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Fast Integrated Die-to-Die Transmitted, Reflected and STARlight-2<^TM> Defect Inspection on Memory MasksLAN, Andy; HSU, Jenny; CHAKRAVARTY, Swapnajit et al.Proceedings of SPIE, the International Society for Optical Engineering. 2008, Vol 7028, pp 70281J.1-70281J.7, issn 0277-786X, isbn 978-0-8194-7243-4 0-8194-7243-3, 2Conference Paper

Special issue on moulds and diesNEE, A. Y. C.Proceedings of the Institution of Mechanical Engineers. Part B. Journal of engineering manufacture. 2002, Vol 216, Num 12, issn 0954-4054, 126 p.Serial Issue

New direct-write technology for pad redistribution on individual dieDUIGNAN, Michael T; MATHEWS, Scott A; WELLS, David N et al.SPIE proceedings series. 2001, pp 745-748, isbn 0-8194-4317-4Conference Paper

Feed forward test methodology utilizing device identificationCABBIBO, A; CONDER, J; JACOBS, M et al.International Test Conference. 2004, pp 655-660, isbn 0-7803-8580-2, 1Vol, 6 p.Conference Paper

On-die DFT based solutions are sufficient for testing multi-GHz interfaces in manufacturing (and are also key to enabling lower cost ATE platforms)TRIPP, Mike.Proceedings - International Test Conference. 2002, issn 1089-3539, isbn 0-7803-7542-4, p. 1232Conference Paper

A new thermally conductive die attach film with low stress and excellent reliabilityMASUKO, Takashi; HAYASHI, Hiroki; TAKEDA, Shinii et al.SPIE proceedings series. 2001, pp 741-744, isbn 0-8194-4317-4Conference Paper

A two-level redundancy scheme for enhancing scalability of molecular-based crossbar memoriesCHOI, Yoon-Hwa; LEE, Myeong-Hyeon; YOUNG KWAN KIM et al.IEEE conference on nanotechnology. 2004, pp 505-508, isbn 0-7803-8536-5, 1Vol, 4 p.Conference Paper

Schmiedegesenke wirtschaftlich fräsen = Economical milling of forging diesVOLLRATH, Klaus.VDI-Z. 2001, Vol 143, Num AOU, pp 40-42, issn 0042-1766, NSArticle

A note on mathematical models of cup drawing by the Guerin and Marform processes = Une note sur les modèles mathématiques de l'emboutissage de coupelles par les processus Guerin et MarformVENKATESH, V. C; GOH, T. N.Journal of mechanical working technology. 1986, Vol 13, Num 3, pp 273-278, issn 0378-3804Article

Manufacturability and reliability of fine pitch wirebondingAOKI, Toyohiro; SAUTER, Wolfgang; HISADA, Takashi et al.Proceedings - Electronic Components Conference. 2004, issn 0569-5503, isbn 0-7803-8365-6, 2Vol, Vol 1, 372-376Conference Paper

Board level reliability of various stacked die chip scale package configurationsCARSON, Flynn; ZAHN, Bret; MITCHELL, Dianne et al.SPIE proceedings series. 2003, pp 894-899, isbn 0-8194-5189-4, 6 p.Conference Paper

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A 0.13μm triple-vt 9MB third level on-die cache for the Itanium® 2 processorCHANG, Jonathan; SHOEMAKER, Jonathan; KULKARNI, Sandhya et al.IEEE International Solid-State Circuits Conference. 2004, pp 496-497, isbn 0-7803-8267-6, 2Vol, 2 p.Conference Paper

A technology for welding pressing moulds and dies for the treatment of liquid and hot metalPAVLYUK, S. K; LUPACHEV, A. G; IVASHNEV, I. N et al.Welding international. 2004, Vol 18, Num 2, pp 124-129, issn 0950-7116, 6 p.Article

L'ugv convient aux matrices = The right die for high speed machiningOSTERMANN, J.-N.CETIM informations. 1998, Num 161, pp 33-34, issn 0399-0001Article

Technology : Die forging of bottoms with controllable corrugation and coningKOLESOV, Yu. B.Chemical and petroleum engineering. 1998, Vol 34, Num 3-4, pp 220-221, issn 0009-2355Conference Paper

Development of SOIC exposed pad package for dual die power productsPAULASTO-KRÖCKEL, Mervi; BOHM, Christina; KOLBECK, Anton et al.SPIE proceedings series. 2003, pp 333-338, isbn 0-8194-5189-4, 6 p.Conference Paper

An integrated linear RF power detectorKULHALLI, Suhas; SETH, Sumantra; FU, Shih-Tsang et al.IEEE International Symposium on Circuits and Systems. 2004, pp 625-628, isbn 0-7803-8251-X, 4 p.Conference Paper

Die attach quality control of 3D stacked diesRENCZ, M; SZEKELY, V; COURTOIS, B et al.IEEE/CPMT/SEMI international electronics manufacturing technology. Symposium. 2004, pp 78-84, isbn 0-7803-8582-9, 1Vol, 7 p.Conference Paper

Minimum testing requirements to screen temperature dependent defectsSCHUERMYER, C; RUFFLER, J; DAASCH, R et al.International Test Conference. 2004, pp 300-308, isbn 0-7803-8580-2, 1Vol, 9 p.Conference Paper

Diamond/PCD and tungsten carbide die reworkingSCHAAF, Silke.Wire industry. 2001, Vol 68, Num 814, pp 536-538, issn 0043-6011, 2 p.Article

Improving COO on KLA-Tencor Wafer Fab Reticle Inspections by implementing Pixel Migration as new STARlight2+ capabilityYEN, S. M; CHAKRAVARTY, Swapnajit; HUANG, Joe et al.Proceedings of SPIE, the International Society for Optical Engineering. 2008, Vol 7028, pp 70282O.1-70282O.8, issn 0277-786X, isbn 978-0-8194-7243-4 0-8194-7243-3, 2Conference Paper

The leading edge of production wafer probe test technologyMANN, William R; TABER, Frederick L; SEITZER, Philip W et al.International Test Conference. 2004, pp 1168-1195, isbn 0-7803-8580-2, 1Vol, 28 p.Conference Paper

Computerintegrierte Fertigung (CIM) im Modell- und FormenbauGRUNEWALD, C; FISCHER, J.Giesserei. 1991, Vol 78, Num 25-26, pp 934-936, issn 0016-9765Article