Controlled DNA-templated metal deposition : Towards ultra-thin nanowiresBERTI, Lorenzo; ALESSANDRINI, Andrea; MENOZZI, Claudia et al.Journal of nanoscience and nanotechnology (Print). 2006, Vol 6, Num 8, pp 2382-2385, issn 1533-4880, 4 p.Article

Coupling exonuclease III with DNA metallization for amplified detection of biothiols at picomolar concentrationZHAOWEI CHEN; LI ZHOU; ANDONG ZHAO et al.Biosensors & bioelectronics. 2014, Vol 58, pp 214-218, issn 0956-5663, 5 p.Article

Characteristics of a 10 nm-thick (TiVCr)N multi-component diffusion barrier layer with high diffusion resistance for Cu interconnectsTSAI, Du-Cheng; HUANG, Yen-Lin; LIN, Sheng-Ru et al.Surface & coatings technology. 2011, Vol 205, Num 21-22, pp 5064-5067, issn 0257-8972, 4 p.Article

Nanoscale coatings for control of interfacial bonds and nanotube growthPULIKOLLU, Rajasekhar V; MUKHOPADHYAY, Sharmila M.Applied surface science. 2007, Vol 253, Num 17, pp 7342-7352, issn 0169-4332, 11 p.Article

Changes at interfaces of friction components during brakingHOLINSKI, R; HESSE, D.Proceedings of the Institution of Mechanical Engineers. Part D, Journal of automobile engineering. 2003, Vol 217, Num 9, pp 765-770, issn 0954-4070, 6 p.Article

Hydrogen : The first metallic elementHENSEL, F; EDWARDS, P. P.Science (Washington, D.C.). 1996, Vol 271, Num 5256, issn 0036-8075, p. 1692Article

Characteristics of Cu films prepared using a magnetron sputter type negative ion source (MSNIS)PAIK, Namwoong.Applied surface science. 2005, Vol 252, Num 5, pp 1812-1817, issn 0169-4332, 6 p.Article

TRANSFER METALLIZING METHOD GAINING ACCEPTANCE1982; PAP. FILM FOIL CONVERTER; ISSN 0031-1138; USA; DA. 1982; VOL. 56; NO 3; PP. 84Article

Barrier property of TiSiN films formed by low frequency, high density inductively coupled plasma processEE, Y. C; CHEN, Z; WANG, W. D et al.Surface & coatings technology. 2005, Vol 198, Num 1-3, pp 291-295, issn 0257-8972, 5 p.Conference Paper

Ultrathin Cr added Ru film as a seedless Cu diffusion barrier for advanced Cu interconnectsHSU, Kuo-Chung; PERNG, Dung-Ching; YEH, Jia-Bin et al.Applied surface science. 2012, Vol 258, Num 18, pp 7225-7230, issn 0169-4332, 6 p.Article

Environmentally friendly process for nickel electroplating of ABSBAZZAOUI, M; MARTINS, J. I; BAZZAOUI, E. A et al.Applied surface science. 2012, Vol 258, Num 20, pp 7968-7975, issn 0169-4332, 8 p.Article

Hydrogen-induced metallization of the 3C-SiC(001)-(3 x 2) surfaceXIANGYANG PENG; KRÜGER, Peter; POLLMANN, Johannes et al.Surface science. 2006, Vol 600, Num 18, pp 3564-3569, issn 0039-6028, 6 p.Conference Paper

Influence of Operation Parameters on Dome Temperature of COREX Melter GasifierSUN, Jing; WU, Shengli; KOU, Mingyin et al.ISIJ international. 2014, Vol 54, Num 1, pp 43-48, issn 0915-1559, 6 p.Article

ACCELERATED AGEING OF IMPATT DIODESSINNADURAI FN.1981; MICROELECTRON. RELIAB.; ISSN 0026-2714; GBR; DA. 1981; VOL. 21; NO 2; PP. 209-219; BIBL. 20 REF.Article

Highly stable carbon-doped Cu films on barrierless SiZHANG, X. Y; LI, X. N; NIE, L. F et al.Applied surface science. 2011, Vol 257, Num 8, pp 3636-3640, issn 0169-4332, 5 p.Article

The influence of surface microchemistry in protective film formation on multi-phase magnesium alloysGRAY-MUNRO, J. E; LUAN, B; HUNTINGTON, L et al.Applied surface science. 2008, Vol 254, Num 9, pp 2871-2877, issn 0169-4332, 7 p.Article

Photolithographic metallization of fluorinated polymersRYE, R. R; HOWARD, A. J; RICCO, A. J et al.Thin solid films. 1995, Vol 262, Num 1-2, pp 73-83, issn 0040-6090Article

Thermal stability of on-chip copper interconnect structuresGUTMANN, R. J; CHOW, T. P; KALOYEROS, A. E et al.Thin solid films. 1995, Vol 262, Num 1-2, pp 177-186, issn 0040-6090Article

SCREAM. I: Single mask, single-crystal silicon, reactive ion etching process for microelectromechanical structuresSHAW, K. A; ZHANG, Z. L; MACDONALD, N. C et al.Sensors and actuators. A, Physical. 1994, Vol 40, Num 1, pp 63-70, issn 0924-4247Article

Au(Ti-W) and Au/Cr metallization of chemically vapor-deposited diamond substrates for multichip module applicationsMEYYAPPAN, I; MALSHE, A. P; NASEEM, H. A et al.Thin solid films. 1994, Vol 253, Num 1-2, pp 407-412, issn 0040-6090Conference Paper

A simple method for acrylonitrile butadiene styrene metallizationBAZZAOUI, M; MARTINS, J. I; BAZZAOUI, E. A et al.Surface & coatings technology. 2013, Vol 224, pp 71-76, issn 0257-8972, 6 p.Article

Thermal dry-etching of copper using hydrogen peroxide and hexafluoroacetylacetoneJAIN, A; KODAS, T. T; HAMPDEN-SMITH, M. J et al.Thin solid films. 1995, Vol 269, Num 1-2, pp 51-56, issn 0040-6090Article

Effect of chemical etching on the Cu/Ni metallization of poly (ether ether ketone)/carbon fiber compositesLIZHI DI; BIN LIU; JIANJING SONG et al.Applied surface science. 2011, Vol 257, Num 9, pp 4272-4277, issn 0169-4332, 6 p.Article

Stretching the limits of static SIMS with C₆₀+DELCORTE, A; POLEUNIS, C; BERTRAND, P et al.Applied surface science. 2006, Vol 252, Num 19, pp 6494-6497, issn 0169-4332, 4 p.Conference Paper

Cluster beams for metallization of microstructured surfacesGATZ, P; HAGENA, O. F.Applied surface science. 1995, Vol 91, pp 169-174, issn 0169-4332Conference Paper