au.\*:("Novak, R.E")
Results 1 to 25 of 56
Selection :
CUSS - an automated ultrasonic inspection system with interactive graphics displays = CUSS - Ein automatisiertes Ultraschall-Pruefsystem mit graphischer BildaufzeichnungWOLTERS, W.J; SEYDEL, J.A; NOVAK, R.E et al.Materials evaluation. 1982, Vol 40, Num 1, pp 109-114, issn 0025-5327Article
Making supercritical CO2 cleaning work: Proper selection of co-solvents and other issuesSEHGAL, Akshey.Proceedings - Electrochemical Society. 2003, pp 214-221, issn 0161-6374, isbn 1-56677-411-X, 8 p.Conference Paper
Cleaning technology in semiconductor device manufacturing VIII (Orlando FL, October 2003)Ruzyllo, J; Hattori, T; Opila, R.L et al.Proceedings - Electrochemical Society. 2003, issn 0161-6374, isbn 1-56677-411-X, XI, 436 p, isbn 1-56677-411-XConference Proceedings
Non-IPA wafer drying technology for single-spin wet cleaningMIYA, Katsuhiko; KISHIMOTO, Takuya; IZUMI, Akira et al.Proceedings - Electrochemical Society. 2003, pp 57-63, issn 0161-6374, isbn 1-56677-411-X, 7 p.Conference Paper
Atomic layer deposition of silicon nitride barrier layer for self-aligned gate stackFINSTAD, Casey C; MUSCAT, Anthony J.Proceedings - Electrochemical Society. 2003, pp 86-92, issn 0161-6374, isbn 1-56677-411-X, 7 p.Conference Paper
Experimental validation of a science-based undercut removal model for the cleaning of micron scale particles from surfacesKUMAR, G; BEAUDOIN, S.Proceedings - Electrochemical Society. 2003, pp 176-181, issn 0161-6374, isbn 1-56677-411-X, 6 p.Conference Paper
Copper low-K contamination and post etch residues removal using supercritical CO2-based processesMILLET, C; DAVIOT, J; DANEL, A et al.Proceedings - Electrochemical Society. 2003, pp 271-278, issn 0161-6374, isbn 1-56677-411-X, 8 p.Conference Paper
Effective post-etch residue removal on low-K films using single wafer processingKESTERS, E; GHEKIERE, J; VAN DOORNE, P et al.Proceedings - Electrochemical Society. 2003, pp 15-22, issn 0161-6374, isbn 1-56677-411-X, 8 p.Conference Paper
Post-etch cleaning of 300mm dual damascene low-K dielectric structures using supercritical CO2TURKOT, Robert B; RAMACHANDRARAO, Vijayakumar S; LYER, Subramanyam A et al.Proceedings - Electrochemical Society. 2003, pp 254-262, issn 0161-6374, isbn 1-56677-411-X, 9 p.Conference Paper
Photoresist stripping using supercritical CO2-based processesPERRUT, V; DANEL, A; MILLET, C et al.Proceedings - Electrochemical Society. 2003, pp 246-253, issn 0161-6374, isbn 1-56677-411-X, 8 p.Conference Paper
Predictive model-based control of critical oxide etches for sub-100nm processes in a single wafer wet processing systemLU, Y; YALAMANCHILI, M. R; ROSATO, J. J et al.Proceedings - Electrochemical Society. 2003, pp 49-56, issn 0161-6374, isbn 1-56677-411-X, 8 p.Conference Paper
Additive technologies for sub100nm device cleaningMORINAGA, Hitoshi; ITOU, Atsushi; MOCHIZUKI, Hideaki et al.Proceedings - Electrochemical Society. 2003, pp 371-378, issn 0161-6374, isbn 1-56677-411-X, 8 p.Conference Paper
Advanced front end of the line clean for post CMP processesKASHKOUSH, Ismall; NOLAN, Thomas; NEMETH, Dennis et al.Proceedings - Electrochemical Society. 2003, pp 299-304, issn 0161-6374, isbn 1-56677-411-X, 6 p.Conference Paper
Evaluation of megasonic cleaning processesHOLSTEYNS, F; RISKIN, A; VEREECKE, G et al.Proceedings - Electrochemical Society. 2003, pp 161-167, issn 0161-6374, isbn 1-56677-411-X, 7 p.Conference Paper
Reversing of silicon surface aging by lamp cleaningSHANMUGASUNDARAM, K; CHANG, K; SHALLENBERGER, J et al.Proceedings - Electrochemical Society. 2003, pp 348-355, issn 0161-6374, isbn 1-56677-411-X, 8 p.Conference Paper
Study of the cleaning control using a megahertz nozzle sound pressure monitor system for single-plate spin cleanersFUJITA, H; HAYAMIZU, N; GOSHOZONO, T et al.Proceedings - Electrochemical Society. 2003, pp 168-175, issn 0161-6374, isbn 1-56677-411-X, 8 p.Conference Paper
Minimizing oxide loss in immersion SC1 processBUTTERBAUGH, Jeffery W; LOPER, Steve; WAGENER, Tom et al.Proceedings - Electrochemical Society. 2003, pp 116-122, issn 0161-6374, isbn 1-56677-411-X, 7 p.Conference Paper
Evaluation of megasonic cleaning systems for particle removal efficiency and damagingVEREECKE, G; HOLSTEYNS, F; VELTENS, J et al.Proceedings - Electrochemical Society. 2003, pp 145-152, issn 0161-6374, isbn 1-56677-411-X, 8 p.Conference Paper
In-situ process for periodic cleaning of low temperature nitride furnacesFOSTER, Derrick; ELLENBERGER, Jim; HERRING, Robert B et al.Proceedings - Electrochemical Society. 2003, pp 205-213, issn 0161-6374, isbn 1-56677-411-X, 9 p.Conference Paper
Aqueous cryogenically enhanced post copper CMP cleaningBANERJEE, Souvik; VIA, Andrea; JOSHI, Sonit et al.Proceedings - Electrochemical Society. 2003, pp 329-336, issn 0161-6374, isbn 1-56677-411-X, 8 p.Conference Paper
Low carbon contamination and water mark free post-CMP cleaning of hydrophobic OSG dielectricsBARTOSH, Kyle; BROWN, Erik; NAGHSHINEH, Shahri et al.Proceedings - Electrochemical Society. 2003, pp 305-311, issn 0161-6374, isbn 1-56677-411-X, 7 p.Conference Paper
Substrate damage-free laser shock cleaning of particlesPARK, J. G; BUSNAINA, A. A; LEE, J. M et al.Proceedings - Electrochemical Society. 2003, pp 190-194, issn 0161-6374, isbn 1-56677-411-X, 5 p.Conference Paper
Surfactant enabled CO2 cleaning processes for beol applications: Post barrier breakthroughWAGNER, Mark; DEYOUNG, James; GROSS, Steve et al.Proceedings - Electrochemical Society. 2003, pp 232-239, issn 0161-6374, isbn 1-56677-411-X, 8 p.Conference Paper
The mechanism of poly-Si etching during poly/W gate cleaning by fluorine based cleaning solutionSANG YONG KIM; SANG JUN CHOI; CHANG KI HONG et al.Proceedings - Electrochemical Society. 2003, pp 129-133, issn 0161-6374, isbn 1-56677-411-X, 5 p.Conference Paper
Innovative surface preparation solutions for sub-90nm IC devicesBAIYA, Evanson G; ROSATO, John J; RAO YALAMANCHILI, M et al.Proceedings - Electrochemical Society. 2003, pp 42-48, issn 0161-6374, isbn 1-56677-411-X, 7 p.Conference Paper