Micro-optics : fabrication, packaging, and integration (Strasbourg, 29-30 April 2004)Van Daele, Peter; Mohr, Jürgen.SPIE proceedings series. 2004, isbn 0-8194-5377-3, VII, 162 p, isbn 0-8194-5377-3Conference Proceedings

Assembly of electro-optical modules in a desk-top factoryMENSCHIG, A.SPIE proceedings series. 2004, pp 96-101, isbn 0-8194-5377-3, 6 p.Conference Paper

Micro-optical components and systems in polymers for optical networks and sensorsTEUBNER, U.SPIE proceedings series. 2004, pp 31-40, isbn 0-8194-5377-3, 10 p.Conference Paper

Sealing optical fibers without metallization: Design guidelinesDIETZ, Raymond L.SPIE proceedings series. 2004, pp 111-120, isbn 0-8194-5377-3, 10 p.Conference Paper

Basic aspects of Deep Lithography with particles for the fabrication of micro-optical and micro-mechanical structuresVOLCKAERTS, Bart; VYNCK, Pedro; THIENPONT, Hugo et al.SPIE proceedings series. 2004, pp 52-63, isbn 0-8194-5377-3, 12 p.Conference Paper

A cost effective packaging for the environmental hardening of passive optical devicesWATTE, J; LEEMAN, S; SWINNEN, L et al.SPIE proceedings series. 2004, pp 102-110, isbn 0-8194-5377-3, 9 p.Conference Paper

Low cost single mode waveguide fabrication allowing passive fiber coupling using LIGA and UV flood exposureHENZI, P; RABUS, D. G; BADE, K et al.SPIE proceedings series. 2004, pp 64-74, isbn 0-8194-5377-3, 11 p.Conference Paper

High precision surface mount assembly of micro-optical components per laser reflow soldering: positioning accuracy and thermal stabilitySTAUFFER, Laurent; WÄLTI, Felix; VOKINGER, Urs et al.SPIE proceedings series. 2004, pp 85-95, isbn 0-8194-5377-3, 11 p.Conference Paper

High-density hybrid interconnect technologiesJOHN, Joachim; ZIMMERMANN, Lars; DE MOOR, Piet et al.SPIE proceedings series. 2004, pp 1-8, isbn 0-8194-5377-3, 8 p.Conference Paper

Development of microlens arrays for high-speed optical communicationKO, Chih-Hsiang; LIN, Chun-Hsu; TSAI, Bor-Chen et al.SPIE proceedings series. 2004, pp 121-128, isbn 0-8194-5377-3, 8 p.Conference Paper

Flip-chip assembly for photonic circuitsWÖRHOFF, K; HEIDEMAN, R. G; GILDE, M. J et al.SPIE proceedings series. 2004, pp 9-20, isbn 0-8194-5377-3, 12 p.Conference Paper

Flip chip assembly and reliability using gold/tin solder bumpsOPPERMANN, Hermann; HUTTER, Matthias; KLEIN, Matthias et al.SPIE proceedings series. 2004, pp 21-30, isbn 0-8194-5377-3, 10 p.Conference Paper

VM-TEST: Mechanical property measurement using electrostatically actuated vertical MEMS test structures fabricated in thick metal layersHALUZAN, Darcy T; KLYMYSHYN, David M; ACHENBACH, Sven et al.Microsystem technologies. 2012, Vol 18, Num 4, pp 443-452, issn 0946-7076, 10 p.Article

X-ray fabrication of SAW resonators with narrow electrodes in thick high-aspect-ratio polymer templatesKLYMYSHYN, David M; MAPPES, Timo; ACHENBACH, Sven et al.Journal of micromechanics and microengineering (Print). 2010, Vol 20, Num 7, issn 0960-1317, 075031.1-075031.6Article

A modular fabrication concept for microoptical systems : Optical MEMS and its future trendsMOHR, Jürgen A; LAST, Arndt; HOLLENBACH, Uwe et al.Journal of lightwave technology. 2003, Vol 21, Num 3, pp 643-647, issn 0733-8724, 5 p.Article

Design for optimized coupling of organic semiconductor laser light into polymer waveguides for highly integrated biophotonic sensorsMAPPES, Timo; VANNAHME, Christoph; SCHELB, Mauno et al.Microelectronic engineering. 2009, Vol 86, Num 4-6, pp 1499-1501, issn 0167-9317, 3 p.Conference Paper

Simulation of structure profiles in optical lithography of thick DNQ-novolak based photoresistsCHUNG, Song-Jo; SCHULZ, Joachim; HEIN, Herbert et al.SPIE proceedings series. 2000, pp 1226-1235, isbn 0-8194-3617-8Conference Paper

High aspect ratio vertical cantilever RF-MEMS variable capacitorKLYMYSHYN, David M; HALUZAN, Darcy T; BÖRNER, Martin et al.IEEE microwave and wireless components letters. 2007, Vol 17, Num 2, pp 127-129, issn 1531-1309, 3 p.Article

Microwave performance of photoresist-alumina microcomposites for batch fabrication of thick polymer-based dielectric structuresRASHIDIAN, Atabak; KLYMYSHYN, David M; TAYFEH ALIGODARZ, Mohammadreza et al.Journal of micromechanics and microengineering (Print). 2012, Vol 22, Num 10, issn 0960-1317, 105002.1-105002.9Article

Development of a micro-optical distance sensorOKA, Toru; NAKAJIMA, Hajime; TSUGAI, Masahiro et al.Sensors and actuators. A, Physical. 2003, Vol 102, Num 3, pp 261-267, issn 0924-4247, 7 p.Article

Vertical High-Q RF-MEMS Devices tor Reactive Lumped-Element CircuitsKLYMYSHYN, David M; BÖRNER, Martin; HALUZAN, Darcy T et al.IEEE transactions on microwave theory and techniques. 2010, Vol 58, Num 11, pp 2976-2986, issn 0018-9480, 11 p., 1Article

Stiction issues and actuation of RF LIGA-MEMS variable capacitorsHALUZAN, Darcy T; KLYMYSHYN, David M; BÖRNER, Martin et al.Microsystem technologies. 2008, Vol 14, Num 9-11, pp 1709-1714, issn 0946-7076, 6 p.Conference Paper

X-ray phase-contrast tomography of porcine fat and rindJENSEN, Torben H; BOTTIGER, Arvid; OLSEN, Eli V et al.Meat science. 2011, Vol 88, Num 3, pp 379-383, issn 0309-1740, 5 p.Article

Characterization of the optical parameters of high aspect ratio polymer micro-optical componentsKRAJEWSKI, Rafal; VAN ERPS, Jurgen; WISSMANN, Markus et al.Proceedings of SPIE, the International Society for Optical Engineering. 2008, pp 69921B.1-69921B.11, issn 0277-786X, isbn 978-0-8194-7190-1Conference Paper

Single Mode Field Analysis and Adjustment on Polymer Waveguides Understanding the Reasons for Coupling LossesHOLLENBACH, Uwe; BOEHM, Hans-Jürgen; MOHR, Jürgen et al.Proceedings of SPIE, the International Society for Optical Engineering. 2008, pp 69920Y.1-69920Y.10, issn 0277-786X, isbn 978-0-8194-7190-1Conference Paper