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Micro-optics : fabrication, packaging, and integration (Strasbourg, 29-30 April 2004)Van Daele, Peter; Mohr, Jürgen.SPIE proceedings series. 2004, isbn 0-8194-5377-3, VII, 162 p, isbn 0-8194-5377-3Conference Proceedings

Assembly of electro-optical modules in a desk-top factoryMENSCHIG, A.SPIE proceedings series. 2004, pp 96-101, isbn 0-8194-5377-3, 6 p.Conference Paper

Micro-optical components and systems in polymers for optical networks and sensorsTEUBNER, U.SPIE proceedings series. 2004, pp 31-40, isbn 0-8194-5377-3, 10 p.Conference Paper

Sealing optical fibers without metallization: Design guidelinesDIETZ, Raymond L.SPIE proceedings series. 2004, pp 111-120, isbn 0-8194-5377-3, 10 p.Conference Paper

Submicron polymer structures with X-ray lithography and hot embossingMAPPES, Timo; WORGULL, Matthias; HECKELE, Mathias et al.Microsystem technologies. 2008, Vol 14, Num 9-11, pp 1721-1725, issn 0946-7076, 5 p.Conference Paper

Unglue bonding of glass-ceramic parts with ultra low coefficient of thermal expansionMASLOV, V. P; SIZOV, F. F.SPIE proceedings series. 2004, pp 155-161, isbn 0-8194-5377-3, 7 p.Conference Paper

PLATIMO: Versatile assembling facilities to bring concepts to prototypes and automated productionKOPP, Christophe; FULBERT, Laurent; GILBERT, Karen et al.SPIE proceedings series. 2004, pp 137-147, isbn 0-8194-5377-3, 11 p.Conference Paper

Basic aspects of Deep Lithography with particles for the fabrication of micro-optical and micro-mechanical structuresVOLCKAERTS, Bart; VYNCK, Pedro; THIENPONT, Hugo et al.SPIE proceedings series. 2004, pp 52-63, isbn 0-8194-5377-3, 12 p.Conference Paper

A cost effective packaging for the environmental hardening of passive optical devicesWATTE, J; LEEMAN, S; SWINNEN, L et al.SPIE proceedings series. 2004, pp 102-110, isbn 0-8194-5377-3, 9 p.Conference Paper

Low cost single mode waveguide fabrication allowing passive fiber coupling using LIGA and UV flood exposureHENZI, P; RABUS, D. G; BADE, K et al.SPIE proceedings series. 2004, pp 64-74, isbn 0-8194-5377-3, 11 p.Conference Paper

Integration of multimode waveguides and micromirror couplers in printed circuit boards using laser ablationVAN STEENBERGE, Geert; GEERINCK, Peter; VAN PUT, Steven et al.SPIE proceedings series. 2004, pp 75-84, isbn 0-8194-5377-3, 10 p.Conference Paper

Ellipsometric investigations of polished surface of glassceramic with ultra low coefficient of the temperature expansionMASLOV, V. P; SARSEMBAEVA, A. Z; SIZOV, F. F et al.SPIE proceedings series. 2004, pp 148-154, isbn 0-8194-5377-3, 7 p.Conference Paper

Large-area origination and replication of microstructures with optical functionsGOMBERT, Andreas; FORBERICH, Karen; BLÄSI, Benedikt et al.SPIE proceedings series. 2004, pp 129-136, isbn 0-8194-5377-3, 8 p.Conference Paper

Sol-gel replication of optical components suited for surface mount assemblySÖCHTIG, Jürgen; MAHMUD, Sanida; OBI, Samuel et al.SPIE proceedings series. 2004, pp 41-51, isbn 0-8194-5377-3, 11 p.Conference Paper

High precision surface mount assembly of micro-optical components per laser reflow soldering: positioning accuracy and thermal stabilitySTAUFFER, Laurent; WÄLTI, Felix; VOKINGER, Urs et al.SPIE proceedings series. 2004, pp 85-95, isbn 0-8194-5377-3, 11 p.Conference Paper

High-density hybrid interconnect technologiesJOHN, Joachim; ZIMMERMANN, Lars; DE MOOR, Piet et al.SPIE proceedings series. 2004, pp 1-8, isbn 0-8194-5377-3, 8 p.Conference Paper

Development of microlens arrays for high-speed optical communicationKO, Chih-Hsiang; LIN, Chun-Hsu; TSAI, Bor-Chen et al.SPIE proceedings series. 2004, pp 121-128, isbn 0-8194-5377-3, 8 p.Conference Paper

Flip-chip assembly for photonic circuitsWÖRHOFF, K; HEIDEMAN, R. G; GILDE, M. J et al.SPIE proceedings series. 2004, pp 9-20, isbn 0-8194-5377-3, 12 p.Conference Paper

Flip chip assembly and reliability using gold/tin solder bumpsOPPERMANN, Hermann; HUTTER, Matthias; KLEIN, Matthias et al.SPIE proceedings series. 2004, pp 21-30, isbn 0-8194-5377-3, 10 p.Conference Paper

Deep x-ray lithography processing for batch fabrication of thick polymer-based antenna structuresRASHIDIAN, Atabak; KTYMYSHYN, David M; BOERNER, Martin et al.Journal of micromechanics and microengineering (Print). 2010, Vol 20, Num 2, issn 0960-1317, 025026.1-025026.11Article

High Aspect-Ratio Coplanar Waveguide Wideband Bandpass Filter With Compact Unit CellsKLYMYSHYN, David M; JAYATILAKA, Himal C; BÖRNER, Martin et al.IEEE transactions on microwave theory and techniques. 2009, Vol 57, Num 11, pp 2753-2760, issn 0018-9480, 8 p.Article

Combdrive Configuration for an Electromagnetic Reluctance ActuatorSCHONHARDT, Stefan; KORVINK, Jan G; MOHR, Jürgen et al.Journal of microelectromechanical systems. 2008, Vol 17, Num 5, pp 1164-1171, issn 1057-7157, 8 p.Article

Submicron-scale surface acoustic wave resonators fabricated by high aspect ratio X-ray lithography and aluminum lift-offACHENBACH, Sven; KLYMYSHYN, David; MAPPES, Timo et al.Microsystem technologies. 2008, Vol 14, Num 9-11, pp 1715-1719, issn 0946-7076, 5 p.Conference Paper

Optoelectromechanical switch array with passively aligned free-space optical components : Optical MEMS and its future trendsRUZZU, Antonio C. M; HALLER, Dirk; MOHR, Jürgen A et al.Journal of lightwave technology. 2003, Vol 21, Num 3, pp 664-671, issn 0733-8724, 8 p.Article

VM-TEST: Mechanical property measurement using electrostatically actuated vertical MEMS test structures fabricated in thick metal layersHALUZAN, Darcy T; KLYMYSHYN, David M; ACHENBACH, Sven et al.Microsystem technologies. 2012, Vol 18, Num 4, pp 443-452, issn 0946-7076, 10 p.Article

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