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Fast Integrated Die-to-Die Transmitted, Reflected and STARlight-2<^TM> Defect Inspection on Memory MasksLAN, Andy; HSU, Jenny; CHAKRAVARTY, Swapnajit et al.Proceedings of SPIE, the International Society for Optical Engineering. 2008, Vol 7028, pp 70281J.1-70281J.7, issn 0277-786X, isbn 978-0-8194-7243-4 0-8194-7243-3, 2Conference Paper

Special issue on moulds and diesNEE, A. Y. C.Proceedings of the Institution of Mechanical Engineers. Part B. Journal of engineering manufacture. 2002, Vol 216, Num 12, issn 0954-4054, 126 p.Serial Issue

Feed forward test methodology utilizing device identificationCABBIBO, A; CONDER, J; JACOBS, M et al.International Test Conference. 2004, pp 655-660, isbn 0-7803-8580-2, 1Vol, 6 p.Conference Paper

Centres d'usinage: conçus pour les moules et matrices = Machining centers: designed for molds and diesMachines production. 1986, Num 430, pp 37-41, issn 0047-536XArticle

On-die DFT based solutions are sufficient for testing multi-GHz interfaces in manufacturing (and are also key to enabling lower cost ATE platforms)TRIPP, Mike.Proceedings - International Test Conference. 2002, issn 1089-3539, isbn 0-7803-7542-4, p. 1232Conference Paper

A new thermally conductive die attach film with low stress and excellent reliabilityMASUKO, Takashi; HAYASHI, Hiroki; TAKEDA, Shinii et al.SPIE proceedings series. 2001, pp 741-744, isbn 0-8194-4317-4Conference Paper

Increasing the abrasive wear resistance of diesTARAKANCHIKOV, G. A; GROPYANOV, V. M; KADYROV, M et al.Refractories (New York). 1992, Vol 33, Num 5-6, pp 284-289, issn 0034-3102Article

Nosing of thin-walled tubes by circular curved dies = Rétreint de tubes à parois minces par des matrices circulaires incurvéesMANABE, K; NISHIMURA, H.Journal of mechanical working technology. 1984, Vol 10, Num 3, pp 287-298, issn 0378-3804Article

Development of a Novel Methodology for Effective Partial die Inspection and MonitoringLEE, Byoung-Ho; LEE, Tae-Yong; CROSS, Andrew et al.Proceedings of SPIE, the International Society for Optical Engineering. 2009, Vol 7272, issn 0277-786X, isbn 978-0-8194-7525-1 0-8194-7525-4, 72723K.1-72723K.6, 2Conference Paper

Effect of die material in molding equipment on deformation of plastic ceramic mixturesMOSIN, YU. M; KULESHOVA, A. V; CHARIKOVA, O. G et al.Glass and ceramics. 1995, Vol 52, Num 5-6, pp 153-157, issn 0361-7610Article

The use of generalised deformation boundaries for the analysis of asymmetric extrusion through curved dies = L'utilisation de limites de déformation généralisées pour l'analyse du filage asymétrique à travers des matrices courbesYANG, D. Y; HAN, C. H; LEE, B. C et al.International journal of mechanical sciences. 1985, Vol 27, Num 10, pp 653-663, issn 0020-7403Article

New direct-write technology for pad redistribution on individual dieDUIGNAN, Michael T; MATHEWS, Scott A; WELLS, David N et al.SPIE proceedings series. 2001, pp 745-748, isbn 0-8194-4317-4Conference Paper

Schmiedegesenke wirtschaftlich fräsen = Economical milling of forging diesVOLLRATH, Klaus.VDI-Z. 2001, Vol 143, Num AOU, pp 40-42, issn 0042-1766, NSArticle

A numerical method for predicting the temperature distribution in axisymmetric extrusion through flat dies = Une méthode numérique pour prédire la distribution de température dans le filage asymétrique à travers des matrices de formage planesALTAN, B; GEVREK, M; ONURLU, S et al.Journal of mechanical working technology. 1986, Vol 13, Num 2, pp 151-162, issn 0378-3804Article

A note on mathematical models of cup drawing by the Guerin and Marform processes = Une note sur les modèles mathématiques de l'emboutissage de coupelles par les processus Guerin et MarformVENKATESH, V. C; GOH, T. N.Journal of mechanical working technology. 1986, Vol 13, Num 3, pp 273-278, issn 0378-3804Article

Manufacturability and reliability of fine pitch wirebondingAOKI, Toyohiro; SAUTER, Wolfgang; HISADA, Takashi et al.Proceedings - Electronic Components Conference. 2004, issn 0569-5503, isbn 0-7803-8365-6, 2Vol, Vol 1, 372-376Conference Paper

Board level reliability of various stacked die chip scale package configurationsCARSON, Flynn; ZAHN, Bret; MITCHELL, Dianne et al.SPIE proceedings series. 2003, pp 894-899, isbn 0-8194-5189-4, 6 p.Conference Paper

Dealing with diesWHALLEY, G.SPC. Soap, perfumery and cosmetics. 1998, Vol 71, Num 2, pp 27-28, issn 0037-749XArticle

A 0.13μm triple-vt 9MB third level on-die cache for the Itanium® 2 processorCHANG, Jonathan; SHOEMAKER, Jonathan; KULKARNI, Sandhya et al.IEEE International Solid-State Circuits Conference. 2004, pp 496-497, isbn 0-7803-8267-6, 2Vol, 2 p.Conference Paper

A two-level redundancy scheme for enhancing scalability of molecular-based crossbar memoriesCHOI, Yoon-Hwa; LEE, Myeong-Hyeon; YOUNG KWAN KIM et al.IEEE conference on nanotechnology. 2004, pp 505-508, isbn 0-7803-8536-5, 1Vol, 4 p.Conference Paper

Improvement of forming limit in conical nosing of thin walled tubes = Amélioration de la limite de formage dans l'ogivage conique de tubes à parois mincesMANABE, K; NISHIMURA, H.Bulletin of the JSME. 1985, Vol 28, Num 245, pp 2730-2736, issn 0021-3764Article

Surface roughness behaviour of ion irradiated industrial steelLEE, Jae S; LEE, Jae H.Surface & coatings technology. 2005, Vol 196, Num 1-3, pp 358-363, issn 0257-8972, 6 p.Conference Paper

A technology for welding pressing moulds and dies for the treatment of liquid and hot metalPAVLYUK, S. K; LUPACHEV, A. G; IVASHNEV, I. N et al.Welding international. 2004, Vol 18, Num 2, pp 124-129, issn 0950-7116, 6 p.Article

An integrated linear RF power detectorKULHALLI, Suhas; SETH, Sumantra; FU, Shih-Tsang et al.IEEE International Symposium on Circuits and Systems. 2004, pp 625-628, isbn 0-7803-8251-X, 4 p.Conference Paper