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High aspect ratio spiral and vertical meander micro coils for actuator applicationsSEIDEMANN, V; KOHLMEIER, T; FÖHSE, M et al.Microsystem technologies. 2004, Vol 10, Num 6-7, pp 564-570, issn 0946-7076, 7 p.Article

3D high aspect ratio micro structures fabricated by one step UV lithographyHUANG, H; YANG, W; WANG, T et al.Journal of micromechanics and microengineering (Print). 2007, Vol 17, Num 2, pp 291-296, issn 0960-1317, 6 p.Article

A method of gap control based on the principle of equal thickness interference for HARNS fabricationJIE ZHOU; GANG LIU; XIAOBO ZHANG et al.Microsystem technologies. 2011, Vol 17, Num 1, pp 101-107, issn 0946-7076, 7 p.Article

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Nanosprint : An infrastructure for nanotechnology foresightCIONTU, Florin.European micro and nano systems. Conference. 2004, pp 249-252, isbn 2-916187-02-2, 1Vol, 4 p.Conference Paper

Influence of the microstructure on the strain of micro componentsALBERS, A; METZ, D.Microsystem technologies. 2006, Vol 12, Num 7, pp 685-690, issn 0946-7076, 6 p.Conference Paper

Macroporous silicon-based deep anisotropic etchingTAO, Yi; ESASHI, Masayoshi.Journal of micromechanics and microengineering (Print). 2005, Vol 15, Num 4, pp 764-770, issn 0960-1317, 7 p.Article

Fabrication of high-aspect-ratio microstructures using SU8 photoresistLIU, G; TIAN, Y; KAN, Y et al.Microsystem technologies. 2005, Vol 11, Num 4-5, pp 343-346, issn 0946-7076, 4 p.Conference Paper

Fabrication of silicon-on-insulator MEM resonators with deep sub-micron transduction gapsDIANA, Nicoleta; CIRESSAN, Badila; HIBERT, Cyrille et al.Microsystem technologies. 2007, Vol 13, Num 11-12, pp 1489-1493, issn 0946-7076, 5 p.Conference Paper

MODULIGA: The LIGA process as a modular production method-current standardization status in GermanyHAHN, L; MEYER, P; BADE, K et al.Microsystem technologies. 2005, Vol 11, Num 4-5, pp 240-245, issn 0946-7076, 6 p.Conference Paper

Hot embossing at viscous state to enhance filling process for complex polymer structuresXUELIN ZHU; SIMON, Terrence W; TIANHONG CUI et al.Microsystem technologies. 2012, Vol 18, Num 3, pp 257-265, issn 0946-7076, 9 p.Article

High aspect ratio hydrogenation-assisted lateral etching of (10 0) silicon substratesKAYYALHA, M; NAGHSH NILCHI, J; EBRAHIMI, A et al.Journal of micromechanics and microengineering (Print). 2011, Vol 21, Num 7, issn 0960-1317, 074003.1-074003.8Conference Paper

1-3 Piezocomposites realised from small feature size, high aspect ratio, hot embossed moulds. Part II: piezocomposite fabricationCLIPSHAM, T. J; BUTTON, T. W.Microsystem technologies. 2010, Vol 16, Num 11, pp 1983-1988, issn 0946-7076, 6 p.Article

Bonding of Cu-based high aspect ratio microscale structures with Sn intermediate layersFANGHUA MEI; KE CHEN; LU, B et al.Microsystem technologies. 2009, Vol 15, Num 7, pp 1111-1118, issn 0946-7076, 8 p.Article

Enhanced UV-assisted vertical etching of polyethylene terephthalate for fabrication of microsystemsJAHANSHAHI, A; PAJOUHI, H; TAMADDON, A. H et al.Journal of micromechanics and microengineering (Print). 2009, Vol 19, Num 7, issn 0960-1317, 074016.1-074016.6Conference Paper

Fabrication of a SFF-based three-dimensional scaffold using a precision deposition system in tissue engineeringJONG YOUNG KIM; EUI KYUN PARK; KIM, Shin-Yoon et al.Journal of micromechanics and microengineering (Print). 2008, Vol 18, Num 5, issn 0960-1317, 055027.1-055027.7Article

Lithographic stress control for the self-assembly of polymer MEMS structuresLEE, S.-W; SAMEOTO, D; MAHANFAR, A et al.Journal of micromechanics and microengineering (Print). 2008, Vol 18, Num 8, issn 0960-1317, 085004.1-085004.8Article

Manufacturing of a micro-tungsten carbide electrode using a supersonic-aided electrolysis processWENG, Feng-Tsai; HO, Chi-Ting.Journal of micromechanics and microengineering (Print). 2008, Vol 18, Num 3, issn 0960-1317, 037001.1-037001.4Article

Fabrication of comb-drive micro-actuators based on UV lithography of SU-8 and electroless plating techniqueWEN DAI; WANJUN WANG.Microsystem technologies. 2008, Vol 14, Num 9-11, pp 1745-1750, issn 0946-7076, 6 p.Conference Paper

Polytetrafluoroethylene processing characteristics using high-energy X-rayUKITA, Yoshiaki; KANDA, Kazuhiro; MATSUI, Shinji et al.Microsystem technologies. 2008, Vol 14, Num 9-11, pp 1567-1572, issn 0946-7076, 6 p.Conference Paper

A micro powder injection molding apparatus for high aspect ratio metal micro-structure productionGANG FU; TOR, Shubeng; LOH, Ngiaphiang et al.Journal of micromechanics and microengineering (Print). 2007, Vol 17, Num 9, pp 1803-1809, issn 0960-1317, 7 p.Article

Fabrication of support structures to prevent SU-8 stiction in high aspect ratio structuresVORA, K. D; PEELE, A. G; SHEW, B.-Y et al.Microsystem technologies. 2007, Vol 13, Num 5-6, pp 487-493, issn 0946-7076, 7 p.Conference Paper

Laser micromachining of high-aspect-ratio metallic grooves for application to microthermal devicesOH, Kwang H; LEE, M. K; JEONG, S. H et al.Journal of micromechanics and microengineering (Print). 2006, Vol 16, Num 10, pp 1958-1966, issn 0960-1317, 9 p.Article

Fabrication of high aspect ratio microstructure arrays by micro reverse wire-EDMLIAO, Yunn-Shiuan; CHEN, Shun-Tong; LIN, Chang-Sheng et al.Journal of micromechanics and microengineering (Print). 2005, Vol 15, Num 8, pp 1547-1555, issn 0960-1317, 9 p.Article