CMP : chemical mechanical planarization VI (Orlando FL, 12-17 October 2003)Seal, S; Opila, R.L; Sundaram, K. B et al.Proceedings - Electrochemical Society. 2003, issn 0161-6374, isbn 1-56677-404-7, VII, 358 p, isbn 1-56677-404-7Conference Proceedings

Making supercritical CO₂ cleaning work: Proper selection of co-solvents and other issuesSEHGAL, Akshey.Proceedings - Electrochemical Society. 2003, pp 214-221, issn 0161-6374, isbn 1-56677-411-X, 8 p.Conference Paper

Cleaning technology in semiconductor device manufacturing VIII (Orlando FL, October 2003)Ruzyllo, J; Hattori, T; Opila, R.L et al.Proceedings - Electrochemical Society. 2003, issn 0161-6374, isbn 1-56677-411-X, XI, 436 p, isbn 1-56677-411-XConference Proceedings

Non-IPA wafer drying technology for single-spin wet cleaningMIYA, Katsuhiko; KISHIMOTO, Takuya; IZUMI, Akira et al.Proceedings - Electrochemical Society. 2003, pp 57-63, issn 0161-6374, isbn 1-56677-411-X, 7 p.Conference Paper

Atomic layer deposition of silicon nitride barrier layer for self-aligned gate stackFINSTAD, Casey C; MUSCAT, Anthony J.Proceedings - Electrochemical Society. 2003, pp 86-92, issn 0161-6374, isbn 1-56677-411-X, 7 p.Conference Paper

Experimental validation of a science-based undercut removal model for the cleaning of micron scale particles from surfacesKUMAR, G; BEAUDOIN, S.Proceedings - Electrochemical Society. 2003, pp 176-181, issn 0161-6374, isbn 1-56677-411-X, 6 p.Conference Paper

Predictive model-based control of critical oxide etches for sub-100nm processes in a single wafer wet processing systemLU, Y; YALAMANCHILI, M. R; ROSATO, J. J et al.Proceedings - Electrochemical Society. 2003, pp 49-56, issn 0161-6374, isbn 1-56677-411-X, 8 p.Conference Paper

Additive technologies for sub100nm device cleaningMORINAGA, Hitoshi; ITOU, Atsushi; MOCHIZUKI, Hideaki et al.Proceedings - Electrochemical Society. 2003, pp 371-378, issn 0161-6374, isbn 1-56677-411-X, 8 p.Conference Paper

Advanced front end of the line clean for post CMP processesKASHKOUSH, Ismall; NOLAN, Thomas; NEMETH, Dennis et al.Proceedings - Electrochemical Society. 2003, pp 299-304, issn 0161-6374, isbn 1-56677-411-X, 6 p.Conference Paper

Study of the cleaning control using a megahertz nozzle sound pressure monitor system for single-plate spin cleanersFUJITA, H; HAYAMIZU, N; GOSHOZONO, T et al.Proceedings - Electrochemical Society. 2003, pp 168-175, issn 0161-6374, isbn 1-56677-411-X, 8 p.Conference Paper

Adhesion and removal of silica and alumina slurry particles during Cu CMP processPARK, Jin-Goo; BUSNAINA, Ahmed A.Proceedings - Electrochemical Society. 2003, pp 312-320, issn 0161-6374, isbn 1-56677-411-X, 9 p.Conference Paper

Behavior of aluminum in ozonated water, optical and electrochemical studyRITALA, Heini; PEHKONEN, Antero; SOLEHMAINEN, Kimmo et al.Proceedings - Electrochemical Society. 2003, pp 406-413, issn 0161-6374, isbn 1-56677-411-X, 8 p.Conference Paper

Open circuit and galvanostatic behavior of copper oxidized and reduced in various solutionsHUGHES, Mike; NAGHSHINEH, Shahri; PETERS, Darryl et al.Proceedings - Electrochemical Society. 2003, pp 421-426, issn 0161-6374, isbn 1-56677-411-X, 6 p.Conference Paper

Aqueous single pass single wafer Al/via cleaningVERHAVERBEKE, Steven; BEAUDRY, Chris; BOELEN, Pieter et al.Proceedings - Electrochemical Society. 2003, pp 23-26, issn 0161-6374, isbn 1-56677-411-X, 4 p.Conference Paper

The science and technology of the functional waterTODA, Masayuki; URYUU, Seijin.Proceedings - Electrochemical Society. 2003, pp 1-12, issn 0161-6374, isbn 1-56677-411-X, 12 p.Conference Paper

Impact of phase behavior on photoresist removal using CO₂based mixturesLEVITIN, Galit; MYNENI, Satyanarayana; HESS, Dennis W et al.Proceedings - Electrochemical Society. 2003, pp 263-270, issn 0161-6374, isbn 1-56677-411-X, 8 p.Conference Paper

Characterizing etch residue removal from low-K ILD structures using aqueous and non-aqueous chemistriesMOORE, John; MEUCHEL, Craig.Proceedings - Electrochemical Society. 2003, pp 340-347, issn 0161-6374, isbn 1-56677-411-X, 8 p.Conference Paper

Cleaning chemistry with complexing agents (CAS): CA degradation monitoring by UV/VIS-spectroscopyDOLL, Oliver; KOLBESEN, Bernd O.Proceedings - Electrochemical Society. 2003, pp 362-370, issn 0161-6374, isbn 1-56677-411-X, 9 p.Conference Paper

Cleaning chemistry with complexing agents (CAs): Decomposition of CAs in hydrogen peroxide and APM studied with HPLCMETZGER, S; KOLBESEN, B. O.Proceedings - Electrochemical Society. 2003, pp 386-392, issn 0161-6374, isbn 1-56677-411-X, 7 p.Conference Paper

Resonance damage of semiconductors by acoustic excitationCHRISTENSON, Kurt K.Proceedings - Electrochemical Society. 2003, pp 182-189, issn 0161-6374, isbn 1-56677-411-X, 8 p.Conference Paper

Evaluation of megasonic cleaning processesHOLSTEYNS, F; RISKIN, A; VEREECKE, G et al.Proceedings - Electrochemical Society. 2003, pp 161-167, issn 0161-6374, isbn 1-56677-411-X, 7 p.Conference Paper

Reversing of silicon surface aging by lamp cleaningSHANMUGASUNDARAM, K; CHANG, K; SHALLENBERGER, J et al.Proceedings - Electrochemical Society. 2003, pp 348-355, issn 0161-6374, isbn 1-56677-411-X, 8 p.Conference Paper

Copper low-K contamination and post etch residues removal using supercritical CO₂-based processesMILLET, C; DAVIOT, J; DANEL, A et al.Proceedings - Electrochemical Society. 2003, pp 271-278, issn 0161-6374, isbn 1-56677-411-X, 8 p.Conference Paper

Effective post-etch residue removal on low-K films using single wafer processingKESTERS, E; GHEKIERE, J; VAN DOORNE, P et al.Proceedings - Electrochemical Society. 2003, pp 15-22, issn 0161-6374, isbn 1-56677-411-X, 8 p.Conference Paper

Post-etch cleaning of 300mm dual damascene low-K dielectric structures using supercritical CO₂TURKOT, Robert B; RAMACHANDRARAO, Vijayakumar S; LYER, Subramanyam A et al.Proceedings - Electrochemical Society. 2003, pp 254-262, issn 0161-6374, isbn 1-56677-411-X, 9 p.Conference Paper