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Supramolecular materials : Self-organized nanostructuresSTUPP, S. I; LEBONHEUR, V; WALKER, K et al.Science (Washington, D.C.). 1997, Vol 276, Num 5311, pp 384-389, issn 0036-8075Article

Rapid thermal post-metallization annealing effect on thin gate oxidesJENG, M.-J; LIN, H.-S; HWU, J.-G et al.Applied surface science. 1996, Vol 92, Num 1-4, pp 208-211, issn 0169-4332Conference Paper

Design and technological peculiarities of making vacuum integrated circuit of a thermocathode-based AC amplifierGRIGORISHIN, I. L; KOTOVA, I. F; MUKHUROV, N. I et al.Applied surface science. 1997, Vol 111, pp 101-105, issn 0169-4332Conference Paper

Micro-scale technologies for electronics coolingNAKAYAMA, Wataru.Heat transfer engineering. 2004, Vol 25, Num 1, issn 0145-7632, 160 p.Serial Issue

Micro inertial measurement system from ChinaHAIFENG DONG; WENDONG ZHANG.IEEE instrumentation & measurement magazine. 2002, Vol 5, Num 1, pp 16-19, issn 1094-6969Article

Evolution of copper-oxide damascene structures in chemical mechanical polishing: II. Copper dishing and oxide erosionLAI, Jiun-Yu; SAKA, Nannaji; CHUN, Jung-Hoon et al.Journal of the Electrochemical Society. 2002, Vol 149, Num 1, pp G41-G50, issn 0013-4651Article

Palladium activation on TaNx barrier films for autocatalytic electroless copper depositionSEOK WOO HONG; SHIN, Chang-Hee; PARK, Jong-Wan et al.Journal of the Electrochemical Society. 2002, Vol 149, Num 1, pp G85-G88, issn 0013-4651Article

Force and shapes of liquid bridges between circular padsVERGES, M. A; LARSON, M. C; BACOU, R et al.Experimental mechanics. 2001, Vol 41, Num 4, pp 351-357, issn 0014-4851Article

Environmentally friendly wafer production : NF3 remote microwave plasma for chamber cleaningREICHARDT, H; FRENZEL, A; SCHOBER, K et al.Microelectronic engineering. 2001, Vol 56, Num 1-2, pp 73-76, issn 0167-9317Conference Paper

European 300 mm metrology platform : MEDEA T618TRILHE, J; READER, A; KWAKMAN, L et al.Microelectronic engineering. 2001, Vol 56, Num 1-2, pp 15-25, issn 0167-9317Conference Paper

Reconfigurable analogue systems : The pulse-based approachHAMILTON, A; PAPATHANASIOU, K.IEE proceedings. Computers and digital techniques. 2000, Vol 147, Num 3, pp 203-207, issn 1350-2387Article

Time-resolved optical characterization of electrical activity in integrated circuitsTSANG, James C; KASH, Jeffrey Alan; VALLETT, David P et al.Proceedings of the IEEE. 2000, Vol 88, Num 9, pp 1440-1459, issn 0018-9219Article

Experimental techniques for fatigue reliability of BGA solder bumps in electronic packagingLEE, Soon-Bok; PARK, Tae-Sang; HAM, Suk-Jin et al.JSME international journal. Series A, Solid mechanics and material engineering. 2000, Vol 43, Num 4, pp 400-407, issn 1344-7912Conference Paper

Real-time process control to prevent CD variation induced by Post Exposure DelayKU, Chin-Yu; TAN FU LEI; SHIEH, Jia-Min et al.SPIE proceedings series. 2000, pp 40-47, isbn 0-8194-3843-XConference Paper

Towards 100 % yield understanding approach in Lucent Technologies MadridRECIO, M; MERINO, M. A; MORILLA, C et al.SPIE proceedings series. 2000, pp 12-19, isbn 0-8194-3843-XConference Paper

Tuning dielectric constant and Young's modulus by nanofabricationSUN, Chang Q; TAY, B. K; LAU, S. P et al.SPIE proceedings series. 2000, pp 302-308, isbn 0-8194-3900-2Conference Paper

Manufacturability issues in Flip chip on laminate assemblyJING QI; JOHNSON, R. W; YAEGER, E et al.The International journal of microcircuits and electronic packaging. 1999, Vol 22, Num 3, pp 270-279, issn 1063-1674Article

Formation of carbon nanocapsules with SiC nanoparticles prepared by polymer pyrolysisOKU, T; NIIHARA, K; SUGANUMA, K et al.Journal of material chemistry. 1998, Vol 8, Num 6, pp 1323-1325, issn 0959-9428Article

Effects of silver-paste formulation on camber development during the cofiring of a silver-based, low-temperature-cofired ceramic packageCHANG, C.-R; JEAN, J.-H.Journal of the American Ceramic Society. 1998, Vol 81, Num 11, pp 2805-2814, issn 0002-7820Article

Direct writing of metallic nanostructures by means of metal colloidsDUMPICH, G; LOHAU, J; WASSERMANN, E. F et al.Materials science forum. 1998, pp 413-415, issn 0255-5476, isbn 0-87849-815-XConference Paper

Hydride vapour phase epitaxy for nanostructuresRODRIGUEZ MESSMER, E; LOURDUDOSS, S; CARLSSON, N et al.Materials science & engineering. B, Solid-state materials for advanced technology. 1998, Vol 51, Num 1-3, pp 238-241, issn 0921-5107Conference Paper

Fabrication of metallic nanostructures with an atomic force microscopeSOHN, L. L; WILLETT, R. L.Surface science. 1996, Vol 361-62, Num 1-3, pp 874-877, issn 0039-6028Conference Paper

Can nanolithography ever be a manufacturing technology ?PEASE, R. F. W.Materials science & engineering. B, Solid-state materials for advanced technology. 1995, Vol 35, Num 1-3, pp 188-191, issn 0921-5107Conference Paper

Fabrication of nanostructures with multilevel architectureTAYLOR, R. P; ADAMS, J. A; DAVIES, M et al.Journal of vacuum science & technology. B. Microelectronics and nanometer structures. Processing, measurement and phenomena. 1993, Vol 11, Num 3, pp 628-633, issn 1071-1023Conference Paper

Effects of limited Cu supply on soldering reactions between SnAgCu and NiHO, C. E; LIN, Y. W; YANG, S. C et al.Journal of electronic materials. 2006, Vol 35, Num 5, pp 1017-1024, issn 0361-5235, 8 p.Article

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