Robust photopolymers for MCM, board, and backplane optical interconnectsELDADA, L; NAHATA, A; YARDLEY, J. T et al.SPIE proceedings series. 1998, pp 175-191, isbn 0-8194-2727-6Conference Paper

Polyimide optical waveguide with multi-fan-out for multichip module systemMATSUMOTO, T; KUWANA, Y; HIROSE, A et al.SPIE proceedings series. 1998, pp 133-144, isbn 0-8194-2727-6Conference Paper

A 160Gb/s interface design configuration for multichip LSIEZAKI, Takayuki; KONDO, Kazuhiro; OZAKI, Hiroshi et al.IEEE International Solid-State Circuits Conference. 2004, pp 140-141, isbn 0-7803-8267-6, 2Vol, 2 p.Conference Paper

Advanced thick-film technology : The new generationBARNWELL, P; WOOD, J.Microelectronics international. 1997, Vol 44, Num SEP, pp 51-53, issn 1356-5362Conference Paper

Dual-block assembled microelectronics tactile sensorGANDELLI, A; LAZZARONI, M; OTTOBONI, R et al.SPIE proceedings series. 1997, pp 203-208, isbn 0-930815-50-5Conference Paper

Technology insertion and process improvements : A case studySPRECKELS, C; GREEN, T. J.SPIE proceedings series. 1997, pp 551-556, isbn 0-930815-50-5Conference Paper

Experimental demonstration of a multi-channel micro-optical bridge for multi-Gb/s, free-space intra-MCM interconnectsVERSCHAFFELT, G; BUCZYNSKI, R; GENOE, J et al.SPIE proceedings series. 1998, pp 44-47, isbn 0-8194-2949-XConference Paper

Guided-wave optoelectronic clock distribution networks on multichip modules using MEMS fabrication techniquesSEUNGUG KOH; SUH, S.-D; DANJIN WU et al.SPIE proceedings series. 1998, pp 79-84, isbn 0-8194-2727-6Conference Paper

Boundary-scan test system based on VXI busDU, Ying; ZHAO, Wenyan; XI, Quansheng et al.Proceedings of SPIE, the International Society for Optical Engineering. 2006, pp 63581P.1-63581P.6, issn 0277-786X, isbn 0-8194-6453-8, 2VolConference Paper

Laser-based electro-optic testing of multichip module structuresMECHTEL, D. M; CHARLES, H. K; FRANCOMACARO, A. S et al.Microelectronics and reliability. 1998, Vol 38, Num 12, pp 1847-1853, issn 0026-2714Article

Efficient waveguide couplers using tilted gratings for optoelectronic interconnectsJIANHUA GAN; BIHARI, B; LINGHUI WU et al.SPIE proceedings series. 1998, pp 122-132, isbn 0-8194-2727-6Conference Paper

A discussion of integrated circuit (IC), MultiChip Module (MCM), and MEMS applications fabricated through MOSISPELTIER, J; HANSFORD, W.SPIE proceedings series. 1997, pp 25-33, isbn 0-8194-2680-6Conference Paper

Implementing high performance graphics subsystems with complex IC technologyBEAT, S. W; AVERY, G; BROWN, S. K et al.SPIE proceedings series. 1997, pp 500-505, isbn 0-930815-50-5Conference Paper

A structured testability approach for multi-chip modules based on BIST and boundary-scan : Advancing MCM technologiesZORIAN, Y.IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging. 1994, Vol 17, Num 3, pp 283-290, issn 1070-9894Article

New process monitoring strategies for large area panel processingCOTTET, Didier; SCHEFFLER, Michael; TRÖSTER, Gerhard et al.SPIE proceedings series. 2000, pp 166-171, isbn 0-930815-62-9Conference Paper

New method for grafting a thin film metal-semiconductor-metal photodetector with a transimpedance amplifier and applications to multichip module packagingMORRISON, C. B; ZHENG ZHU; STEINBERG, J et al.SPIE proceedings series. 1998, pp 16-22, isbn 0-8194-2727-6Conference Paper

Study of thermal behaviour in a multi-chip-composed microinstrumentation systemBRÜNNER, M. P; BARTEK, M; WOLFFENBUTTEL, R. F et al.Sensors and actuators. A, Physical. 1998, Vol 68, Num 1-3, pp 378-383, issn 0924-4247Conference Paper

Thermal model reduction for IC packages and MCM'sFURMANCZYK, M; NAPIERALSKI, A; YU, E et al.THERMINIC : international workshop on thermal investigations of ICs and microstructures. 1998, pp 135-138, isbn 2-913329-01-2Conference Paper

Design and fabrication of optoelectronic multichip module prototypes using MEMS fabrication techniquesKOH, S; SADLER, D. J; OH, K et al.SPIE proceedings series. 1997, pp 43-51, isbn 0-8194-2419-6Conference Paper

Large area Processing (LAP) : Performance studies on extrusion coatingWELLS, G. T; GIBSON, G; NEWQUIST, C et al.SPIE proceedings series. 1997, pp 54-59, isbn 0-930815-50-5Conference Paper

Structured test methodologies and test economics for multichip modulesKORNEGAY, K. T; ROY, K.IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging. 1996, Vol 19, Num 1, pp 195-202, issn 1070-9894Article

Process synthesis and design for multi-chip module fabricationPIERCE, D. W; REALFF, M. J.Computers & chemical engineering. 1996, Vol 20, pp S1307-S1315, issn 0098-1354, SUPBConference Paper

A 1.2Gb/s/pin wireless superconnect based on inductive inter-chip signaling (IIS)MIZOGUCHI, Daisuke; YUSMEERAZ BINTI YUSOF; MIURA, Noriyuki et al.IEEE International Solid-State Circuits Conference. 2004, pp 142-143, isbn 0-7803-8267-6, 2Vol, 2 p.Conference Paper

AIDE A LA CONCEPTION DE SYSTEMES TESTABLES = COMPUTER AIDED DESIGN OF TESTABLE SYSTEMSMaroufi, Walid; Marzouki, Meryem.1999, 182 p.Thesis

The integration of electroluminescent displays on multilayer ceramic-on-metal circuit boards for application in military vehiclesRIDDLE, G. H. N; SREERAM, A. N; STAEBLER, D. L et al.SPIE proceedings series. 1998, pp 264-268, isbn 0-8194-2812-4Conference Paper