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Silicon micro-transducer = Silizium-MiniaturaufnehmerMIDDELHOEK, S; NOORLAG, D.Journal of physics. E. Scientific instruments. 1981, Vol 14, Num 12, pp 1343-1352, issn 0022-3735Article

Temperaturfeldberechnungen auf integrierten piezoresistiven Druckwandlern = Computation of temperature fields by use of integrated piezoresistive pressure transducersJENSCHKE, W.Feingerätetechnik. 1982, Vol 31, Num 7, pp 297-300, issn 0014-9683Article

A transistor anemometer = Ein Transistor-AnemometerMACHATTIE, L.E.Journal of physics. E. Scientific instruments. 1981, Vol 14, Num 1, pp 80-82, issn 0022-3735Article

Out of the SHADOW: Watch parts in the spotlight: Laser beam micro welding of delicate watch componentsKRAMER, Thorsten; OLOWINSKY, Alexander M.SPIE proceedings series. 2003, pp 481-492, isbn 0-8194-4777-3, 12 p.Conference Paper

Miniaturisierte thermische Strahlungssensoren: Die neue Thermosaeule TS-50.1 = Miniaturized thermal sensors: The new thermopile TS-50.1ELBEL, T; MUELLER, J.E; VOELKLEIN, F et al.Feingerätetechnik. 1985, Vol 34, Num 3, pp 113-115, issn 0014-9683Article

Wear resistant tools for reproduction technologies produced by micro powder metallurgyROTA, A; DUONG, T.-V; HARTWIG, T et al.Microsystem technologies. 2002, Vol 7, Num 5-6, pp 225-228, issn 0946-7076Article

Various replication techniques for manufacturing three-dimensional metal microstructuresRUPRECHT, R; BENZLER, T; HAUSSELT, J et al.Microsystem technologies. 1997, Vol 4, Num 1, pp 28-31, issn 0946-7076Article

Forming technologies for production of micro structured partsNEUGEBAUER, R; SCHUBERT, A; BÖHM, J et al.euspen : european society for precision engineering and nanotechnology. International conference. 2001, pp 184-187, 2VolConference Paper

Miniflachzugproben prüfen: Richtige Probenentnahme und zuverlässige Prüfverfahren = Mini flat tensile specimens and various methods for testing themDOBI, D; JUNGHANS, E.Materialprüfung. 1999, Vol 41, Num 11-12, pp 445-450, issn 0025-5300Article

Passive films at the nanoscaleMAURICE, Vincent; MARCUS, Philippe.Electrochimica acta. 2012, Vol 84, pp 129-138, issn 0013-4686, 10 p.Article

Corrosion research at the micro and nano scale : A well known phenomenonSCHMUTZ, Patrick; SUTER, Thomas.GIT laboratory journal Europe. 2005, Vol 9, Num 5, pp 51-52, issn 1611-6038, 2 p.Article

Micro powder metallurgy for the replicative production of metallic microstructuresROTA, A; DUONG, T. V; HARTWIG, T et al.Microsystem technologies. 2002, Vol 8, Num 4-5, pp 323-325, issn 0946-7076Conference Paper

Pressure free fabrication of 3D microcomponents using Al powderKIM, Jung-Sik; JIANG, Kyle; CHANG, Isaac et al.Advanced engineering materials (Print). 2006, Vol 8, Num 1-2, pp 38-41, issn 1438-1656, 4 p.Article

Preliminary evaluation of hot extrusion miniaturizationMORSI, K; NANAYAKKARA, N; MCSHANE, H. B et al.Journal of materials science. 1999, Vol 34, Num 12, pp 2801-2806, issn 0022-2461Article

The formation of moulds for 3D microstructures using excimer laser ablationLAWES, R. A; HOLMES, A. S; GOODALL, F. N et al.Microsystem technologies. 1996, Vol 3, Num 1, pp 17-19, issn 0946-7076Article

A low-temperature IC-compatible process for fabricating surface-micromachined metallic microchannelsPAPAUTSKY, I; BRAZZLE, J; SWERDLOW, H et al.Journal of microelectromechanical systems. 1998, Vol 7, Num 2, pp 267-273, issn 1057-7157Article

Development of pocket-size electro-discharge machineHIGUCHI, T; FURUTANI, K; YAMAGATA, Y et al.CIRP annals. 1991, Vol 40, Num 1, pp 203-206, issn 0007-8506Article

Investigations into the Size Effect on Plastic Deformation Behavior of Metallic Materials in Microcoining ProcessJUNG SOO NAM; SANG WON LEE; HONG SEOK KIM et al.International journal of precision engineering and manufacturing. 2014, Vol 15, Num 1, pp 5-11, 7 p.Article

Refinement of the Microstructure of Sn-Ag-Bi-In Solder, by Addition of SiC Nanoparticles, to Reduce Electromigration Damage Under High Electric Current : Pb-FREE SOLDERS AND MATERIALS FOR EMERGING INTERCONNECT AND PACKAGING TECHNOLOGIESYOUNGSEOK KIM; SHIJO NAGAO; SUGAHARA, Tohru et al.Journal of electronic materials. 2014, Vol 43, Num 12, pp 4428-4434, issn 0361-5235, 7 p.Article

OFETs with sub-100 nm channel length fabricated by wafer-scale NIL and comprehensive DC and AC characterizationsLICHAO TENG; FINN, Andreas; PLÖTNER, Matthias et al.Microelectronic engineering. 2014, Vol 121, pp 27-32, issn 0167-9317, 6 p.Article

Fabrication of 120° silicon double mirrors robust against misalignment for use in micro optical gyroscopesNIESEL, Thalke; DIETZEL, Andreas.Microelectronic engineering. 2014, Vol 121, pp 72-75, issn 0167-9317, 4 p.Article

Acoustic Softening and Hardening of Aluminum in High-Frequency Vibration-Assisted Micro/Meso FormingZHEHE YAO; KIM, Gap-Yong; FAIDLEY, Leann et al.Materials and manufacturing processes. 2013, Vol 28, Num 4-6, pp 584-588, issn 1042-6914, 5 p.Article

Synthesis, characterization, electrical and thermal properties of nanocomposite of polythiophene with nanophotoadduct: a potent composite for electronic useHANIEF NAJAR, Mohd; MAJID, Kowsar.Journal of materials science. Materials in electronics. 2013, Vol 24, Num 11, pp 4332-4339, issn 0957-4522, 8 p.Article

The effect of joint size on the creep properties of microscale lead-free solder joints at elevated temperaturesLIMENG YIN; SONG WEI; ZHANGLIANG XU et al.Journal of materials science. Materials in electronics. 2013, Vol 24, Num 4, pp 1369-1374, issn 0957-4522, 6 p.Article

Investigation of the Quality of Microholes Machined by μEDM Using Image ProcessingJAFFERSON, J. M; HARIHARAN, P.Materials and manufacturing processes. 2013, Vol 28, Num 10-12, pp 1356-1360, issn 1042-6914, 5 p.Article

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