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Results 1 to 25 of 1172

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Single flux quantum signal transmission techniques in building practical RSFQ circuitsKANG, J. H.Cryogenics (Guildford). 2003, Vol 43, Num 10-11, pp 543-547, issn 0011-2275, 5 p.Conference Paper

KGD, repair, and module testing influences on MCM yield and costCHARLES, H. K; BARNHART, W. E.SPIE proceedings series. 2000, pp 628-635, isbn 0-930815-62-9Conference Paper

MCM '97 SymposiumThe International journal of microcircuits and electronic packaging. 1997, Vol 20, Num 3, pp 239-402, issn 1063-1674Conference Proceedings

Low-cost, high throughput, large area meniscus coating for MCM-D and MCM-L substratesBHATTACHARYA, Swapan; BHATEVARA, Sachin; MORALES, Hector et al.SPIE proceedings series. 2000, pp 74-79, isbn 0-930815-62-9Conference Paper

Robust photopolymers for MCM, board, and backplane optical interconnectsELDADA, L; NAHATA, A; YARDLEY, J. T et al.SPIE proceedings series. 1998, pp 175-191, isbn 0-8194-2727-6Conference Paper

Polyimide optical waveguide with multi-fan-out for multichip module systemMATSUMOTO, T; KUWANA, Y; HIROSE, A et al.SPIE proceedings series. 1998, pp 133-144, isbn 0-8194-2727-6Conference Paper

A 160Gb/s interface design configuration for multichip LSIEZAKI, Takayuki; KONDO, Kazuhiro; OZAKI, Hiroshi et al.IEEE International Solid-State Circuits Conference. 2004, pp 140-141, isbn 0-7803-8267-6, 2Vol, 2 p.Conference Paper

Dual-block assembled microelectronics tactile sensorGANDELLI, A; LAZZARONI, M; OTTOBONI, R et al.SPIE proceedings series. 1997, pp 203-208, isbn 0-930815-50-5Conference Paper

Technology insertion and process improvements : A case studySPRECKELS, C; GREEN, T. J.SPIE proceedings series. 1997, pp 551-556, isbn 0-930815-50-5Conference Paper

Lithography on flexible substrates : A roll-to-roll, high-throughput, high-resolution system for low-cost production of microelectronicsJAIN, K; DUNN, T; FARMIGA, N et al.SPIE proceedings series. 1998, pp 207-213, isbn 0-8194-2776-4Conference Paper

Experimental demonstration of a multi-channel micro-optical bridge for multi-Gb/s, free-space intra-MCM interconnectsVERSCHAFFELT, G; BUCZYNSKI, R; GENOE, J et al.SPIE proceedings series. 1998, pp 44-47, isbn 0-8194-2949-XConference Paper

Guided-wave optoelectronic clock distribution networks on multichip modules using MEMS fabrication techniquesSEUNGUG KOH; SUH, S.-D; DANJIN WU et al.SPIE proceedings series. 1998, pp 79-84, isbn 0-8194-2727-6Conference Paper

Progress of single flux quantum packet switch technologyYOROZU, S; KAMEDA, Y; HASHIMOTO, Y et al.IEEE transactions on applied superconductivity. 2005, Vol 15, Num 2, pp 411-414, issn 1051-8223, 4 p., 1Conference Paper

Development of a Compact Broadband Folded Hybrid Coupler on Multilayer Organic SubstrateHAI HOANG TA; PHAM, Anh-Vu.IEEE microwave and wireless components letters. 2010, Vol 20, Num 2, pp 76-78, issn 1531-1309, 3 p.Article

Boundary-scan test system based on VXI busDU, Ying; ZHAO, Wenyan; XI, Quansheng et al.Proceedings of SPIE, the International Society for Optical Engineering. 2006, pp 63581P.1-63581P.6, issn 0277-786X, isbn 0-8194-6453-8, 2VolConference Paper

Laser-based electro-optic testing of multichip module structuresMECHTEL, D. M; CHARLES, H. K; FRANCOMACARO, A. S et al.Microelectronics and reliability. 1998, Vol 38, Num 12, pp 1847-1853, issn 0026-2714Article

Efficient waveguide couplers using tilted gratings for optoelectronic interconnectsJIANHUA GAN; BIHARI, B; LINGHUI WU et al.SPIE proceedings series. 1998, pp 122-132, isbn 0-8194-2727-6Conference Paper

A discussion of integrated circuit (IC), MultiChip Module (MCM), and MEMS applications fabricated through MOSISPELTIER, J; HANSFORD, W.SPIE proceedings series. 1997, pp 25-33, isbn 0-8194-2680-6Conference Paper

Implementing high performance graphics subsystems with complex IC technologyBEAT, S. W; AVERY, G; BROWN, S. K et al.SPIE proceedings series. 1997, pp 500-505, isbn 0-930815-50-5Conference Paper

A structured testability approach for multi-chip modules based on BIST and boundary-scan : Advancing MCM technologiesZORIAN, Y.IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging. 1994, Vol 17, Num 3, pp 283-290, issn 1070-9894Article

MCMs for space application: Up to 40 GHz inside the multilayer ceramicDREVON, Claude; SCHAFFAUSER, Chloe; CAZAUX, Jean-Louis et al.SPIE proceedings series. 2003, pp 616-620, isbn 0-8194-5189-4, 5 p.Conference Paper

Defect and fault tolerance in VLSI systemsFUJIWARA, E; HORIGUCHI, S; LO, J.-C et al.Journal of systems architecture. 2002, Vol 47, Num 10, issn 1383-7621, 97 p.Serial Issue

Bump & underfill free flip-chip technology for VLSI/MCM assembly, based on Universal Contact UnitTARAN, Alexander; KRIVOSHAPKC, Vladimir; REILLY, Patrick et al.SPIE proceedings series. 2000, pp 808-813, isbn 0-930815-62-9Conference Paper

Mask aligners in advanced packaging : European technologyTÖNNIES, D; TÖPPER, M; WOLF, J et al.Solid state technology. 1998, Vol 41, Num 3, pp S13-S18, issn 0038-111X, 4 p.Article

What is known-good die and how do you get there ?NOVELLINO, J.Electronic design. 1997, Vol 45, Num 17, pp 83-88, issn 0013-4872, 4 p.Article

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