. 2007, Vol 47, Num 15, pp 2273-2281, issn 0890-6955, 9 p.Article

A strategy for machining interacting features using spatial reasoningPAL, Pralay; TIGGA, A. M; KUMAR, A et al.International journal of machine tools & manufacture. 2005, Vol 45, Num 3, pp 269-278, issn 0890-6955, 10 p.Article

Surface integrity of PCD composites generated by dynamic friction polishing: Effect of processing conditionsCHEN, Y; ZHANG, L. C; TANG, F et al.Diamond and related materials. 2012, Vol 26, pp 25-31, issn 0925-9635, 7 p.Article

Numerical and experimental investigation on multi-zone chemical mechanical planarizationTONGQING WANG; XINCHUN LU.Microelectronic engineering. 2011, Vol 88, Num 11, pp 3327-3332, issn 0167-9317, 6 p.Article

Pulse train data analysis to investigate the effect of machining parameters on the performance of wire electro discharge turning (WEDT) processJANARDHAN, V; SAMUEL, G. L.International journal of machine tools & manufacture. 2010, Vol 50, Num 9, pp 775-788, issn 0890-6955, 14 p.Article

Research on chemo-mechanical grinding of large size quartz glass substrateLIBO ZHOU; SHIINA, Takeshi; ZHONGJUN QIU et al.Precision engineering. 2009, Vol 33, Num 4, pp 499-504, issn 0141-6359, 6 p.Article