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Micro-optics : fabrication, packaging, and integration (Strasbourg, 29-30 April 2004)Van Daele, Peter; Mohr, Jürgen.SPIE proceedings series. 2004, isbn 0-8194-5377-3, VII, 162 p, isbn 0-8194-5377-3Conference Proceedings

Flip-chip assembly for photonic circuitsWÖRHOFF, K; HEIDEMAN, R. G; GILDE, M. J et al.SPIE proceedings series. 2004, pp 9-20, isbn 0-8194-5377-3, 12 p.Conference Paper

High-density hybrid interconnect technologiesJOHN, Joachim; ZIMMERMANN, Lars; DE MOOR, Piet et al.SPIE proceedings series. 2004, pp 1-8, isbn 0-8194-5377-3, 8 p.Conference Paper

Sealing optical fibers without metallization: Design guidelinesDIETZ, Raymond L.SPIE proceedings series. 2004, pp 111-120, isbn 0-8194-5377-3, 10 p.Conference Paper

Assembly of electro-optical modules in a desk-top factoryMENSCHIG, A.SPIE proceedings series. 2004, pp 96-101, isbn 0-8194-5377-3, 6 p.Conference Paper

Flip chip assembly and reliability using gold/tin solder bumpsOPPERMANN, Hermann; HUTTER, Matthias; KLEIN, Matthias et al.SPIE proceedings series. 2004, pp 21-30, isbn 0-8194-5377-3, 10 p.Conference Paper

Micro-optical components and systems in polymers for optical networks and sensorsTEUBNER, U.SPIE proceedings series. 2004, pp 31-40, isbn 0-8194-5377-3, 10 p.Conference Paper

Large-area origination and replication of microstructures with optical functionsGOMBERT, Andreas; FORBERICH, Karen; BLÄSI, Benedikt et al.SPIE proceedings series. 2004, pp 129-136, isbn 0-8194-5377-3, 8 p.Conference Paper

Sol-gel replication of optical components suited for surface mount assemblySÖCHTIG, Jürgen; MAHMUD, Sanida; OBI, Samuel et al.SPIE proceedings series. 2004, pp 41-51, isbn 0-8194-5377-3, 11 p.Conference Paper

Unglue bonding of glass-ceramic parts with ultra low coefficient of thermal expansionMASLOV, V. P; SIZOV, F. F.SPIE proceedings series. 2004, pp 155-161, isbn 0-8194-5377-3, 7 p.Conference Paper

A cost effective packaging for the environmental hardening of passive optical devicesWATTE, J; LEEMAN, S; SWINNEN, L et al.SPIE proceedings series. 2004, pp 102-110, isbn 0-8194-5377-3, 9 p.Conference Paper

Development of microlens arrays for high-speed optical communicationKO, Chih-Hsiang; LIN, Chun-Hsu; TSAI, Bor-Chen et al.SPIE proceedings series. 2004, pp 121-128, isbn 0-8194-5377-3, 8 p.Conference Paper

Integration of multimode waveguides and micromirror couplers in printed circuit boards using laser ablationVAN STEENBERGE, Geert; GEERINCK, Peter; VAN PUT, Steven et al.SPIE proceedings series. 2004, pp 75-84, isbn 0-8194-5377-3, 10 p.Conference Paper

Ellipsometric investigations of polished surface of glassceramic with ultra low coefficient of the temperature expansionMASLOV, V. P; SARSEMBAEVA, A. Z; SIZOV, F. F et al.SPIE proceedings series. 2004, pp 148-154, isbn 0-8194-5377-3, 7 p.Conference Paper

PLATIMO: Versatile assembling facilities to bring concepts to prototypes and automated productionKOPP, Christophe; FULBERT, Laurent; GILBERT, Karen et al.SPIE proceedings series. 2004, pp 137-147, isbn 0-8194-5377-3, 11 p.Conference Paper

Basic aspects of Deep Lithography with particles for the fabrication of micro-optical and micro-mechanical structuresVOLCKAERTS, Bart; VYNCK, Pedro; THIENPONT, Hugo et al.SPIE proceedings series. 2004, pp 52-63, isbn 0-8194-5377-3, 12 p.Conference Paper

Low cost single mode waveguide fabrication allowing passive fiber coupling using LIGA and UV flood exposureHENZI, P; RABUS, D. G; BADE, K et al.SPIE proceedings series. 2004, pp 64-74, isbn 0-8194-5377-3, 11 p.Conference Paper

High precision surface mount assembly of micro-optical components per laser reflow soldering: positioning accuracy and thermal stabilitySTAUFFER, Laurent; WÄLTI, Felix; VOKINGER, Urs et al.SPIE proceedings series. 2004, pp 85-95, isbn 0-8194-5377-3, 11 p.Conference Paper

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