kw.\*:("PACKAGE")
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METALLURGICAL CONSIDERATIONS FOR BEAM TAPE ASSEMBLY.ROSE AS; SCHELINE FE; SIKINA TV et al.1978; SOLID STATE TECHNOL.; U.S.A.; DA. 1978; VOL. 21; NO 3; PP. 49-68 (5P.); BIBL. 8 REF.Article
USING CHIP CARRIERS FOR HIGH DENSITY PACKAGING.BAUER JA.1977; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1977; VOL. 17; NO 10; PP. 85-91 (4P.)Article
IMPROVING THE QUALITY OF GLASS-SEALED CERAMIC DIPS.LAMSON MA; RAMSEY TH JR.1978; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1978; VOL. 18; NO 1; PP. 84-96 (7P.); BIBL. 8 REF.Article
BEAM TAPE CARRIERS - A DESIGN GUIDE.CAIN RL.1978; SOLID STATE TECHNOL.; U.S.A.; DA. 1978; VOL. 21; NO 3; PP. 53-58; BIBL. 1 P. 1/2Article
P-KANAL-MOS-DOPPELTRANSISTOR SMY 60.HESSLER U.1976; RADIO FERNSEHEN ELEKTRON.; DTSCH.; DA. 1976; VOL. 25; NO 15; PP. 494Article
DEVELOPMENT OF A 68-PIN MULTIPLE IN-LINE PACKAGEBRODSKY WL; PARKER FD; SCHOENTHALER D et al.1980; I.E.E.E. TRANS. COMPON. HYBR. MANUFG TECHNOL.; USA; DA. 1980; VOL. 3; NO 4; PP. 594-601; BIBL. 6 REF.Article
PRELIMINARY EVALUATION OF DIP/SOCKET CONNECTION RELIABILITYMILLS GW.1979; I.E.E.E. TRANS. COMPON. HYBR. MANUFG TECHNOL.; USA; DA. 1979; VOL. 2; NO 4; PP. 476-487; BIBL. 8 REF.Article
CHIP CARRIER PACKAGING APPLICATIONSBAUER JA.1980; I.E.E.E. TRANS. COMPON. HYBR. MANUFG TECHNOL.; USA; DA. 1980; VOL. 3; NO 1; PP. 120-125; BIBL. 5 REF.Article
EXPERIMENTAL INVESTIGATION OF MOUNTING THERMAL RESISTANCE OF FLATPACKS ON CIRCUIT BOARDSMOVIUS TF; JONES IR; KALLIS JM et al.1979; I.E.E.E. TRANS. COMPON. HYBR. MANUFG TECHNOL.; USA; DA. 1979; VOL. 2; NO 4; PP. 512-517Article
THERMAL STUDIES OF A PLASTIC DUAL-IN-LINE PACKAGEMITCHELL C; BERG HM.1979; I.E.E.E. TRANS. COMPON. HYBR. MANUFG TECHNOL.; USA; DA. 1979; VOL. 2; NO 4; PP. 500-511; BIBL. 12 REF.Article
On a Proposal for a Generic Package Development ProcessBRAMKLEV, C.Packaging technology & science. 2009, Vol 22, Num 3, pp 171-186, issn 0894-3214, 16 p.Article
TRANVERSE MOMENTUM BEHAVIOUR OF MUONS E+E-->E+E-MU +MU -COURAU A.1982; ; FRA; DA. 1982; LAL/82-19; 7 P.-4 PL.; 30 CM; BIBL. 10 REF.Report
A COMPUTER PACKAGE FOR THE EVALUATION OF NEURON MODELS INVOLVING LARGE UNIFORM NETWORKSLEE MH; MARUDARAJAN AR.1982; INTERNATIONAL JOURNAL OF MAN-MACHINE STUDIES; ISSN 0020-7373; GBR; DA. 1982; VOL. 17; NO 2; PP. 189-210; BIBL. 24 REF.Article
A COMPUTER-BASED INTERACTIVE MODEL FOR INDUSTRIAL LAND USE FORECASTINGGOICOECHEA A; KROUSE MR.1983; COMPUTERS & INDUSTRIAL ENGINEERING; ISSN 0360-8352; USA; DA. 1983; VOL. 7; NO 1; PP. 49-67; BIBL. 38 REF.Article
PP ANNIHILATION AT REST IN THE ONE MESON EXCHANGE MODEL: APPLICATION TO THE ASTERIX EXPERIMENTDELCOURT B; LAYSSAC J; PELAQUIER E et al.1982; ; FRA; DA. 1982; LAL/82-17; 18 P.; 30 CM; BIBL. 9 REF.Report
PRELIMINARY RESULTS ON INCLUSIVE PI 0, GAMMA PHOTOPRODUCTION AT HIGH PT NA14 COLLABORATIONPETROFF P.1982; ; FRA; DA. 1982; LAL/82-14; 5 P.-10 PL.; 30 CMReport
UNE NOUVELLE GENERATION DE RESONATEURS A QUARTZBESSON R.1979; C.R. ACAD. SCI., B; FRA; DA. 1979; VOL. 288; NO 16; PP. 245-248; ABS. ENG; BIBL. 10 REF.Article
BREVET BOITIER DE CAPTEUR D'ENERGIE SOLAIRE.1978; ; FRA; DA. 1978-10-27; FR/A1/2.381.982; DEP.7805594/1978-02-27; PR. US/772.971/1977-02-28Patent
THE ADVANTAGES OF SOLDERING FLAT PACKS AND LEAD FRAMES WITH INFRARED EQUIPMENT.SLEPPIN M.1977; INSULAT. CIRCUITS; U.S.A.; DA. 1977; VOL. 23; NO 8; PP. 35-36Article
SCALAR LEPTON SEARCH WITH THE CELLO DETECTOR AT PETRA1982; ; FRA; DA. 1982; LAL/82-09; 9 P.-4 PL.; 30 CM; BIBL. 11 REF.Report
A DATABASE SUBSYSTEM FOR BCPLBROOKER RA.1982; COMPUTER JOURNAL; ISSN 0010-4620; GBR; DA. 1982; VOL. 25; NO 4; PP. 448-464; BIBL. 4 REF.Article
A TOPOLOGY RECONFIGURATION MECHANISM FOR DISTRIBUTED COMPUTER SYSTEMSBOZYIGIT M; PAKER Y.1982; COMPUTER JOURNAL; ISSN 0010-4620; GBR; DA. 1982; VOL. 25; NO 1; PP. 87-92; BIBL. 9 REF.Article
HUMIDITY TEST OF PREMOLDED CHIP CARRIERSMARTIN JH; HANLEY LD.1981; IEEE TRANS. COMPON. HYBRIDS MANUF. TECHNOL.; ISSN 0148-6411; USA; DA. 1981; VOL. 4; NO 2; PP. 210-213Article
PACKAGING PHOTODETECTOR COMPONENTSMURRAY LA.1980; ELECTRON. PACKAG. PRODUCT.; USA; DA. 1980; VOL. 20; NO 6; PP. 177-192; 9 P.Article
STITCH-BOND PARALLEL-GAP WELDING FOR INTEGRATED CIRCUITSCHVOSTAL P; TUTTLE J; VANDERPOOL R et al.1980; INSUL., CIRCUITS; ISSN 0020-4544; USA; DA. 1980; VOL. 26; NO 10; PP. 63Article